公开(公告)号：US20240363477A1

公开(公告)日：2024-10-31

申请号：US18028850

申请日：2022-08-26

申请人： Honor Device Co., Ltd.

发明人： Erliang Li ,  Hanghang Dong ,  Junjie Yang

IPC分类号： H01L23/373 ,  G06F1/16 ,  H01L23/367 ,  H05K7/20

CPC分类号： H01L23/3735 ,  H01L23/3675 ,  H01L23/3736 ,  H05K7/20409 ,  G06F1/1613

摘要： This application discloses a thermal pad, a heat dissipation module, and an electronic device, and relates to the field of thermal pad technologies. The thermal pad includes a pad body. The pad body is provided with a hollowed-out part, and the hollowed-out part is filled with a liquid metal material layer. This application may be applied to electronic devices such as notebook computers.

公开(公告)号：US20240363471A1

公开(公告)日：2024-10-31

申请号：US18755366

申请日：2024-06-26

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Maria Cristina ESTACIO ,  Elsie Agdon CABAHUG ,  Romel N. MANATAD

IPC分类号： H01L23/367 ,  H01L23/29 ,  H01L23/495

CPC分类号： H01L23/367 ,  H01L23/29 ,  H01L23/49517 ,  H01L23/49562 ,  H01L23/49575

摘要： In a general aspect, a packaged semiconductor device apparatus a conductive paddle, a semiconductor die coupled with the conductive paddle and a conductive clip having a first portion with a first thickness and a second portion with a second thickness. The first thickness can be greater than the second thickness. The first portion can be coupled with the semiconductor die. The device can also include a molding compound encapsulating the semiconductor die and at least partially encapsulating the conductive paddle and the conductive clip. The device can further include a signal lead that is at least partially encapsulated in the molding compound, the second portion of the conductive clip being coupled with the signal lead.

公开(公告)号：US12131972B2

公开(公告)日：2024-10-29

申请号：US17681695

申请日：2022-02-25

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Po-Chih Pan ,  Hung-Chun Kuo

IPC分类号： H01L23/367 ,  H01L23/495 ,  H01L23/538 ,  H01L25/065 ,  H01L25/18

CPC分类号： H01L23/367 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/5384 ,  H01L25/0657 ,  H01L25/18

摘要： An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.

公开(公告)号：US20240355699A1

公开(公告)日：2024-10-24

申请号：US18137187

申请日：2023-04-20

申请人： CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION

发明人： Hyoung Soon LEE ,  Dae Young KONG

IPC分类号： H01L23/367 ,  H01L21/48

CPC分类号： H01L23/367 ,  H01L21/4882

摘要： A semiconductor device thermal management module includes a thermal diffusion plate stacked on a semiconductor device for thermal diffusion of the semiconductor device and a heat spreader provided on the thermal diffusion plate, molded by a three-dimensional (3D) printing method, and having a channel through which a cooling fluid flows.

公开(公告)号：US12127382B2

公开(公告)日：2024-10-22

申请号：US17679867

申请日：2022-02-24

申请人： FUJI ELECTRIC CO., LTD.

发明人： Yoshihiro Tateishi ,  Tatsuhiko Asai ,  Takahiro Koyama ,  Hiromichi Gohara

IPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18

CPC分类号： H05K7/20927 ,  H01L23/3677 ,  H01L23/473 ,  H05K7/20254 ,  H01L25/072 ,  H01L25/18

摘要： A semiconductor module includes a cooling device that includes: a ceiling plate; a side wall; a bottom plate; a plurality of pin fins having a polygonal shape and arranged in a matrix form in which one end of the respective pin fins is connected to a fin region having a rectangular shape; an inlet for a coolant at a first position adjacent to a part of one of long sides of the fin region, and an outlet for the coolant at a second position adjacent to a part of the other long side of the fin region. The matrix directions of the respective pin fins make an angle with a straight line connecting the first position and the second position, and a length of a segment of the straight line passing across the fin region is longer than a length of short sides of the fin region.

公开(公告)号：US12125807B2

公开(公告)日：2024-10-22

申请号：US18377193

申请日：2023-10-05

申请人： James Curtis

发明人： James Curtis

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L23/367 ,  H01L23/538 ,  H01L23/552

CPC分类号： H01L23/564 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552

摘要： A gift card system and method for purchasing both physical and digital gift cards at a kiosk, both physical and virtual, is disclosed. The system/method includes a gift card distribution kiosk located at a retail establishment or online that provides a user with access to a multitude of different forms of gift cards that may be purchased and printed onto a customizable card with a personalized message. The kiosk includes a kiosk processor interface, a gift card dispenser, a card reader and gift card management server connected to a network. The gift card management server, through the kiosk processor interface, provides vendor options to users to select and pay via the card reader. The kiosk may be used to redeem unused user gift cards for a reduced value user selected gift card, reduced cash value, full value store card, rewards points, bank debit, and/or electronic code user towards online purchases.

