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公开(公告)号：US11623291B2
公开(公告)日：2023-04-11
申请号：US17474762
申请日：2021-09-14
申请人： ERSA GmbH
发明人： Sven Proppert , Theresa Christ
摘要： Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.
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公开(公告)号：US20220355423A1
公开(公告)日：2022-11-10
申请号：US17735704
申请日：2022-05-03
申请人： ERSA GmbH
发明人： Markus Sendelbach
摘要： Moving unit for moving two soldering assemblies connected by means of a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.
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公开(公告)号：US11458558B2
公开(公告)日：2022-10-04
申请号：US16977240
申请日：2019-03-01
申请人： ERSA GmbH
发明人： Alexander Leisering
摘要： The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and with a wave portion which forms the solder wave during operation and which has a peripheral wall having a free upper side, and with at least one separating strip which can be inserted into the wave portion and which can be wetted with solder, wherein the at least one separating strip is formed as a frameless separating strip. The invention also relates to a soldering installation having a nozzle plate and having at least one soldering nozzle.
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公开(公告)号：US20220226618A1
公开(公告)日：2022-07-21
申请号：US17685767
申请日：2022-03-03
发明人： Robert C. Hayzelden
摘要： A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.
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公开(公告)号：US11298769B2
公开(公告)日：2022-04-12
申请号：US16410651
申请日：2019-05-13
发明人： Toyohiro Aoki , Eiji Nakamura , Takashi Hisada
摘要： An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.
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公开(公告)号：US11141807B2
公开(公告)日：2021-10-12
申请号：US16685462
申请日：2019-11-15
申请人： Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Services GmbH , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co., Ltd.
发明人： Fengchun Xie , Dandan Zhang , Roberto-Francisco Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
IPC分类号： B23K1/00 , B23K3/00 , B23K3/06 , B23K1/08 , B23K101/38
摘要： A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
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公开(公告)号：US10894294B2
公开(公告)日：2021-01-19
申请号：US16767873
申请日：2018-11-27
摘要： Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.
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公开(公告)号：US20200290143A1
公开(公告)日：2020-09-17
申请号：US16767873
申请日：2018-11-27
摘要： Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.
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公开(公告)号：US20200254549A1
公开(公告)日：2020-08-13
申请号：US16696907
申请日：2019-11-26
发明人： Noboru HASHIMOTO , Takahiro KASAMA
IPC分类号： B23K1/08
摘要： To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput.Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.
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公开(公告)号：US10737344B2
公开(公告)日：2020-08-11
申请号：US15807125
申请日：2017-11-08
申请人： Flex Ltd.
发明人： Zohair Mehkri , Anwar Mohammed , Jesus Tan , David Geiger , Murad Kurwa
IPC分类号： B23K1/08 , B33Y50/00 , G06F30/20 , G06F30/28 , B23K3/08 , B33Y50/02 , B33Y80/00 , B29C64/393 , H05K3/34 , B29C64/106 , B29C64/112 , B23K3/06 , B33Y10/00 , B29L31/34 , B29L31/00
摘要： A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.
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