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    POLISHING DEVICE AND METHOD FOR POLISHING SEMICONDUCTOR WAFER
    1.
    发明申请
    POLISHING DEVICE AND METHOD FOR POLISHING SEMICONDUCTOR WAFER 有权
    抛光装置和抛光半导体波形的方法

    公开(公告)号：US20160074986A1

    公开(公告)日：2016-03-17

    申请号：US14633907

    申请日：2015-02-27

    申请人： Kabushiki Kaisha Toshiba

    发明人： Shiguma KATO

    IPC分类号： B24B21/18 ,  H01L21/304 ,  B24B21/06

    CPC分类号： B24B21/18 ,  B24B21/06 ,  B24B37/005 ,  B24B37/04 ,  B24B49/04 ,  H01L21/321

    摘要： According to one embodiment, a polishing device includes a stage, a polishing unit, a warp suppressing unit, and an adsorbing mechanism. A semiconductor wafer is mounted onto the stage. The stage is rotatable around a first shaft. The polishing unit applies a force to and polishes a rear surface of the semiconductor wafer mounted on the stage. The warp suppressing unit applies a force to, during the polishing, an outer circumferential part of a front surface of the semiconductor wafer. The adsorbing mechanism adsorbs, during the polishing, a first region in the rear surface of the semiconductor wafer. The first region is on a center side relative to an area at which the polishing is performed.

    摘要翻译： 根据一个实施例，抛光装置包括台，抛光单元，翘曲抑制单元和吸附机构。 半导体晶片安装在平台上。 舞台可围绕第一轴旋转。 抛光单元对安装在平台上的半导体晶片的后表面施加力并进行抛光。 翘曲抑制单元在抛光期间对半导体晶片的正面的外周部施加力。 吸附机构在抛光期间吸附半导体晶片后表面的第一区域。 第一区域相对于进行抛光的区域在中心侧。

    Sanding apparatus
    2.
    发明授权
    Sanding apparatus 失效
    砂光机

    公开(公告)号：US07744446B1

    公开(公告)日：2010-06-29

    申请号：US12196070

    申请日：2008-08-21

    申请人： Ilmars Vilmanis

    发明人： Ilmars Vilmanis

    IPC分类号： B24B21/06

    CPC分类号： B24B21/04 ,  B24B41/02

    摘要： A sanding apparatus includes a plurality of posts each having an upper end and a lower end. The plurality of posts is four posts. A first horizontal support extends between two of the posts and a second horizontal support extends between another two of the posts. The first and second horizontal supports are vertically adjustable with respect to the posts. A table is mounted to and extends between the first and second horizontal supports. A belt sander is amounted to the posts. The table is positioned between the lower end of the posts and the belt sander. The table is selectively movable upwardly towards or downwardly from the belt sander.

    摘要翻译： 打磨装置包括多个柱，每个柱具有上端和下端。 多个职位是四个职位。 第一水平支架在两个柱之间延伸，第二水平支撑在另外两个柱之间延伸。 第一和第二水平支撑件相对于柱垂直可调。 桌子安装到第一和第二水平支撑件之间并在其之间延伸。 皮带砂光机相当于立柱。 工作台位于柱的下端和带式打磨机之间。 桌子选择性地可以从带式打磨机向上或向下移动。

    Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
    3.
    发明授权
    Method and apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane 失效
    具有载体和膜的微电子基板的化学机械平面化的方法和装置

    公开(公告)号：US06852017B2

    公开(公告)日：2005-02-08

    申请号：US09910638

    申请日：2001-07-20

    申请人： Nathan R. Brown

    发明人： Nathan R. Brown

    IPC分类号： B24B21/06 ,  B24B37/30 ,  B24B37/32 ,  B24B1/00

    CPC分类号： B24B37/30 ,  B24B21/06 ,  B24B37/32

    摘要： A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.

    摘要翻译： 一种用于平面化微电子衬底的方法和装置。 在一个实施例中，该装置可以包括由可压缩的柔性材料（例如氯丁橡胶或硅树脂）形成的膜，并且具有厚度大于第二部分的厚度的第一部分。 膜可以与微电子衬底对准以将微电子衬底偏压于平坦化介质，使得膜的第一部分以比膜的第二部分更大的向下的力使微电子衬底偏压。 因此，膜可以补偿影响，例如穿过衬底的线的速度的变化，否则将导致衬底以非均匀的方式平坦化，或者可以使用膜来选择性地平面化微电子部分 底物以不同的速率。

    System and method for independent air bearing zoning for semiconductor polishing device
    5.
    发明授权
    System and method for independent air bearing zoning for semiconductor polishing device 有权
    用于半导体抛光装置的独立空气轴承分区的系统和方法

    公开(公告)号：US6155915A

    公开(公告)日：2000-12-05

    申请号：US275654

    申请日：1999-03-24

    申请人： Christopher H. Raeder

    发明人： Christopher H. Raeder

    IPC分类号： B24B21/06 ,  B24B37/04 ,  B24B29/00 ,  B24B5/00

    CPC分类号： B24B37/04 ,  B24B21/06

    摘要： A polishing assembly for CMP of semiconductors includes an air bearing platen having multiple concentric rings of air holes, with each ring defining an air delivery zone. Each ring includes air source holes alternating with air drain holes. A distribution plate is mated with the platen, and the distribution plate has alternating rings of air supply and air exhaust rings. The air supply rings include air supply apertures that are aligned with the air source holes in the platen, and the air exhaust rings include air exhaust apertures that are aligned with the air drain holes in the platen. With this structure, the air distribution profile of each air delivery zone can be established relatively independently of the profiles of the other zones.

