公开(公告)号：US12130454B2

公开(公告)日：2024-10-29

申请号：US17318345

申请日：2021-05-12

申请人： ams Sensors Singapore Pte. Ltd.

发明人： Nicola Spring ,  Hartmut Rudmann ,  Markus Rossi

IPC分类号： B29D11/00 ,  F21V7/00 ,  G02B3/00 ,  G02B5/04 ,  G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/34 ,  G02B13/00 ,  G02B17/08 ,  G02B6/43

CPC分类号： G02B5/045 ,  B29D11/00692 ,  B29D11/00721 ,  F21V7/0091 ,  G02B3/0062 ,  G02B5/04 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/13 ,  G02B6/34 ,  G02B13/0065 ,  G02B17/0856 ,  G02B2006/12114 ,  G02B2006/12166 ,  G02B6/43

摘要： The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.

公开(公告)号：US12099236B2

公开(公告)日：2024-09-24

申请号：US17892726

申请日：2022-08-22

申请人： POET Technologies, Inc.

发明人： Suresh Venkatesan ,  Yee Loy Lam

IPC分类号： G02B6/13 ,  G02B6/12 ,  G02B6/42 ,  G02B6/43 ,  G02B6/122

CPC分类号： G02B6/13 ,  G02B6/12019 ,  G02B6/12028 ,  G02B6/4272 ,  G02B6/43 ,  G02B6/12016 ,  G02B2006/12061 ,  G02B6/1223 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4224 ,  G02B6/423 ,  G02B6/4251 ,  G02B6/4274

摘要： An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

公开(公告)号：US12078674B2

公开(公告)日：2024-09-03

申请号：US17903542

申请日：2022-09-06

申请人： Ciena Corporation

发明人： Jérôme Leclerc-Perron ,  Marie-Josee Picard ,  Raphael Beaupré-Laflamme

IPC分类号： G01R31/28 ,  G01R31/26 ,  G02B6/12 ,  G02B6/124 ,  G02B6/13

CPC分类号： G01R31/2886 ,  G01R31/2635 ,  G02B6/124 ,  G02B6/13 ,  G02B2006/12107

摘要： An apparatus for testing a wafer or chip comprising a photonic integrated circuit comprises: an electrical signal interface module comprising an array of movable conducting structures; a photonic signal interface module attached to the electrical signal interface module, the photonic signal interface module comprising one or more optical fiber interfaces, and a first set of grating couplers arranged over at least a first plane of the photonic signal interface module; and one or more electrical signal connections between the electrical signal interface module and the photonic signal interface module.

公开(公告)号：US12066658B2

公开(公告)日：2024-08-20

申请号：US17725558

申请日：2022-04-21

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Feng-Wei Kuo ,  Wen-Shiang Liao

IPC分类号： G02B6/12 ,  G02B6/124 ,  G02B6/13

CPC分类号： G02B6/124 ,  G02B6/13 ,  G02B2006/12107

摘要： An integrated optical device includes a substrate, a waveguide structure and a grating structure. The substrate has a waveguide region and a grating region adjacent to each other. The waveguide structure is disposed on the substrate in the waveguide region. The grating structure is disposed on the substrate in the grating region. In some embodiments, the grating structure includes grating bars and grating intervals arranged alternately, and widths of the grating bars of the grating structure are varied.

公开(公告)号：US20240266801A1

公开(公告)日：2024-08-08

申请号：US18567471

申请日：2022-06-08

申请人： IHP GmbH-Innovations for High Performance Microelectronics/Leibniz-Instit.für innovative

发明人： Karsten VOIGT ,  Lars ZIMMERMANN ,  Christian MAI ,  Jochen KREISSL

IPC分类号： H01S5/10 ,  G02B6/13 ,  G02B6/28 ,  H01S5/02 ,  H01S5/125 ,  H01S5/30

CPC分类号： H01S5/1028 ,  G02B6/13 ,  G02B6/2821 ,  H01S5/021 ,  H01S5/1014 ,  H01S5/125 ,  H01S5/3013

摘要： An integrated optoelectronic device comprises a substrate with a silicon layer comprising one or more electronic components. An interconnect stack comprising a plurality of metal levels is arranged on the substrate. A front-end-of-line (FEOL) optical waveguide on the substrate has an optical FEOL coupling section. A photonic component is arranged in the interconnect stack at a distance from the substrate. A back-end-of-line (BEOL) optical waveguide in the interconnect stack is optically coupled to the photonic component and has an optical BEOL coupling section. An optical interconnect structure is arranged and configured for optically coupling radiation from the BEOL coupling section into the FEOL coupling section and vice versa. The optical interconnect structure comprises a stack of wave-guide elements made of a first dielectric material, which each are embedded in a second dielectric material and which in a desired wavelength range have an index of refraction higher than the second dielectric material.

