公开(公告)号：US10731267B2

公开(公告)日：2020-08-04

申请号：US15322861

申请日：2015-07-01

申请人： BASF SE

发明人： Frederic Bauer ,  Tobias Urban ,  Rainer Eskuchen ,  Lukas Maksym ,  Yvonne Schriefers

IPC分类号： C25D3/56 ,  C25D3/22 ,  C25D3/24

摘要： The present invention refers to a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate, a zinc coated metallic substrate having a specific gloss as well as an aqueous alkaline plating bath for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and the use of a zinc plating bath additive in a process for the electrolytic deposition of a zinc or zinc alloy coating on a metallic substrate and for improving the optical appearance and/or the adhesion of a zinc or zinc alloy coating on a metallic substrate.

公开(公告)号：US12071700B2

公开(公告)日：2024-08-27

申请号：US17909030

申请日：2021-03-03

申请人： BASF SE

发明人： Tobias Urban ,  Paul Klingelhoefer ,  Sophie Maitro-Vogel ,  Yvonne Schriefers ,  Frank Richter ,  Manfred Bichler

IPC分类号： C25D3/02 ,  C25D3/38 ,  C25D5/00 ,  C25D21/12

CPC分类号： C25D21/12 ,  C25D3/38

摘要： The present invention relates to a process for depositing a metal layer on a substrate by contacting the substrate with a metal plating bath comprising a metal ion source and a suppressor, and applying a current density to the substrate, where the suppressor is a polycarboxylate ether as described below. The invention further relates to a metal plating bath comprising a metal ion source and the suppressor which is a polycarboxylate ether; and to a use of the polycarboxylate ether in a metal plating bath for depositing a metal layer on a substrate.