- 专利标题: Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal
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申请号: US14652389申请日: 2013-12-26
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公开(公告)号: US09653191B2公开(公告)日: 2017-05-16
- 发明人: Kazunari Maki , Hiroyuki Mori , Daiki Yamashita
- 申请人: MITSUBISHI MATERIALS CORPORATION , Mitsubishi Shindoh Co., Ltd.
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: MITSUBISHI MATERIALS CORPORATION,MITSUBISHI SHINDOH CO., LTD.
- 当前专利权人: MITSUBISHI MATERIALS CORPORATION,MITSUBISHI SHINDOH CO., LTD.
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: Leason Ellis LLP
- 优先权: JP2012-288051 20121228; JP2013-252331 20131205
- 国际申请: PCT/JP2013/084903 WO 20131226
- 国际公布: WO2014/104198 WO 20140703
- 主分类号: B32B15/20
- IPC分类号: B32B15/20 ; C22C9/04 ; H01B1/02 ; H01B5/02 ; C23C30/00 ; C22C9/06 ; C22C9/00 ; C23C2/08 ; B32B15/04 ; B32B15/01 ; C22F1/08
摘要:
The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002≦Fe/Ni
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