    摘要翻译： 用于半导体CMP的抛光组件包括具有多个气孔同心环的空气轴承压板，每个环限定空气输送区。 每个环包括与排气孔交替的空气源孔。 分配板与压板配合，分配板具有交替的供气环和排气环。 空气供给环包括与压板中的空气源孔对准的空气供给孔，排气环包括与压板中的排气孔对准的排气孔。 利用这种结构，可以相对独立于其它区域的轮廓来建立每个空气输送区域的空气分配轮廓。

    Apparatus and method for polishing a flat surface using a belted polishing pad
    6.
    发明授权
    Apparatus and method for polishing a flat surface using a belted polishing pad 有权

    公开(公告)号：US6146249A

    公开(公告)日：2000-11-14

    申请号：US177089

    申请日：1998-10-22

    申请人： Albert Hu ,  Burford J. Furman ,  Mohamed Abushaban

    发明人： Albert Hu ,  Burford J. Furman ,  Mohamed Abushaban

    IPC分类号： B24B21/06 ,  B24B21/12 ,  B24B37/04 ,  G11B5/84 ,  B24B1/00

    CPC分类号： B24B21/12 ,  B24B21/06 ,  B24B37/04 ,  G11B5/84 ,  G11B5/8404

    摘要： The present invention relates to an apparatus and method of Chemical Mechanical Planarization ("CMP") for wafer, flat panel display (FPD), and hard drive disk (HDD). The preferred apparatus comprises a looped belt spatially oriented in a vertical direction with respect to a ground floor. A polishing pad is glued to an outer surface of the belt. At an inner surface of the belt, there are a plurality of wafer supports to support the wafers while they are in polishing process. Wafers are loaded from a wafer station to a wafer head using a handling structure before polishing and are unloaded from the wafer head to the wafer station after polishing. An electric motor or equivalent is used to drive the looped belt running over two pulleys. An adjustment means is used to adjust the tension and position of the belt for smooth running. This new CMP machine can be mounted in multiple orientations to save manufacturing space.

    Apparatus for pressing a circulating grinding belt
    9.
    发明授权
    Apparatus for pressing a circulating grinding belt 失效
    用于压制循环研磨带的装置

    公开(公告)号：US5613901A

    公开(公告)日：1997-03-25

    申请号：US552267

    申请日：1995-11-02

    申请人： Georg Weber ,  Martin Ellmer

    发明人： Georg Weber ,  Martin Ellmer

    IPC分类号： B24B21/06 ,  B24B21/10 ,  B24B21/08

    CPC分类号： B24B21/10 ,  B24B21/06

    摘要： In an apparatus for pressing the grinding belt of a belt grinding machine to the upper surface of a workpiece, a pressing beam located above and extending transversely to the feed direction of the workpiece carries a row of positioning units having downwardly extending positioning rods for applying forces to an equalizing mat positioned between the lower ends of the rods and the inner side of the grinding belt to push the belt downwardly onto the top surface of the workpiece. The forces are transferred from the positioning rods to the equalizing mat by a row of pressure plates respectively associated with the positioning rods with the lower ends of the positioning rods lying loosely against the pressure plates. This achieves a simplified construction easing maintenance and repair and allows the equalizing pad to have the ability to uniformly distribute the forces onto the grinding belt and to have the flexibility needed to accommodate workpiece top surfaces of different shapes.

    摘要翻译： 在用于将带式磨碎机的研磨带压到工件的上表面的装置中，位于工件的进给方向上方并横向延伸的加压梁承载一排具有向下延伸的定位杆的定位单元，用于施加力 到位于杆的下端和研磨带的内侧之间的均衡垫，以将带向下推到工件的顶表面上。 这些力通过分别与定位杆相关联的一排压板从定位杆传递到均衡垫，定位杆的下端松散地抵靠压板。 这实现了简化的结构简化维护和修理，并且允许均衡垫具有将力均匀地分布到研磨带上并且具有容纳不同形状的工件顶表面所需的柔性的能力。

    Wide-belt sander machine
    10.
    发明授权
    Wide-belt sander machine 失效
    宽带砂光机

    公开(公告)号：US5094036A

    公开(公告)日：1992-03-10

    申请号：US593112

    申请日：1990-10-05

    申请人： Gino Botteghi

    发明人： Gino Botteghi

    IPC分类号： B24B21/06

    CPC分类号： B24B21/06

    摘要： The improvement described in this invention consists of a cross-beam fitted with a lever fixed to and rotating with, at one end, to the end of a single, plate pivot pin projecting from a support frame, the other end of the lever is connected to hydraulic actuating means located on the frame and acting on the lever so as to vary the angle of the plates in relation to the conveyor belt. On the frame there is an adjustable stroke limiter which acts on the lever and limits the angular variation of the lever to within a preset range. The frame is also fitted with automatic engaging and locking means connected to the hydraulic actuating means.