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公开(公告)号：US20240349729A1
公开(公告)日：2024-10-24
申请号：US18683457
申请日：2022-04-12
发明人： Xiaofa LIN , Xiaoshan LIN , Xiaolong LIU , Xiaowei LIN , Dongliang PENG , Yining ZHANG
IPC分类号： A01N59/16 , A01N25/34 , A01N33/12 , A01P1/00 , C25D3/08 , C25D3/12 , C25D5/00 , C25D5/14 , C25D5/34 , C25D5/56
CPC分类号： A01N59/16 , A01N25/34 , A01N33/12 , A01P1/00 , C25D3/08 , C25D3/12 , C25D5/14 , C25D5/34 , C25D5/56 , C25D5/605 , C25D5/623
摘要： An antiviral environment-friendly composite plating layer, a preparation method therefor, and an antiviral environment-friendly product. The antiviral environment-friendly composite plating layer includes: a semi-bright nickel layer, a microporous nickel layer and an environment-friendly black chromium composite antiviral layer; the semi-bright nickel layer is provided on a base material having antiviral requirements; the microporous nickel layer is provided on the surface of the side of the semi-bright nickel layer away from the base material; the environment-friendly black chromium composite antiviral layer is provided on the surface of the side of the microporous nickel layer away from the base material; the environment-friendly black chromium composite antiviral layer has a nanoneedle structure and is formed by a composite raw material containing an antiviral ammonium salt, and the concentration of the antiviral ammonium salt in the composite raw material is 50-100 g/L.
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公开(公告)号：US20240347774A1
公开(公告)日：2024-10-17
申请号：US18594433
申请日：2024-03-04
发明人： Cyrus Rustomji , Sungho Jin , Taekyoung Kim , Jungmin You , Joseph Wang , Duyoung Choi
IPC分类号： H01M10/0569 , C25D3/42 , C25D3/44 , C25D3/50 , C25D3/54 , C25D5/00 , C25D9/08 , C25D17/02 , H01G11/22 , H01G11/46 , H01G11/60 , H01G11/78 , H01G11/86 , H01M10/052 , H01M10/0525 , H01M10/0564 , C25D21/00 , H01G11/62 , H01M4/38
CPC分类号： H01M10/0569 , C25D3/42 , C25D3/44 , C25D3/50 , C25D3/54 , C25D5/003 , C25D9/08 , C25D17/02 , H01G11/22 , H01G11/46 , H01G11/60 , H01G11/78 , H01G11/86 , H01M10/052 , H01M10/0525 , H01M10/0564 , C25D21/00 , H01G11/62 , H01M4/382 , H01M2300/0028 , H01M2300/0031 , H01M2300/0034 , Y02E60/13
摘要： Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on “compressed gas solvents” mixed with various salts, referred to as “compressed gas electrolytes.” Various embodiments of a compressed gas solvent includes a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at a room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, pentafluoroethane. Also disclosed are battery and supercapacitor structures that use compressed gas solvent-based electrolytes, techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed gas electrolytes as an electroplating bath are also disclosed.
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公开(公告)号：US20240328024A1
公开(公告)日：2024-10-03
申请号：US18193711
申请日：2023-03-31
申请人： Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the University of Illinois
发明人： Sujan Dewanjee , Gaurav Singhal , Nenad Milijkovic , Paul Braun , Danny Lohan , Shailesh Joshi
摘要： In one embodiment, a method of fabricating a porous structure includes applying a first electroplating current at first current density for a first period of time, wherein the first electroplating current is a constant current, and applying a second electroplating current at a second current density for a second period of time following the first period of time, wherein the second electroplating current is a pulsed current and the first electroplating current and the second electroplating current grows the porous structure on a surface of the substrate.
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公开(公告)号：US12071700B2
公开(公告)日：2024-08-27
申请号：US17909030
申请日：2021-03-03
申请人： BASF SE
发明人： Tobias Urban , Paul Klingelhoefer , Sophie Maitro-Vogel , Yvonne Schriefers , Frank Richter , Manfred Bichler
摘要： The present invention relates to a process for depositing a metal layer on a substrate by contacting the substrate with a metal plating bath comprising a metal ion source and a suppressor, and applying a current density to the substrate, where the suppressor is a polycarboxylate ether as described below. The invention further relates to a metal plating bath comprising a metal ion source and the suppressor which is a polycarboxylate ether; and to a use of the polycarboxylate ether in a metal plating bath for depositing a metal layer on a substrate.
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5.发明公开公开(公告)号：US20240271305A1
公开(公告)日：2024-08-15
申请号：US18568352
申请日：2022-06-08
摘要： The present invention relates to a method for electrodepositing a dark chromium layer on a substrate, a respective electroplating bath for depositing such a dark chromium layer, and a respective substrate comprising said dark chromium layer. The electroplating bath comprises colloidal particles containing the chemical element aluminum. The substrate comprising said dark chromium layer is primarily suited for decorative purposes.
