公开(公告)号：US12089335B2

公开(公告)日：2024-09-10

申请号：US17522374

申请日：2021-11-09

申请人： Flex Ltd.

发明人： Curtis V. Bradford ,  Alfredo Garcia

IPC分类号： G06F3/044 ,  H05K1/18

CPC分类号： H05K1/181 ,  G06F3/044 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10151

摘要： Embodiments of the present disclosure are directed to a detailed lit indicator and touch detection in the same location through a metal surface. When the light behind the metal is turned off there will be no visible appearance of an indicator. When touched the metal will have no perceptible movement and never experience any deformation or evidence of usage over the life of the product.

公开(公告)号：US20240040703A1

公开(公告)日：2024-02-01

申请号：US18231043

申请日：2023-08-07

申请人： FLEX LTD

发明人： Dongkai Shangguan ,  David Geiger ,  Venkat Iyer ,  Cheng Yang

IPC分类号： H05K3/00 ,  H05K3/28

CPC分类号： H05K3/0044 ,  H05K3/0026 ,  H05K3/284 ,  H05K2203/025

摘要： Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

公开(公告)号：US11855358B2

公开(公告)日：2023-12-26

申请号：US17824346

申请日：2022-05-25

申请人： Flex Ltd.

发明人： Minghui Dai ,  Jiangsong Zhang ,  Xiao Sun

IPC分类号： H01Q21/24 ,  H01Q9/04 ,  H01Q7/00 ,  H01Q1/38 ,  H04B5/00 ,  H01F27/36

CPC分类号： H01Q21/24 ,  H01F27/366 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/0407 ,  H04B5/0081

摘要： A planar antenna can include one or more high permeability objects that are added near the planar coil's tips. Further, the planar antenna includes a coil having two or more layers, with each layer having two or more turns. The planar antenna also has a restricted conductor arrangement, where there are a maximum number of turns arranged in any horizontal layer. A turn's conductor could be a single conductor or could be two (2) or more conductors arranged in parallel.

公开(公告)号：US11850684B2

公开(公告)日：2023-12-26

申请号：US16787177

申请日：2020-02-11

申请人： FLEX LTD

发明人： Zohair Mehkri ,  Anwar Mohammed ,  Jesus Tan ,  David Geiger ,  Murad Kurwa

IPC分类号： B23K3/08 ,  H05K3/34 ,  B33Y50/02 ,  B33Y80/00 ,  B29C64/393 ,  B23K1/08 ,  B29C64/106 ,  B29C64/112 ,  B23K3/06 ,  H05K13/04 ,  B33Y10/00 ,  B29L31/34 ,  B29L31/00

CPC分类号： B23K3/08 ,  B23K1/085 ,  B23K3/0653 ,  B23K3/087 ,  B29C64/106 ,  B29C64/112 ,  B29C64/393 ,  B33Y50/02 ,  B33Y80/00 ,  H05K3/3447 ,  H05K3/3468 ,  H05K13/0465 ,  B29L2031/3425 ,  B29L2031/7178 ,  B33Y10/00 ,  H05K2203/0165 ,  H05K2203/0173 ,  H05K2203/044

摘要： A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

公开(公告)号：US11766218B2

公开(公告)日：2023-09-26

申请号：US16427713

申请日：2019-05-31

申请人： Flex Ltd.

发明人： Mudhafar Hassan-Ali ,  Connor Meehan ,  Phuocan N. Nguyen ,  Anthony Joseph Piazza ,  Yolita C. Nugent ,  Adam M. Whiton ,  Jeffrey B. Cross ,  Biren Salunke ,  Syed Muhammad Abdullah ,  Allison E. Bowles ,  Dennis T. Nguyen ,  Mark A. Bergman

IPC分类号： A61B5/00 ,  G16H50/30 ,  A41D13/12 ,  A61B5/08 ,  A61B5/01 ,  A41D1/00 ,  A41D13/02 ,  A61B5/25 ,  A61B5/282 ,  A61B5/296

CPC分类号： A61B5/6804 ,  A41D1/002 ,  A41D13/02 ,  A41D13/1281 ,  A61B5/0059 ,  A61B5/01 ,  A61B5/0809 ,  A61B5/0816 ,  A61B5/25 ,  A61B5/282 ,  A61B5/296 ,  A61B5/6843 ,  G16H50/30 ,  A61B2562/0209