公开(公告)号：US12125768B2

公开(公告)日：2024-10-22

申请号：US17461459

申请日：2021-08-30

申请人： Altera Corporation

发明人： Loke Yip Foo ,  Choong Kooi Chee

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L25/18

CPC分类号： H01L23/481 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3672 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/09 ,  H01L24/17 ,  H01L24/33 ,  H01L24/73 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/0231 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/73204 ,  H01L2924/15311

摘要： Reduced-profile semiconductor device apparatus are achieved by thinning a semiconductive device substrate at a backside surface to expose a through-silicon via pillar, forming a recess to further expose the through-silicon via pillar, and by seating an electrical bump in the recess to contact both the through-silicon via pillar and the recess. In an embodiment, the electrical bump contacts a semiconductor package substrate to form a low-profile semiconductor device apparatus. In an embodiment, the electrical bump contacts a subsequent die to form a low-profile semiconductor device apparatus.

公开(公告)号：US20240339374A1

公开(公告)日：2024-10-10

申请号：US18745743

申请日：2024-06-17

申请人： AMERICAN AXLE & MANUFACTURING, INC.

发明人： Jeffrey J. RONNING

IPC分类号： H01L23/367 ,  H01L23/36 ,  H01L25/065

CPC分类号： H01L23/3672 ,  H01L23/36 ,  H01L25/0652 ,  H01L2225/06562 ,  H01L2225/06568

摘要： An array of heat-sinked power semiconductors that includes a power semiconductor and a heat sink. The power semiconductor has a power semiconductor die, a plurality of first terminals and a second terminal. The power semiconductor die has a plurality of semiconductor terminals. Each of the first terminals is electrically coupled to an associated one of the semiconductor terminals. The second terminal is a surface mount terminal and is electrically coupled to one of the first terminals. The heat sink has a heat sink body and a plurality of fins. The heat sink body has a base and an exterior surface. The base is fixedly coupled directly to the surface mount terminal. The exterior surface has a fin mount portion to which the fins extend. At least a portion of the fin-mount portion is oriented non-parallel to base.

公开(公告)号：US12114467B2

公开(公告)日：2024-10-08

申请号：US17871660

申请日：2022-07-22

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Magnus Kallmark ,  Fredrik Ohlsson ,  Vadim Tsoi ,  Reine Granstrom

IPC分类号： H05K7/20 ,  H01L23/367 ,  H01L23/467

CPC分类号： H05K7/20409 ,  H01L23/3672 ,  H01L23/467 ,  F28F2215/04 ,  H05K7/20127 ,  H05K7/20509

摘要： The invention relates to a heatsink for transferring heat from one or more electrical devices to a heat transfer medium. The heatsink includes a plurality of fins arranged on a frontside of the heatsink. The plurality of fins includes a first group of fins extending in a first planar direction and a second group of fins extending in a second planar direction angled in relation to the first planar direction. For example, the first group of fins may extend from the bottom to the top of the heatsink, while the second group of fins may extend from the first group of fins to the sides of the heatsink. In this way, the sides of the heatsink can be used as air outlets and the airflow through the heatsink can be increased.

公开(公告)号：US20240332271A1

公开(公告)日：2024-10-03

申请号：US18742606

申请日：2024-06-13

申请人： ROHM CO., LTD.

发明人： Hiroto SAKAI ,  Yuta OKAWAUCHI ,  Tetsuo TATEISHI

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L23/049 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L25/07

CPC分类号： H01L25/16 ,  H01L23/049 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3735 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48225 ,  H01L2924/10272 ,  H01L2924/1207 ,  H01L2924/13091 ,  H01L2924/30101 ,  H01L2924/30107

摘要： A semiconductor device includes two semiconductor elements with a respective switching operation being controlled depending on a first driving signal input to a third electrode. A first conductor and a second conductor are electrically interposed between the third electrodes of the two semiconductor elements. The first conductor is electrically connected to a signal terminal. The electrical connection between the third electrodes of the two semiconductor elements includes a first conduction path through the first conductor and a second conduction path through the second conductor. An inductance value of the second conduction path is smaller than an inductance value of the first conduction path. A resistance value of the second conduction path is larger than a resistance value of the first conduction path.