公开(公告)号：US20240304512A1

公开(公告)日：2024-09-12

申请号：US18182072

申请日：2023-03-10

申请人： Cisco Technology, Inc.

发明人： Norbert SCHLEPPLE ,  Vipulkumar K. PATEL ,  Aparna R. PRASAD ,  Paul TON

IPC分类号： H01L23/367 ,  G02B6/38 ,  H01L23/50

CPC分类号： H01L23/367 ,  G02B6/3897 ,  H01L23/50

摘要： An apparatus includes a substrate, an integrated circuit positioned on the substrate, and a load plate positioned on the integrated circuit such that the load plate is arranged to absorb heat from the integrated circuit. The load plate includes a body and an extender. The body includes an upper surface and a bottom surface. The bottom surface contacts the integrated circuit such that the bottom surface is between the integrated circuit and the upper surface. A portion of the body extends beyond the integrated circuit. The extender is coupled to the portion of the body such that the extender extends from the bottom surface to define a cavity between the extender and the integrated circuit. The extender defines an aperture aligned with the integrated circuit.

公开(公告)号：US20240184066A1

公开(公告)日：2024-06-06

申请号：US18061881

申请日：2022-12-05

申请人： Cisco Technology, Inc.

发明人： Norbert SCHLEPPLE ,  Aparna R. PRASAD ,  Vipulkumar K. PATEL

IPC分类号： G02B6/42 ,  H04B10/40

CPC分类号： G02B6/4239 ,  G02B6/4238 ,  G02B6/4245 ,  G02B6/4255 ,  G02B6/4257 ,  G02B6/426 ,  G02B6/428 ,  H04B10/40

摘要： In a first embodiment aspect presented in this disclosure, an optical wafer-level (OWL) package includes a frontside electrical redistribution layer (RDL) and a molding compound layer, the OWL package further including at least one of (1) an optical transmitter at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical transmitter arranged for providing an optically modulated output data signal; or (2) an optical receiver at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical receiver arranged for receiving an optically modulated input data signal.

公开(公告)号：US20220113480A1

公开(公告)日：2022-04-14

申请号：US17070763

申请日：2020-10-14

申请人： Cisco Technology, Inc.

发明人： Ashley J.M. ERICKSON ,  Vipulkumar K. PATEL ,  Aparna R. PRASAD

IPC分类号： G02B6/42 ,  G02B6/13 ,  G02B6/12

摘要： An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.

公开(公告)号：US20220278022A1

公开(公告)日：2022-09-01

申请号：US17663072

申请日：2022-05-12

申请人： Cisco Technology, Inc.

发明人： Ashley J.M. ERICKSON ,  Matthew J. TRAVERSO ,  Sandeep RAZDAN ,  Joyce J. M. PETERNEL ,  Aparna R. PRASAD

IPC分类号： H01L23/473 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544

摘要： An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

公开(公告)号：US20210305128A1

公开(公告)日：2021-09-30

申请号：US16836825

申请日：2020-03-31

申请人： Cisco Technology, Inc.

发明人： Ashley J.M. ERICKSON ,  Matthew J. TRAVERSO ,  Sandeep RAZDAN ,  Joyce J.M. PETERNEL ,  Aparna R. PRASAD

IPC分类号： H01L23/473 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544

摘要： An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

公开(公告)号：US20240272385A1

公开(公告)日：2024-08-15

申请号：US18167003

申请日：2023-02-09

申请人： Cisco Technology, Inc.

发明人： Li CHEN ,  Long CHEN ,  Norbert SCHLEPPLE ,  Aparna R. PRASAD ,  Vipulkumar K. PATEL

IPC分类号： G02B6/42

CPC分类号： G02B6/4251 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4238

摘要： Photonic packages with underfill dam structures are described. The underfill dam structures address various underfill material location issues by controlling where an underfill material flows and which areas of the photonic package underfill material is excluded from entering.

公开(公告)号：US20220196933A1

公开(公告)日：2022-06-23

申请号：US17133407

申请日：2020-12-23

申请人： Cisco Technology, Inc.

发明人： Vipulkumar K. PATEL ,  Paul TON ,  Aparna R. PRASAD ,  Norbert SCHLEPPLE

IPC分类号： G02B6/42

摘要： Aspects described herein include an apparatus comprising a substrate, an electronic integrated circuit (IC) disposed on the substrate, one or more optical ICs disposed on the substrate and communicatively coupled with the electronic IC, and a stiffener device attached to the substrate. The stiffener device comprises a stiffener ring that substantially circumscribes the one or more optical ICs. The stiffener device defines one or more features configured to receive a plurality of light-carrying media that optically couple with the one or more optical ICs and that extend to one or more lateral edges of the stiffener device.

公开(公告)号：US20200319416A1

公开(公告)日：2020-10-08

申请号：US16522531

申请日：2019-07-25

申请人： Cisco Technology, Inc.

发明人： Vipulkumar K. PATEL ,  Aparna R. PRASAD ,  Sandeep RAZDAN

IPC分类号： G02B6/42

摘要： The present disclosure provides a frame lid assembly, which may be used in assembling an optical platform to provide isolated thermal conduction paths for various elements thereof. The frame lid assembly includes a first frame lid, including: a foot, disposed in a first plane; a roof, disposed in a second plane parallel to the first plane, the roof defining a port as a first through-hole that is perpendicular to the second plane; a wall, disposed obliquely to the first plane, separating the roof from the foot, the wall defining a slot as a second through-hole that is parallel to the first plane; a second frame lid connected to the first frame lid and thermally isolated from the first frame lid, the second frame lid including: a cap, connected to the roof via a thermal insulator; and a plug, extending perpendicularly from the cap through the port.

公开(公告)号：US20240264370A1

公开(公告)日：2024-08-08

申请号：US18165844

申请日：2023-02-07

申请人： Cisco Technology, Inc.

发明人： Aparna R. PRASAD ,  Norbert SCHLEPPLE ,  Vipulkumar K. PATEL ,  Arturo PACHON MUNOZ

IPC分类号： G02B6/12 ,  G02B6/13

CPC分类号： G02B6/12004 ,  G02B6/13 ,  G02B2006/12061

摘要： An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.

公开(公告)号：US20230060862A1

公开(公告)日：2023-03-02

申请号：US17445914

申请日：2021-08-25

申请人： Cisco Technology, Inc.

发明人： Vipulkumar K. PATEL ,  Matthew J. TRAVERSO ,  Sandeep RAZDAN ,  Aparna R. PRASAD

IPC分类号： G02B6/42

摘要： Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.