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公开(公告)号:US11931828B2
公开(公告)日:2024-03-19
申请号:US18169192
申请日:2023-02-14
发明人: Sujuan Zhong , Yongtao Jiu , Yafang Cheng , Junlan Huang , Tianran Ding , Guanxing Zhang , Quanbin Lu
IPC分类号: B23K35/02 , B23K35/22 , B23K35/30 , B23K35/365 , B23K35/40 , B32B1/08 , B32B7/02 , B32B15/01 , B32B15/02 , B32B15/04 , B32B15/20 , C22C9/00 , C22C9/02 , C23C2/08 , C23C2/38 , C23C28/00 , C23C28/02 , C23C30/00
CPC分类号: B23K35/0227 , B23K35/0261 , B23K35/0272 , B23K35/22 , B23K35/302 , B23K35/365 , B23K35/40 , B23K35/404 , B23K35/406 , B32B1/08 , B32B7/02 , B32B15/01 , B32B15/02 , B32B15/04 , B32B15/043 , B32B15/20 , C22C9/00 , C22C9/02 , C23C2/08 , C23C2/38 , C23C28/02 , C23C28/021 , C23C28/32 , C23C28/321 , C23C28/322 , C23C30/00 , C23C30/005 , Y10T428/12708 , Y10T428/12715 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291 , Y10T428/24942 , Y10T428/2495 , Y10T428/26
摘要: The present disclosure provides a copper-phosphorus-tin brazing wire and a preparation method thereof, relates to the technical field of brazing materials. The copper-phosphorus-tin brazing wire is of a three-layer structure, the inner layer is Cu, the middle layer is Cu-14P alloy, and the outer layer is Sn, wherein the mass percentage of Sn is over 7%. The present disclosure solves the technical problems in the prior art that the copper-phosphorus-silver brazing filler metal is prone to produce defects such as pores and inclusions when brazing copper alloys, which leads to the decline of the mechanical properties of the joint, and simultaneously provides the preparation method of the copper-phosphorus-tin brazing wire, such that the technical problem that it is difficult to obtain copper-phosphorus-tin brazing wire with a wire diameter below 0.5 mm under the condition of high Sn content is solved.
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公开(公告)号:US20230265549A1
公开(公告)日:2023-08-24
申请号:US18040169
申请日:2020-12-21
申请人: WIELAND-WERKE AG
发明人: Michael BOHSMANN , Robert ZAUTER
IPC分类号: C23C2/08
CPC分类号: C23C2/08
摘要: An electrically conducting material including a substrate composed of copper or a copper alloy, and a coating composed of at least one layer. The coating has an outermost layer consisting to an extent of at least 90 Vol % of an intermetallic phase which is or includes Cu6Sn5. The surface of the outermost layer that faces away from the substrate has insular, silver-rich precipitations with an area fraction of 7 to 20%.
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公开(公告)号:US11149336B2
公开(公告)日:2021-10-19
申请号:US16171670
申请日:2017-04-26
申请人: ArcelorMittal
发明人: José Veg , Didier Dauchelle , Hubert Saint-Raymond
IPC分类号: C23C2/00 , C23C2/06 , C23C2/12 , C23C2/30 , C23C2/20 , C23C2/40 , C23C2/02 , C23C2/10 , C23C2/08
摘要: An apparatus for the continuous hot dip coating of a metal strip is provided. The apparatus includes a vessel intended to contain a liquid metal bath, a bottom roller and a displacement casing for the metal strip. The casing includes an upper portion and a lower portion. The lower portion includes a pouring box delimiting at least two liquid metal pouring compartments. Each pouring compartment is inwardly delimited by an inner wall including an upper rim. The casing is provided with the pouring box, is rotatable relative to the metal strip around a first rotation axis and the pouring box is rotatable relative to the upper portion of the casing around a second rotation axis. A method for coating the metal sheet is also provided.
