公开(公告)号：US10382071B2

公开(公告)日：2019-08-13

申请号：US15094250

申请日：2016-04-08

Applicant: RF Micro Devices, Inc.

Inventor： Ashraf Rozek ,  Jason Yorks

IPC: H04B1/04 ,  H04L5/14 ,  H03F1/02 ,  G05F3/02 ,  H03F1/00 ,  H03F3/193 ,  H03G1/04 ,  H03H21/00

Abstract: Circuitry, which includes a PA power supply and RF PA circuitry, is disclosed. The RF PA circuitry includes a group of RF PAs and a group of PA decoupling circuits. The group of RF PAs includes a first RF PA and a second RF PA. The group of PA decoupling circuits includes a first PA decoupling circuit and a second PA decoupling circuit. The PA power supply provides a first PA power supply output signal to at least one of the group of RF PAs and to at least one of the group of PA decoupling circuits. The first PA decoupling circuit is coupled across the first RF PA, is programmable, and at least partially decouples the first RF PA from other circuitry. The second PA decoupling circuit is coupled across the second RF PA and at least partially decouples the second RF PA from other circuitry.

公开(公告)号：US10291189B2

公开(公告)日：2019-05-14

申请号：US15730241

申请日：2017-10-11

Applicant: RICHWAVE TECHNOLOGY CORP.

Inventor： Chih-Sheng Chen ,  Chia-Jung Yeh

IPC: H03F1/14 ,  H03F1/00 ,  H03F3/19 ,  H03F3/21

Abstract: An amplification circuit includes a first amplifier circuit and a second-stage amplifier. The second-stage amplifier is connected to the amplifier to form a multi-stage amplification circuit. The first amplifier circuit includes a first-stage amplifier and a bypass circuit. The bypass circuit includes a first transistor. A first end of the first transistor is coupled to the input end of the first amplifier circuit, a second end of the first transistor is coupled to the output end of the first amplifier circuit, and a third end of the first transistor is coupled to a supply voltage. The first end of the first transistor is further coupled to a first control terminal to receive a control signal for controlling a bias voltage of the first transistor, so as to make the amplification circuit work in different operation modes.

公开(公告)号：US20190020531A1

公开(公告)日：2019-01-17

申请号：US16029274

申请日：2018-07-06

Applicant: FUJITSU LIMITED

Inventor： Yi Ge ,  Takeshi Hoshida ,  Hisao Nakashima ,  YUICHI AKIYAMA

IPC: H04L27/36 ,  H03C3/40 ,  H04L1/00 ,  H04L25/49 ,  H03F1/00

CPC classification number: H04L27/364 ,  H03C3/40 ,  H03C5/00 ,  H03F1/00 ,  H03F3/24 ,  H03F2200/336 ,  H04B1/0475 ,  H04L1/0042 ,  H04L1/0047 ,  H04L25/03828 ,  H04L25/49

Abstract: A transmission system includes a first transponder including a first I/Q modulator, and a second transponder including a second I/Q modulator, and configured to communicate with the first transponder using a frequency modulation scheme, wherein the first transponder is configured to set a first phase rotation mode in a first state for first light signal output from the first I/Q modulator, and transmit, to the second transponder, a first command to specify a second phase rotation mode for second light signal output from the second I/Q modulator, and the second transponder is configured to set, in response to the first command, the second phase rotation mode in a state specified by the first command.

公开(公告)号：US10122332B2

公开(公告)日：2018-11-06

申请号：US15607145

申请日：2017-05-26

Applicant: QUALCOMM Incorporated

Inventor： Serkan Sayilir ,  Chuan Wang ,  Kevin Hsi Huai Wang

IPC: H03F1/00 ,  H03F3/191 ,  H03F3/30 ,  H03F3/26 ,  H03H7/48 ,  H03F3/00 ,  H03F3/72 ,  H04B1/18 ,  H04L27/26

Abstract: A wireless communication device includes a first low-noise amplifier (LNA). The wireless communication device also includes a first LNA load circuit coupled to an output of the LNA. The wireless communication device further includes a power splitter switchably coupled to the first LNA load circuit. The power splitter includes a negatively coupled transformer and is switchably coupled to multiple outputs.

公开(公告)号：US10027286B2

公开(公告)日：2018-07-17

申请号：US15616820

申请日：2017-06-07

Applicant: Litrinium, Inc.

Inventor： Najabat Hasnain Bajwa ,  Mikhail Barashenka ,  Hanqing Qian

IPC: H03F1/00 ,  H03F1/42 ,  H03G3/30 ,  H03F3/08 ,  H04B10/50 ,  H04B10/564 ,  H04B10/572

Abstract: A system to program parameters of one or more stages of a transimpedance amplifier (TIA) in an optical sub-assembly (e.g. TO-can package) is disclosed. With this invention, users have the option/flexibility to discretely program any of the stages of the TIA after production of the sub-assembly, i.e. they can still change the TIA settings once the TIA has been installed in a system and the system is in use.

公开(公告)号：US09819320B1

公开(公告)日：2017-11-14

申请号：US15414535

申请日：2017-01-24

Applicant: Brad W. Hoff ,  David M. French

Inventor： Brad W. Hoff ,  David M. French

IPC: H03F1/00 ,  H03F3/58 ,  H01J25/34 ,  H01J23/04 ,  H01J23/06 ,  H01J23/24

CPC classification number: H03F3/58 ,  H01J23/04 ,  H01J23/06 ,  H01J23/24 ,  H01J25/34

Abstract: A coaxial amplifier having at least one electron beam is provided. The amplifier may include a conductive rod, a plurality of parallel discs on the rod, a cathode array for producing at least one electron beam. When a plurality of electron beams are formed they are arranged in an annular configuration around said rod and disks, and directed along said rod and coaxially thereof. A first waveguide may apply electromagnetic wave energy to one end of said disc and rod assembly to induce propagation of said energy along said assembly. A second waveguide may extract the amplified electromagnetic energy from the other end of the disc and rod assembly.

