发明授权
- 专利标题： Chemical mechanical polishing with a small polishing pad
- 专利标题（中）： 化学机械抛光用小抛光垫
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申请号： US342316申请日： 1999-06-29
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公开(公告)号： US6159080A公开(公告)日： 2000-12-12
- 发明人: Homayoun Talieh
- 申请人： Homayoun Talieh
- 申请人地址： CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： CA Santa Clara
- 主分类号： B24B1/00
- IPC分类号： B24B1/00 ; B24B7/22 ; B24B21/00 ; B24B21/04 ; B24B21/06 ; B24B27/00 ; B24B37/04 ; B24B41/047 ; B24B41/06 ; B24B49/10 ; B24B49/16 ; B24B53/007
摘要：
A chemical mechanical polishing apparatus includes a rotating plate on which a substrate is received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be varied to control the rate of material removed by the pad.
公开/授权文献
- US4936855A Stepped-lock ring system for implantable joint prostheses 公开/授权日：1990-06-26
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