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公开(公告)号:US20210218171A1
公开(公告)日:2021-07-15
申请号:US17055016
申请日:2019-05-21
发明人: BENJAMIN CAPPI , HELGE LEHMANN , KARL ZEIGER
摘要: The present invention concerns a copper strip for the making of electrical contacts, with a base material of copper or a copper alloy and a coating of tin, wherein the coating of tin has a proportion of insoluble, precipitation-forming elements of 0.003 to 1.0, preferably up to 0.5, preferably up to 0.05, particularly preferably up to 0.01 percent by weight. The invention further relates to a process for producing a copper strip for the manufacture of electrical contacts and a connector.
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公开(公告)号:US10851467B2
公开(公告)日:2020-12-01
申请号:US15739052
申请日:2015-06-23
IPC分类号: C25D9/08 , C25D3/30 , C25D3/12 , C22C1/00 , C25D5/10 , C25D5/48 , C21D8/02 , C25D3/54 , C23C2/04 , B32B15/04 , C23C28/00 , C23C30/00 , C23C2/08 , C23C22/03 , C22C1/02 , B32B15/01 , B32B15/18 , C22C1/04 , C23C22/07 , C23C2/02 , C25D5/12 , C21D8/00 , C25D5/50 , C21D9/46 , C23F17/00
摘要: A steel sheet for containers including a steel sheet, a Sn coated layer that is formed on at least one surface of the steel sheet, and a chemical treatment layer that is formed on the Sn coated layer. A variation amount in a yellowness index measured at one measurement point on the outermost surface of the chemical treatment layer is defined as ΔYI, and represented by ΔYI=YI−YI0, wherein YI is the yellowness index measured after the steel sheet for containers is subjected to a retort treatment at a temperature of 130° C. for 5 hours, and YI0 is the yellowness index measured before the retort treatment. An average of absolute values of the ΔYI obtained at a plurality of measurement points included in a unit area of the outermost surface is 5.0 or less.
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公开(公告)号:US10577705B2
公开(公告)日:2020-03-03
申请号:US15563208
申请日:2016-04-15
发明人: Akira Tachiki , Shigeru Hirano , Yoshiaki Tani , Hirokazu Yokoya , Morio Yanagihara , Makoto Kawabata
IPC分类号: C25D5/12 , C25D5/50 , C25D9/08 , C25D7/06 , B32B15/01 , C25D5/48 , C23C28/00 , C23C30/00 , C23C28/02 , C23C10/28 , C23C2/02 , C23C2/28 , C23C2/40 , C23C2/08 , C23C10/02 , C25D11/36 , C25D5/34 , C25D5/40 , C25D11/00 , C25D7/04 , C25D5/36 , C25D11/34 , C25D11/26 , C25D9/10 , C25D11/02 , B32B15/18 , B32B15/04 , C23C2/26 , C23C2/04 , C23C2/34
摘要: A steel sheet for a container includes: a steel sheet; a coated layer containing Ni provided as an upper layer of the steel sheet; and a chemical treatment layer as an upper layer of the coated layer, and containing a Zr compound in an amount of 3.0 to 30.0 mg/m2 in terms of Zr metal, and a Mg compound in an amount of 0.50 to 5.00 mg/m2 in terms of Mg metal, in which the coated layer is one of: a Ni coated layer which contains Ni in amount of 10 to 1000 mg/m2 in terms of Ni metal, and a composite coated layer which contains Ni in an amount of 5 to 150 mg/m2 in terms of Ni metal and Sn in an amount of 300 to 3000 mg/m2 in terms of Sn metal, and has an island-shaped Sn coated layer formed on an Fe—Ni—Sn alloy layer.
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公开(公告)号:US10563311B2
公开(公告)日:2020-02-18
申请号:US15562805
申请日:2016-04-15
发明人: Akira Tachiki , Shigeru Hirano , Yoshiaki Tani , Hirokazu Yokoya , Morio Yanagihara , Makoto Kawabata
IPC分类号: C23C28/00 , C23C30/00 , C25D9/08 , C25D5/48 , C25D5/12 , C25D5/50 , C25D7/06 , B32B15/01 , C25D11/00 , C25D11/02 , C25D11/26 , C25D11/36 , C25D11/34 , C25D7/04 , C23C10/02 , C23C2/02 , C23C2/28 , C25D5/36 , C25D5/34 , C25D9/10 , C23C2/34 , C23C10/28 , C23C2/40 , C23C2/08 , C23C2/04 , C23C28/02 , C23C2/26 , C25D5/40 , B32B15/04 , B32B15/18
摘要: A steel sheet for a container includes a steel sheet, a Sn coated layer which is provided as an upper layer of the steel sheet and contains Sn in an amount of 560 to 5600 mg/m2 in terms of Sn metal, and a chemical treatment layer which is provided as an upper layer of the Sn coated layer and contains a Zr compound in an amount of 3.0 to 30.0 mg/m2 in terms of Zr metal and a Mg compound in an amount of 0.50 to 5.00 mg/m2 in terms of Mg metal.
