PROCEDURE FOR DETERMINING REAL MOLDING FRONTS AND ALIGNING SIMULATIONS

    公开(公告)号:US20240359381A1

    公开(公告)日:2024-10-31

    申请号:US18765787

    申请日:2024-07-08

    摘要: A method for determining positions of a real moulding material front during a process to be carried out with a moulding machine, wherein



    a simulation progression (SV) of a variable characteristic of the processa is calculated,
    positions of a simulated moulding material front are determined from the simulation,
    the real process is carried out, and at least one measurement progression (MV) of the at least one characteristic variable is measured directly or indirectly,
    a transformation is chosen, which has at least one parameter (ΔV, kp, Vunknown),
    the transformation is applied to the at least one simulation progression (SV), with the result that a transformed simulation progression (tSV) is formed, and
    a parameter value is determined for the parameter (ΔV, kp, Vunknown) such that a deviation between the measurement progression (MV) and the transformed simulation progression (tSV) is minimized according to a predetermined error measure or according to an operator input.

    Method and device for processing wafer detection tasks, system, and storage medium

    公开(公告)号:US12085916B2

    公开(公告)日:2024-09-10

    申请号:US17400431

    申请日:2021-08-12

    发明人: Deqing Qu

    IPC分类号: G05B19/4093 G05B19/406

    摘要: A method and device for processing wafer detection tasks, a system, and a storage medium. The method includes that: the resource manager node receives the wafer detection task from the storage server, selects the target work node from the plurality of work nodes according to weight values of the work nodes connected to the resource manager node, and allocates the wafer detection task to the target work node. The target work node selects the idle GPU from the resource pool and allocates the wafer detection task to the idle GPU for execution. The GPU preprocesses the wafer map in the wafer detection task and inputs the processed wafer map into the wafer detection model to obtain the detection result.

    SYSTEMS AND METHODS FOR SAFETY-ENABLED CONTROL

    公开(公告)号:US20240280960A1

    公开(公告)日:2024-08-22

    申请号:US18588957

    申请日:2024-02-27

    发明人: Nathan Bivans

    IPC分类号: G05B19/406

    CPC分类号: G05B19/406 G05B2219/50193

    摘要: Systems and methods for safety-enabled control. Input values provided to a control system can be validated. Command gating can be performed for control values provided by the control system. Validation of input values and command gating for control values can be performed in accordance with respective validation windows. Validation windows can be dynamically adjusted based on data received via a sensor or interface.

    Optoelectronic safety sensor and method for safeguarding a machine

    公开(公告)号:US12061457B2

    公开(公告)日:2024-08-13

    申请号:US17333872

    申请日:2021-05-28

    申请人: SICK AG

    发明人: Markus Hammes

    IPC分类号: G05B19/406 F16P3/14

    CPC分类号: G05B19/406 F16P3/142

    摘要: An optoelectronic safety sensor (10) for safeguarding a machine (34), the sensor (10) comprising a light receiver (24) for optical detection of object data and a control and evaluation unit (26) configured to use the object data to decide whether a safety-critical object (36) is detected in a vicinity of the machine (34) and in this case to trigger a safety-related reaction, and wherein the control and evaluation unit (26) is further configured to adapt the sensitivity of a criterion for deciding whether a safety-critical object (36) is detected as a function of at least one of previously detected objects and simultaneously detected objects.

    MOLD STATE MONITORING SYSTEM AND METHOD THEREOF

    公开(公告)号:US20240210911A1

    公开(公告)日:2024-06-27

    申请号:US18069952

    申请日:2022-12-21

    IPC分类号: G05B19/406

    CPC分类号: G05B19/406 G05B2219/45244

    摘要: A mold state monitoring system is provided, and the monitoring method thereof is: dividing multiple processing signals of a mold into initial state information and wear state information, so as to obtain a target model and a wear threshold based on the initial state information, and input the wear state information into the target model to obtain a wear index of the mold; inputting the latest multiple processing signals and corresponding wear indices thereof into a time series prediction model for training to obtain wear prediction values of hypothetical times, and then performing a predicting operation based on the wear prediction value, so that when the wear prediction value is greater than the wear threshold, it can be estimated as a damage time point of the mold. Therefore, via the design of the time series prediction model, the target information can be changed at any time on the production line, and the state of the mold can be monitored online in real time.

    DEVICE FOR MONITORING THE POSITION AND/OR ATTITUDE AND/OR MOVEMENT OF A TOOL

    公开(公告)号:US20240201649A1

    公开(公告)日:2024-06-20

    申请号:US18589615

    申请日:2024-02-28

    申请人: SARISSA GMBH

    发明人: Volker JAUCH

    IPC分类号: G05B19/406

    CPC分类号: G05B19/406

    摘要: The invention relates to a device for monitoring the position and/or location and/or movement of a tool to which an inertial sensor, such as a gyroscope sensor and/or an inertial sensor, is attached. A monitoring unit is provided in order to determine the position and/or location and/or movement of the tool on the basis of a specified starting situation using the detected sensor data. The device is characterized in that in order to calibrate the sensor (s), at least one image capturing unit is provided which is designed to capture one or more images of the tool at least at specified points in time or in intervals; an image analysis unit is provided for determining the position and/or location and/or movement of the tool; and the monitoring unit is designed to calibrate the sensor data in order to process the data.