-
公开(公告)号:US20220196933A1
公开(公告)日:2022-06-23
申请号:US17133407
申请日:2020-12-23
IPC分类号: G02B6/42
摘要: Aspects described herein include an apparatus comprising a substrate, an electronic integrated circuit (IC) disposed on the substrate, one or more optical ICs disposed on the substrate and communicatively coupled with the electronic IC, and a stiffener device attached to the substrate. The stiffener device comprises a stiffener ring that substantially circumscribes the one or more optical ICs. The stiffener device defines one or more features configured to receive a plurality of light-carrying media that optically couple with the one or more optical ICs and that extend to one or more lateral edges of the stiffener device.
-
公开(公告)号:US20240304512A1
公开(公告)日:2024-09-12
申请号:US18182072
申请日:2023-03-10
IPC分类号: H01L23/367 , G02B6/38 , H01L23/50
CPC分类号: H01L23/367 , G02B6/3897 , H01L23/50
摘要: An apparatus includes a substrate, an integrated circuit positioned on the substrate, and a load plate positioned on the integrated circuit such that the load plate is arranged to absorb heat from the integrated circuit. The load plate includes a body and an extender. The body includes an upper surface and a bottom surface. The bottom surface contacts the integrated circuit such that the bottom surface is between the integrated circuit and the upper surface. A portion of the body extends beyond the integrated circuit. The extender is coupled to the portion of the body such that the extender extends from the bottom surface to define a cavity between the extender and the integrated circuit. The extender defines an aperture aligned with the integrated circuit.
-
公开(公告)号:US20240105549A1
公开(公告)日:2024-03-28
申请号:US18169609
申请日:2023-02-15
发明人: Yongguo CHEN , Kai CAO , Hua YANG , Vic Hong CHIA , Paul TON
IPC分类号: H01L23/427 , H01L23/00
CPC分类号: H01L23/4275 , H01L24/08 , H01L24/32 , H01L2224/08111 , H01L2224/32257 , H01L2224/32501 , H01L2924/1433
摘要: The systems and cold plate pedestal and assembly described decrease mechanical stresses in integrated circuits, while also providing efficient thermal coupling between heat producing components and a cold plate. A cold plate assembly includes a cold plate with a pedestal portion a groove formed in a surface of the pedestal portion. The cold plate assembly also includes a thermal pad layer formed in the groove and a phase change material (PCM) layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.
-
-