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    TACKIFIED AND FILLED SILICONE ADHESIVE COMPOSITIONS
    3.
    发明申请
    TACKIFIED AND FILLED SILICONE ADHESIVE COMPOSITIONS 有权

    公开(公告)号：US20210238463A1

    公开(公告)日：2021-08-05

    申请号：US17270107

    申请日：2019-08-21

    申请人： 3M INNOVATIVE PROPERTIES COMPANY

    发明人： Payam Khodaparast ,  Michael B. Runge ,  Kent C. Hackbarth ,  Sonja S. Mackey ,  David J. Kinning

    IPC分类号： C09J183/04 ,  C09J7/35 ,  C09J7/38 ,  C09J183/10 ,  C09J177/06 ,  C09J175/02

    摘要： The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer, silicone polyurea block copolymer, and/or an addition cure silicone, a silicate tackifying resin, and inorganic particle filler. The filler is typically fumed silica. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in between about 0.1 wt % and about 20 wt %; a silicone polyurea block copolymer, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in an amount between about 0.1 wt % and about 20 wt %; and an addition cure silicone, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in an amount between about 0.1 wt % and about 20 wt %.

    Polyamides based on aminoalkylpiperazine or aminoarylpiperazine for hot-melt adhesives
    4.
    发明授权
    Polyamides based on aminoalkylpiperazine or aminoarylpiperazine for hot-melt adhesives 有权

    公开(公告)号：US10550227B2

    公开(公告)日：2020-02-04

    申请号：US15322934

    申请日：2015-06-22

    申请人： Arkema France

    发明人： Quentin Pineau

    IPC分类号： C08G69/26 ,  C09J177/06 ,  C08L77/08 ,  C09J179/04 ,  C08L77/06 ,  C08G69/36 ,  C08G69/40 ,  C08G73/06 ,  C08L79/04

    摘要： A semi-crystalline polyamide including at least one monomer resulting from the condensation of a diacid and of a diamine of formula AP.Y, the semi-crystalline polyamide having the following general formula (I): AP.Y/(A)m/(Pip.Y′)n/(B.Y″)q and the semi-crystalline polyamide having an Mp1 less than or equal to approximately 150° C., in particular less than or equal to approximately 130° C., in particular less than or equal to approximately 120° C. and/or a Tg less than or equal to approximately 60° C., in particular less than or equal to approximately 50° C., in particular less than or equal to approximately 40° C., as determined respectively by DSC according to standard ISO 11357-3 (2013) and ISO 11357-2 (2013).

    RESIN COMPOSITION AND BONDED COMPOSITE
    9.
    发明申请
    RESIN COMPOSITION AND BONDED COMPOSITE 有权
    树脂组合物和粘结复合材料

    公开(公告)号：US20130295309A1

    公开(公告)日：2013-11-07

    申请号：US13979011

    申请日：2011-12-28

    申请人： Yuma Irisa ,  Shuichi Maeda

    发明人： Yuma Irisa ,  Shuichi Maeda

    IPC分类号： B32B27/28 ,  C09J177/06 ,  B32B7/10

    CPC分类号： B32B27/281 ,  B32B1/02 ,  B32B1/08 ,  B32B7/10 ,  B32B27/285 ,  B32B27/34 ,  B32B2605/08 ,  B32B2605/18 ,  C08G69/08 ,  C08G69/10 ,  C08G69/14 ,  C08G69/36 ,  C08G69/40 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C09J177/02 ,  C09J177/06 ,  Y10T428/1352 ,  Y10T428/1393 ,  Y10T428/24628 ,  Y10T428/31721

    摘要： A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between the polyimide resin and the composition, and a bonded composite having the resin composition and a polyimide resin which together form an interface to be bonded with each other. A resin composition for forming an interface together with a polyimide resin for bonding, wherein the resin composition comprises a polyether polyamide elastomer (component R) obtained by subjecting a specific aminocarboxylic acid compound A1 and/or lactam compound A2, polyether compound B, and dicarboxylic acid compound C to polymerization, wherein the content of the component R in the resin composition is 80 to 100% by weight.

    摘要翻译： 一种树脂组合物，优选粘合剂组合物，其包含能够与聚酰亚胺树脂强力弯曲的聚醚聚酰胺弹性体，优选通过容易的方法强力弯曲以形成聚酰亚胺树脂和组合物之间的界面，以及具有树脂的粘合复合材料 组合物和一起形成要彼此键合的界面的聚酰亚胺树脂。 一种与用于粘合的聚酰亚胺树脂一起形成界面的树脂组合物，其中所述树脂组合物包含通过使特定的氨基羧酸化合物A1和/或内酰胺化合物A2，聚醚化合物B和二羧酸获得的聚醚聚酰胺弹性体（组分R） 酸化合物C进行聚合，其中树脂组合物中组分R的含量为80〜100重量％。

    METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
    10.
    发明申请
    METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD 审中-公开
    制造多层印刷线路板的方法

    公开(公告)号：US20080202676A1

    公开(公告)日：2008-08-28

    申请号：US12038634

    申请日：2008-02-27

    申请人： Yukihiro UENO ,  Hiroaki OKADA

    发明人： Yukihiro UENO ,  Hiroaki OKADA

    IPC分类号： B32B38/10 ,  C09J177/06 ,  C09J173/00

    CPC分类号： H05K3/4691 ,  H05K3/046 ,  H05K3/243 ,  H05K3/281 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2203/0191

    摘要： In one embodiment, an inner layer pattern formation step of patterning a conductor layer of an inner layer base material to form an inner layer circuit pattern of an inner layer circuit pattern portion and a lead pattern of a lead pattern portion, a resin film affixing step of affixing a resin film to the lead pattern portion, an outer layer base material layering step of layering/fastening to the inner layer base material an outer layer adhesive layer disposed corresponding to the inner layer circuit pattern portion and an outer layer conductor layer disposed corresponding to the inner layer base material, an outer layer pattern formation step of patterning the outer layer conductor layer to form an outer layer circuit pattern portion corresponding to the inner layer circuit pattern portion, and a resin film peeling step of peeling away the resin film from the lead pattern portion, are provided.

    摘要翻译： 在一个实施例中，内层图形形成步骤，对内层基材的导体层进行构图以形成内层电路图案部分和引线图形部分的引线图案的内层电路图案，树脂膜固定步骤 将树脂膜固定到引线图案部分的外层基材层叠步骤，对内层基材进行分层/固定，对应于内层电路图形部分设置的外层粘合层和相应设置的外层导体层 外层图案形成工序，对外层导体层进行图案化，形成对应于内层电路图形部分的外层电路图形部分;以及树脂膜剥离步骤，将树脂膜从 引线图案部分。