ULTRA-LOW NOISE CRYOGENIC MICROWAVE AMPLIFICATION

    公开(公告)号:US20230327388A1

    公开(公告)日:2023-10-12

    申请号:US18208531

    申请日:2023-06-12

    IPC分类号: H01S1/02

    CPC分类号: H01S1/02

    摘要: Embodiments of the microwave amplification system are described. In an embodiment, a microwave amplification system includes a microwave amplifier that contains a paramagnetic material with an impurity. The impurity has a plurality of nuclear spin and electron spin-based energy levels. The system includes an input to receive a pumping signal which is transmitted to the microwave amplifier to cause a population inversion in the impurity and excite it to one of the nuclear spin and electron spin-based energy levels. The system further includes another input to receive an input signal to be amplified by the microwave amplifier, the input signal having a lower power than the pumping signal. Once transmitted to the microwave amplifier, the input signal is amplified by the excited state of the impurity in the microwave amplifier thereby generating an amplified signal.

    ROOM TEMPERATURE MASING USING SPIN-DEFECT CENTRES

    公开(公告)号:US20210091526A1

    公开(公告)日:2021-03-25

    申请号:US16634225

    申请日:2018-07-26

    IPC分类号: H01S1/02

    摘要: Masing at room temperature is achieved by an apparatus and method that utilize a microwave cavity which exhibits a resonance of sufficiently high Q-factor for maser oscillation, and a resonator structure comprising a masing medium located within a resonant element. The masing medium comprises spin-defect centres. The resonator structure is disposed within the microwave cavity. A magnetic field is applied across the masing medium. An input of microwave radiation to be amplified is coupled to the resonator structure. An optical pump pumps the masing medium, thereby causing stimulated emission of microwave photons. The microwave cavity has an effective magnetic mode volume matching the volume of the masing medium.

    COHERENT TERAHERTZ MAGNON LASER AND COHERENT TERAHERTZ COMMUNICATION SYSTEM

    公开(公告)号:US20200225152A1

    公开(公告)日:2020-07-16

    申请号:US16655472

    申请日:2019-10-17

    申请人: Magtera, Inc.

    摘要: An apparatus for generation of coherent terahertz radiation is provided. In one example, the apparatus includes one or more multilayer tunable microcolumns. In turn, a multilayer tunable microcolumn can include a substrate, a bottom electrode, a bottom layer of a ferromagnetic material further comprising a magnon gain medium (MGM) coupled to the bottom electrode, a tunnel junction coupled to the ferromagnetic material, a spin injector coupled to the tunnel junction, a pinning layer coupled to the spin injector, a reference layer coupled to the pinning layer and a top electrode. In one example, a containment cavity encloses at least one of the multilayer tunable microcolumns. In one example, a storage cavity encloses the containment cavity.

    Thermo-electric cooling system and method for cooling electronic devices

    公开(公告)号:US09806491B2

    公开(公告)日:2017-10-31

    申请号:US14824964

    申请日:2015-08-12

    摘要: A thermo-electric cooling (TEC) system is presented for cooling of a device, such a laser for example. The TECT system comprises first and second heat pumping assemblies, and a control unit associated at least with said second heat pumping assembly. Each heat pumping assembly has a heat source from which heat is pumped and a heat drain through which pumped heat is dissipated. The at least first and second heat pumping assemblies are arranged in a cascade relationship having at least one thermal interface between the heat source of the second heat pumping assembly and the heat drain of the first heat pumping assembly, the heat source of the first heat pumping assembly being thermally coupled to the electronic device which is to be cooled by evacuating heat therefrom. The control unit is configured and operable to carry out at least one of the following: (i) operating said second heat pumping assembly to provide a desired temperature condition such that temperature of the heat drain of said first heat pumping assembly is either desirably low or by a certain value lower than temperature of the heat source of said first heat pumping assembly; and (ii) operating said second heat pumping assembly to maintain predetermined temperature of said thermal interface.