公开(公告)号：US20240266338A1

公开(公告)日：2024-08-08

申请号：US18618055

申请日：2024-03-27

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  Hsing-Kuo Hsia

IPC分类号： H01L25/16 ,  G02B6/122 ,  G02B6/13 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/18

CPC分类号： H01L25/167 ,  G02B6/122 ,  G02B6/13 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/18

摘要： A package includes an interposer structure including a first via; a first interconnect device including conductive routing and which is free of active devices; an encapsulant surrounding the first via and the first interconnect device; and a first interconnect structure over the encapsulant and connected to the first via and the first interconnect device; a first semiconductor die bonded to the first interconnect structure and electrically connected to the first interconnect device; and a first photonic package bonded to the first interconnect structure and electrically connected to the first semiconductor die through the first interconnect device, wherein the first photonic package includes a photonic routing structure including a waveguide on a substrate; a second interconnect structure over the photonic routing structure, the second interconnect structure including conductive features and dielectric layers; and an electronic die bonded to and electrically connected to the second interconnect structure.

公开(公告)号：US20240264371A1

公开(公告)日：2024-08-08

申请号：US18625342

申请日：2024-04-03

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chih-Tsung Shih ,  Hau-Yan Lu ,  Wei-Kang Liu ,  Yingkit Felix Tsui

IPC分类号： G02B6/12 ,  G02B6/13

CPC分类号： G02B6/12004 ,  G02B6/13 ,  G02B2006/12104 ,  G02B2006/12121 ,  G02B2006/12142

摘要： Various embodiments of the present disclosure are directed towards a semiconductor package comprising optically coupled integrated circuit (IC) chips. A first IC chip and a second IC chip overlie a substrate at a center of the substrate. A photonic chip overlies the first and second IC chips and is electrically coupled to the second IC chip. A laser device chip overlies the substrate, adjacent to the photonic chip and the second IC chip, at a periphery of the substrate. The photonic chip is configured to modulate a laser beam from the laser device chip in accordance with an electrical signal from the second IC chip and to provide the modulated laser beam to the first IC chip. This facilitates optical communication between the first IC chip to the second IC chip. Various embodiments of the present disclosure are further directed towards simultaneously aligning and bonding constituents of the semiconductor package.

公开(公告)号：US20240264370A1

公开(公告)日：2024-08-08

申请号：US18165844

申请日：2023-02-07

申请人： Cisco Technology, Inc.

发明人： Aparna R. PRASAD ,  Norbert SCHLEPPLE ,  Vipulkumar K. PATEL ,  Arturo PACHON MUNOZ

IPC分类号： G02B6/12 ,  G02B6/13

CPC分类号： G02B6/12004 ,  G02B6/13 ,  G02B2006/12061

摘要： An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.

公开(公告)号：US12050347B2

公开(公告)日：2024-07-30

申请号：US17751777

申请日：2022-05-24

申请人： Taiwan Semiconductor Manufacturing Company

发明人： Tai-Chun Huang ,  Stefan Rusu

IPC分类号： G02B6/27 ,  G02B6/12 ,  G02B6/122 ,  G02B6/124 ,  G02B6/126 ,  G02B6/13 ,  G02B27/28

CPC分类号： G02B6/2773 ,  G02B6/1228 ,  G02B6/124 ,  G02B6/126 ,  G02B6/13 ,  G02B27/285 ,  G02B2006/1215

摘要： A photonic polarizing beamsplitter is disclosed. The beamsplitter comprises a first waveguide, a second waveguide located above the first waveguide, and a birefringent coupler between the first waveguide and the second waveguide. The birefringent coupler has an effective refractive index for a TM mode which is greater than a refractive index of the first waveguide, and an effective refractive index for a TE mode which is less than the refractive index of the first waveguide. The second waveguide comprises a plurality of outwardly tapering legs with a gap between adjacent legs that are connected downstream to a body. The vertical beamsplitter uses less surface area.

公开(公告)号：US12044851B2

公开(公告)日：2024-07-23

申请号：US17416248

申请日：2019-12-20

申请人： Magic Leap, Inc.

发明人： Xiaopei Deng ,  Vikramjit Singh ,  Shuqiang Yang ,  Kang Luo ,  Nai-Wen Pi ,  Frank Y. Xu

IPC分类号： G02B27/01 ,  F21V8/00 ,  G02B6/10 ,  G02B6/122 ,  G02B6/13 ,  G02B27/00

CPC分类号： G02B27/0172 ,  G02B6/0011 ,  G02B6/1223 ,  G02B6/13 ,  G02B27/0081 ,  G02B6/10 ,  G02B2027/0174

摘要： Recesses are formed on a front side and a rear side of a waveguide. A solid porogen material is spun onto the front side and the rear side and fills the recesses. First front and rear cap layers are then formed on raised formations of the waveguide and on the solid porogen material. The entire structure is then heated and the solid porogen material decomposes to a porogen gas. The first front and rear cap layers are porous to allow the porogen gas to escape and air to enter into the recesses. The air maximizes a difference in refractive indices between the high-index transparent material of the waveguide and the air to promote reflection in the waveguide from interfaces between the waveguide and the air.