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6.发明授权公开(公告)号：US12060648B2
公开(公告)日：2024-08-13
申请号：US17704042
申请日：2022-03-25
发明人： Jian Lu , Yang Yang Li , Binbin Zhou , Junda Shen
IPC分类号： C25F3/14 , B23H3/00 , B23H3/08 , B23H9/00 , C23F1/02 , C23F4/00 , C25D5/00 , C25D5/18 , G01N21/65
CPC分类号： C25F3/14 , B23H3/00 , B23H3/08 , B23H9/008 , C23F1/02 , C23F4/00 , C25D5/18 , C25D5/605 , G01N21/658
摘要： A method for microengineering a gradient structure on a metal surface. A metal surface including at least first, second, and third metal surface regions is exposed to a metal-removing agent. A portion of surface metal atoms is removed by the metal-removing agent in each of the first, second, and third metal surface regions. Sequential metal removal processes expose only the second and third regions to the metal-removing agent, followed by exposing only the third region to the metal-removing agent. A gradient metal surface is formed having different properties in each of the first, second, and third metal surface regions. In a further aspect, quantitative surface-enhanced Raman spectroscopy may be performed using the treated metal surface. An amount of an analyte is determined based on its position in one of the first, second, or third metal surface regions.
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公开(公告)号：US12054843B2
公开(公告)日：2024-08-06
申请号：US17920509
申请日：2021-04-22
发明人： Ralf Schmidt , Josef Gaida , Willi Rohland , Jens Palm , Himendra Jha
IPC分类号： C25D5/16 , C07D233/60 , C07D249/04 , C07D251/54 , C25D3/38 , C25D5/00 , C25D5/12 , C25D5/50
CPC分类号： C25D3/38 , C07D233/60 , C07D249/04 , C07D251/54
摘要： The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising
(i) copper (II) ions,
(ii) one or more than one suppressor consisting of or comprising
one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms and more than one substituent covalently connected to one of said ring nitrogen atoms and/or a ring carbon atom, wherein said substituent independently is or comprises
one or more than one linear or branched polyalkylene glycol moiety, and/or
one or more than one linear or branched polyalkylene glycol block polyalkylene glycol, or random polyalkylene glycol moiety,
with the proviso that
if said suppressor comprises a OH group, then it is a terminal OH group of said polyalkylene glycol moiety, polyalkylene glycol block polyalkylene glycol, and random polyalkylene glycol moiety, respectively, and
said suppressor does not comprise NH2 groups, halogen atoms, and sulfur atoms;
a method of electrolytic copper plating using the acidic aqueous composition; and specific suppressors as defined above.-
公开(公告)号：US12000057B2
公开(公告)日：2024-06-04
申请号：US17044617
申请日：2018-09-20
发明人： Lei Lu , Zhao Cheng , Shuai Jin
摘要： A method for improving mechanical properties by changing a gradient nanotwinned structure of metallic materials is the technical field of nanostructured metallic materials. The method uses the inherent principles of microstructure and mechanical properties of metallic materials to improve materials mechanical properties. The metallic materials has a gradient nanotwinned structure. The principles of microstructure and mechanical properties of the metallic materials mean that the mechanical properties of the metallic materials are adjusted by changing the structural gradient scale of the nanotwinned structure. The method combines two strengthening methods of nanotwins and gradient structure, and can obviously improve the mechanical properties of the metallic materials. For pure copper materials of the gradient nanotwinned structure prepared by an electrodeposition technology: the yield strength is 481±15 MPa, the tensile strength is 520±12 MPa, the uniform elongation can be 7±0.5%, and the elongation to failure can be 11.7±1.3%.
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公开(公告)号：US20240175162A1
公开(公告)日：2024-05-30
申请号：US18284630
申请日：2022-03-17
发明人： Ayumu TATEOKA , Tsubasa KATO , Shota KAWAGUCHI , Po Chun YANG
摘要： Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and suppression of powdering. This roughened copper foil includes a roughened surface on at least one side. The roughened surface has a roughness slope tan θ of 0.58 or less as calculated based on a mean height Rc (μm) and a mean width RSm (μm) of profile elements by formula Rc/(0.5×RSm), and a sharpness index Rc×Sku of 2.35 or less that is a product of the mean height Rc (μm) and a kurtosis Sku. Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value λs and a cutoff value λc, and Sku is a value measured in accordance with ISO 25178 under a condition of not performing a cutoff using an S filter and an L filter.
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公开(公告)号：US11959187B2
公开(公告)日：2024-04-16
申请号：US17145749
申请日：2021-01-11
发明人： Tak-Sing Wong , Shikuan Yang , Nan Sun , Birgitt Boschitsch
IPC分类号： G02B1/11 , B22F1/18 , B22F9/24 , C22C5/02 , C22C5/06 , C25D1/00 , C25D5/00 , C25D5/02 , C25D7/00 , C25D9/06 , C25D13/06 , C25D13/12 , G02B1/116 , G02B1/118 , B22F1/05 , B22F7/04 , C22C1/04 , C22C5/00 , C25D3/12 , C25D3/46 , C25D3/48
CPC分类号： C25D7/00 , B22F1/18 , B22F9/24 , C22C5/02 , C22C5/06 , C25D1/003 , C25D1/006 , C25D5/02 , C25D5/605 , C25D7/006 , C25D9/06 , C25D13/06 , C25D13/12 , G02B1/116 , G02B1/118 , B22F1/05 , B22F2007/045 , C22C1/0466 , C22C5/00 , C25D3/12 , C25D3/46 , C25D3/48
摘要： Synthetic brochosomes can be prepared by disposing a monolayer of first polymer microspheres on a substrate and forming a layer of metal on the monolayer of the first polymer microspheres. A monolayer of second polymer microspheres is then disposed on the layer of metal to form a template. The second polymer microspheres are smaller than the first polymer microspheres. A brochosome material is then electrodeposited on the template. The brochosome material is selected from the group consisting of a metal, a metal oxide, a polymer or a hybrid thereof. The first polymer microspheres and the second polymer microspheres are then removed to form a coating of synthetic brochosomes of the brochosome material on the substrate.
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