公开(公告)号：US20150349714A1

公开(公告)日：2015-12-03

申请号：US14291080

申请日：2014-05-30

Applicant: Nicholas Heath Wright

Inventor： Nicholas Heath Wright

IPC: H03F1/00

CPC classification number: H05K7/20445 ,  H05K7/20409

Abstract: A amplifier with improved space efficiency includes a housing that dissipates heat having an upper wall and two side walls and having an interior with upper and lower portions. The amplifier further includes an upper circuit board in the upper portion and a lower circuit board in a lower portion. The amplifier further includes a connector that electrically connects the upper and lower circuit boards.

Abstract translation: 具有改善的空间效率的放大器包括散热的壳体，其具有上壁和两个侧壁，并且具有具有上部和下部的内部。 放大器还包括上部电路板和下部电路板。 放大器还包括电连接上电路板和下电路板的连接器。

公开(公告)号：US09190958B2

公开(公告)日：2015-11-17

申请号：US13941127

申请日：2013-07-12

Applicant: SNAPTRACK, INC.

Inventor： Martin Paul Wilson

IPC: H03F1/00 ,  H03F1/02 ,  H03F3/189 ,  H03F3/19 ,  H03F3/21

CPC classification number: H03F1/0222 ,  H03F1/00 ,  H03F1/02 ,  H03F1/025 ,  H03F3/189 ,  H03F3/19 ,  H03F3/21 ,  H03F3/245 ,  H03F2200/102 ,  H03F2200/331 ,  H03F2200/451 ,  H03F2200/504 ,  H03F2200/511

Abstract: A radio frequency amplification stage comprising: an amplifier for receiving an input signal to be amplified and a power supply voltage; and a power supply voltage stage for supplying said power supply voltage, comprising: means for providing a reference signal representing the envelope of the input signal; means for selecting one of a plurality of supply voltage levels in dependence on the reference signal; and means for generating an adjusted selected power supply voltage, comprising an ac amplifier for amplifying a difference between the reference signal and one of the selected supply voltage level or the adjusted selected supply voltage level, and a summer for summing the amplified difference with the selected supply voltage to thereby generate the adjusted supply voltage.

Abstract translation: 一种射频放大级，包括：放大器，用于接收待放大的输入信号和电源电压; 以及用于提供所述电源电压的电源电压级，包括：用于提供表示所述输入信号的包络的参考信号的装置; 用于根据参考信号选择多个电源电压电平中的一个的装置; 以及用于产生经调整的所选择的电源电压的装置，包括用于放大参考信号与所选择的电源电压电平或所调整的所选电源电压电平之一之间的差的交流放大器，以及用于将所放大的差与所选择的电源电压相加的加法器 供给电压，从而生成调整后的电源电压。

公开(公告)号：US09118278B2

公开(公告)日：2015-08-25

申请号：US14264631

申请日：2014-04-29

Applicant: Martin Paul Wilson

Inventor： Martin Paul Wilson

IPC: H03F1/00 ,  H03F1/02 ,  H03F3/189 ,  H03F3/19 ,  H03F3/21

CPC classification number: H03F1/0222 ,  H03F1/00 ,  H03F1/02 ,  H03F1/025 ,  H03F3/189 ,  H03F3/19 ,  H03F3/21 ,  H03F3/245 ,  H03F2200/102 ,  H03F2200/331 ,  H03F2200/451 ,  H03F2200/504 ,  H03F2200/511

Abstract: A radio frequency amplification stage comprising: an amplifier for receiving an input signal to be amplified and a power supply voltage; and a power supply voltage stage for supplying said power supply voltage, comprising: means for providing a reference signal representing the envelope of the input signal; means for selecting one of a plurality of supply voltage levels in dependence on the reference signal; and means for generating an adjusted selected power supply voltage, comprising an ac amplifier for amplifying a difference between the reference signal and one of the selected supply voltage level or the adjusted selected supply voltage level, and a summer for summing the amplified difference with the selected supply voltage to thereby generate the adjusted supply voltage.

公开(公告)号：US09078380B2

公开(公告)日：2015-07-07

申请号：US13655830

申请日：2012-10-19

Applicant: NVIDIA CORPORATION

Inventor： Shuang Xu

IPC: H01L25/00 ,  H03F1/00 ,  H01L29/08 ,  H05K3/30

CPC classification number: H05K3/30 ,  H01L25/00 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/10166 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Embodiments of the invention provide methods and configuration for packaging multiple semiconductor ships in a semiconductor package. In one embodiment, an integrated circuit system includes a printed circuit board, a first MOSFET device disposed on a first surface of the printed circuit board, and a second MOSFET device disposed on a second surface of the printed circuit board, wherein the first MOSFET device overlaps an edge of the second MOSFET device in a direction extending through the printed circuit board.

Abstract translation: 本发明的实施例提供了用于在半导体封装中封装多个半导体船的方法和配置。 在一个实施例中，集成电路系统包括印刷电路板，设置在印刷电路板的第一表面上的第一MOSFET器件和布置在印刷电路板的第二表面上的第二MOSFET器件，其中第一MOSFET器件 在延伸穿过印刷电路板的方向上与第二MOSFET器件的边缘重叠。