摘要： Embodiments of the disclosure provide systems and methods for a garment comprising a fabric layer, a plurality of biometric sensors integrated into the fabric layer, and a connectivity layer integrated into the fabric layer. The connectivity layer can comprise signal conductors and power conductors coupled with each of the plurality of biometric sensors. The garment can further comprise a power source coupled with each of the power conductors and providing, via the power conductors of the connectivity layer, electrical power to each of the plurality of biometric sensors, a signal monitor coupled with the connectivity layer and receiving, via the signal conductors of the connectivity layer, a signal comprising biometric information from each of the plurality of biometric sensors, and a gateway coupled with the signal monitor, the gateway receiving the biometric information from the signal monitor and providing the biometric information to an external computer system.

公开(公告)号：US11723151B2

公开(公告)日：2023-08-08

申请号：US17719348

申请日：2022-04-12

申请人： FLEX LTD

发明人： Dongkai Shangguan ,  David Geiger ,  Venkat Iyer ,  Cheng Yang

IPC分类号： H05K3/00 ,  H05K3/28

CPC分类号： H05K3/0044 ,  H05K3/0026 ,  H05K3/284 ,  H05K2203/025

摘要： Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

公开(公告)号：US20230241825A1

公开(公告)日：2023-08-03

申请号：US18011049

申请日：2021-06-15

申请人： FLEX LTD

发明人： Javier Antoñana ,  Javier Berro ,  Felix Galé ,  Luis Larumbe ,  Yann Le Bronnec ,  Francisco Javier Pérez Gil

IPC分类号： B29C45/76 ,  B29C45/36 ,  B29C45/26

CPC分类号： B29C45/7686 ,  B29C45/36 ,  B29C45/261 ,  B29C45/768 ,  B29C2945/7629 ,  B29C2945/76103 ,  B29C2945/76588 ,  B29C2945/76745 ,  B29C2945/76936

摘要： A method employing a corrector busing including measuring plastic parts produced by a plastic injection mold, adjusting one or more corrector bushings based on any measured errors in the plastic parts, performing a test production run of plastic parts, measuring the parts produced by the test production run, and determining whether the plastic parts produced by the test production run are within tolerance.

公开(公告)号：US11668686B1

公开(公告)日：2023-06-06

申请号：US16443546

申请日：2019-06-17

申请人： Flex Ltd.

发明人： Marco De Angeli

IPC分类号： G01N31/22 ,  H04B5/00 ,  G01N21/81 ,  G01K11/16

CPC分类号： G01N31/222 ,  G01K11/16 ,  G01N21/81 ,  H04B5/0037

摘要： Recent progress related to energy harvesting solutions and printed electronics is opening the opportunity for a smart label to combine chemical/physical color change technology with an electronic based reader architecture, which can be achieved with printed electronics technologies and can be suitable for monitoring applications that are very cost sensitive. The smart label provides an innovative product architecture to achieve a very low cost solution to monitor packaged items during storage and shipment. Exemplary applications of the smart label include, but are not limited to, cold chain monitoring, food monitoring, and in-package control of sensitive devices, such as electronic components.

公开(公告)号：US20220238482A1

公开(公告)日：2022-07-28

申请号：US17668921

申请日：2022-02-10

申请人： FLEX LTD

发明人： Cheng Yang ,  Dongkai Shangguan ,  Li Yao

IPC分类号： H01L23/00 ,  H05K1/02 ,  H01L23/367

摘要： An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.

公开(公告)号：US11388023B2

公开(公告)日：2022-07-12

申请号：US16379297

申请日：2019-04-09

申请人： FLEX LTD.

发明人： Juan Benigno Nogueira-Nine ,  Johan Botvidzon ,  Linus Isberg Martinsson

IPC分类号： H04L12/66 ,  H04B1/401 ,  H04W88/16 ,  H04W88/10

摘要： Embodiments of the disclosure provide systems and methods for a multi-protocol LPWAN gateway. In the first mode, a transceiver of the gateway device can communicate with wireless devices in a first LPWAN protocol and, in the second mode, the wireless transceiver can communicate with the one or more wireless devices in a second LPWAN protocol. The second LPWAN protocol can be different from the first LPWAN protocol. In response to selecting the first mode, the gateway device can cause the wireless transceiver to conduct communications with the wireless devices using the first LPWAN protocol. In response to selecting the second mode, the gateway device can cause the wireless transceiver to conduct communications with the wireless devices using the second LPWAN protocol.