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公开(公告)号:US09653191B2
公开(公告)日:2017-05-16
申请号:US14652389
申请日:2013-12-26
发明人: Kazunari Maki , Hiroyuki Mori , Daiki Yamashita
IPC分类号: B32B15/20 , C22C9/04 , H01B1/02 , H01B5/02 , C23C30/00 , C22C9/06 , C22C9/00 , C23C2/08 , B32B15/04 , B32B15/01 , C22F1/08
CPC分类号: H01B1/026 , B32B15/01 , B32B15/04 , B32B15/043 , B32B15/20 , C22C9/00 , C22C9/04 , C22C9/06 , C22F1/08 , C23C2/08 , C23C30/00 , C23C30/005 , H01B5/02 , Y10T428/12 , Y10T428/12431 , Y10T428/12438 , Y10T428/12715 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291 , Y10T428/12917 , Y10T428/12924
摘要: The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002≦Fe/Ni
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公开(公告)号:US06918172B2
公开(公告)日:2005-07-19
申请号:US10037935
申请日:2002-01-02
申请人: James Wong
发明人: James Wong
CPC分类号: C23C2/28 , C23C2/02 , C23C2/08 , H01L39/2409 , Y10T29/49014
摘要: A niobium-based superconductor is manufactured by establishing multiple niobium components in a billet of a ductile metal, working the composite billet through a series of reduction steps to form the niobium components into elongated elements, each niobium element having a thickness on the order of 1 to 25 microns, surrounding the billet prior to the last reduction step with a porous confining layer of an acid resistant metal, immersing the confined billet in an acid or a high temperature liquid metal to remove the ductile metal from between the niobium elements while the niobium elements remain confined by said porous layer, exposing the confined mass of niobium elements to a material capable of reacting with Nb to form a superconductor.
摘要翻译: 铌基超导体通过在延性金属的坯料中建立多个铌组分来制造,通过一系列还原步骤来加工复合坯料,以将铌组分形成为细长元件,每个铌元素的厚度大约为1 至25微米,在最后的还原步骤之前,用耐酸金属的多孔限制层围绕坯料,将受限制的坯料浸入酸或高温液态金属中,以从铌元素之间除去延性金属,而铌 元素仍然被所述多孔层限制,将约束的铌元素暴露于能够与Nb反应的材料以形成超导体。
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公开(公告)号:US5330801A
公开(公告)日:1994-07-19
申请号:US789667
申请日:1991-05-08
IPC分类号: B23K1/06 , B23K1/08 , B23K1/20 , C23C2/02 , C23C2/08 , B05D3/12 , B05D5/12 , B05D1/18 , B05D3/10
摘要: A process for tinning plated wire involves first the placing of the wire in a suitable chemical flux for a period of time, the wire is then immersed for a period of time into a static solder pot having molten solder therein, the wire is then re-immersed into the chemical flux for a period of time, and finally the wire is immersed for a period of time into an ultrasonic solder pot having molten solder therein, the wire when removed from the ultrasonic pot being sufficiently tinned such that the solder has formed a suitable intermolecular bond to the plating in accordance with typical bonding criteria.
摘要翻译: 镀锡电镀线的方法首先将电线放置在合适的化学助焊剂中一段时间,然后将电线浸入一段时间内进入其中具有熔融焊料的静态焊料罐中, 浸入化学通量一段时间,最后将电线浸入一段时间内浸入其中具有熔融焊料的超声波焊锡锅中,从超声波锅中取出的电线被充分镀锡,使焊料形成一个 根据典型的键合标准,适当的分子间键合到电镀。
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