Invention Grant
- Patent Title: Wire automatic soldering system
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Application No.: US16685462Application Date: 2019-11-15
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Publication No.: US11141807B2Publication Date: 2021-10-12
- Inventor: Fengchun Xie , Dandan Zhang , Roberto-Francisco Yi Lu , Lvhai Hu , Qinglong Zeng , Lan Gong , Qian Ying , Yingcong Deng , Yun Liu
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Services GmbH , Measurement Specialties (Chengdu) Ltd. , Shenzhen AMI Technology Co., Ltd.
- Applicant Address: CN Shanghai; CH Schaffhausen; CN Chengdu; CN Shenzhen
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Services GmbH,Measurement Specialties (Chengdu) Ltd.,Shenzhen AMI Technology Co., Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Services GmbH,Measurement Specialties (Chengdu) Ltd.,Shenzhen AMI Technology Co., Ltd.
- Current Assignee Address: CN Shanghai; CH Schaffhausen; CN Chengdu; CN Shenzhen
- Agency: Barley Snyder
- Priority: CN201710352835.7 20170518
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K3/00 ; B23K3/06 ; B23K1/08 ; B23K101/38
Abstract:
A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
Public/Granted literature
- US20200094339A1 Wire Automatic Soldering System Public/Granted day:2020-03-26
Information query
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