公开(公告)号：US12078674B2

公开(公告)日：2024-09-03

申请号：US17903542

申请日：2022-09-06

申请人： Ciena Corporation

发明人： Jérôme Leclerc-Perron ,  Marie-Josee Picard ,  Raphael Beaupré-Laflamme

IPC分类号： G01R31/28 ,  G01R31/26 ,  G02B6/12 ,  G02B6/124 ,  G02B6/13

CPC分类号： G01R31/2886 ,  G01R31/2635 ,  G02B6/124 ,  G02B6/13 ,  G02B2006/12107

摘要： An apparatus for testing a wafer or chip comprising a photonic integrated circuit comprises: an electrical signal interface module comprising an array of movable conducting structures; a photonic signal interface module attached to the electrical signal interface module, the photonic signal interface module comprising one or more optical fiber interfaces, and a first set of grating couplers arranged over at least a first plane of the photonic signal interface module; and one or more electrical signal connections between the electrical signal interface module and the photonic signal interface module.

公开(公告)号：US20240077532A1

公开(公告)日：2024-03-07

申请号：US17903542

申请日：2022-09-06

申请人： Ciena Corporation

发明人： Jérôme Leclerc-Perron ,  Marie-Josee Picard ,  Raphael Beaupré-Laflamme

IPC分类号： G01R31/28 ,  G01R31/26 ,  G02B6/124 ,  G02B6/13

CPC分类号： G01R31/2886 ,  G01R31/2635 ,  G02B6/124 ,  G02B6/13 ,  G02B2006/12107

摘要： An apparatus for testing a wafer or chip comprising a photonic integrated circuit comprises: an electrical signal interface module comprising an array of movable conducting structures; a photonic signal interface module attached to the electrical signal interface module, the photonic signal interface module comprising one or more optical fiber interfaces, and a first set of grating couplers arranged over at least a first plane of the photonic signal interface module; and one or more electrical signal connections between the electrical signal interface module and the photonic signal interface module.