公开(公告)号：US06783053B2

公开(公告)日：2004-08-31

申请号：US10360884

申请日：2003-02-07

申请人： Volker Boettinger ,  Karl-Heinz Hennig ,  Wolfgang Keller ,  Achim Maeutner ,  Hans Schikotanz ,  Roland Windheim

发明人： Volker Boettinger ,  Karl-Heinz Hennig ,  Wolfgang Keller ,  Achim Maeutner ,  Hans Schikotanz ,  Roland Windheim

IPC分类号： B23K3704

CPC分类号： B25B5/006 ,  B23K31/00 ,  B23K37/0443 ,  B23K2101/18 ,  B25B5/12

摘要： A clamping mechanism for locating sheet metal components includes a carrier plate and a clamping jaw swivel-mounted in relation to the carrier plate, the sheet metal components being clamped in contact areas between the carrier plate and the clamping jaw. The carrier plate is bolted to a support element, which is fixed to a base unit. Between the carrier plate and the support element there is an intermediate plate, which is positioned in relation to the carrier plate by a first set of locating pins and in relation to the support element by a second set of locating pins. The use of an intermediate plate with modified orientation of the locating pins may enable the carrier plate together with the component contact areas provided thereon to be displaced in relation to the support element.

公开(公告)号：US06634538B2

公开(公告)日：2003-10-21

申请号：US10021618

申请日：2001-12-11

申请人： Sven Evers ,  Craig T. Clyne

发明人： Sven Evers ,  Craig T. Clyne

IPC分类号： B23K3704

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

公开(公告)号：US06595401B2

公开(公告)日：2003-07-22

申请号：US09998669

申请日：2001-12-03

申请人： André-Claude-Félix Collot ,  Jean-Pierre Ferte

发明人： André-Claude-Félix Collot ,  Jean-Pierre Ferte

IPC分类号： B23K3704

CPC分类号： B23K20/1205 ,  B23K20/129 ,  B23K2101/001

摘要： A tool for holding a blade blank (1) comprises a frame (13) in which a control system using clamping jaws (18, 19) and lifters (30, 34, 35) grips the blade and holds it in position vertically on two supporting faces (22, 23), while the blade has been laid on three lateral faces (41, 42, 43). The blade is thus simultaneously held in a precise position and gripped sufficiently tightly, with a single control main mechanism. The mounting of the blade is thus greatly simplified and it may be subjected without further precaution to a manufacturing operation such as welding by friction to a rotor disk.

公开(公告)号：US06454153B2

公开(公告)日：2002-09-24

申请号：US09797725

申请日：2001-03-02

申请人： Michael Bettinger ,  Ronald W. Ellis ,  Tracy Reynolds

发明人： Michael Bettinger ,  Ronald W. Ellis ,  Tracy Reynolds

IPC分类号： B23K3704

CPC分类号： H01L24/85 ,  B23K2101/42 ,  H01L23/4951 ,  H01L23/49572 ,  H01L24/45 ,  H01L24/48 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/73215 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention encompasses a method of forming a semiconductor chip assembly. A substrate is provided. Such substrate has a pair of opposing surfaces and circuitry formed on one of the opposing surfaces. A semiconductor chip is joined to the substrate. The semiconductor chip has bonding regions thereon. A plurality of wires join to the circuitry and extend over the bonding regions of the semiconductor chip. The wires are pressed down to about the bonding regions of the semiconductor chip with a tool. The tool is lifted from the wires, and subsequently the wires are adhered to the bonding regions of the semiconductor chip. The invention also encompasses an apparatus for forming wire bonds from circuitry on a substrate to a semiconductor chip joined to the substrate. Such apparatus comprises a support for supporting the substrate and the semiconductor chip. The apparatus further comprises a pressing tool movably mounted relative to the substrate, and which has a deflecting surface configured to press the wires into a slit of the substrate when the pressing tool is moved toward the substrate. The deflecting surface is substantially planar, and has a sufficient length to extend within a predominate portion of the slit.

摘要翻译： 本发明包括形成半导体芯片组件的方法。 提供基板。 这种衬底具有一对相对表面和形成在相对表面之一上的电路。 将半导体芯片接合到基板。 半导体芯片具有接合区域。 多个导线连接到电路并在半导体芯片的接合区域上延伸。 用工具将电线压到半导体芯片的接合区域附近。 工具从电线上提起，随后电线粘附到半导体芯片的接合区域。 本发明还包括用于从衬底上的电路到连接到衬底的半导体芯片形成引线接合的装置。 这种设备包括用于支撑衬底和半导体芯片的支撑件。 该装置还包括一个相对于该基板可移动地安装的按压工具，该按压工具具有一个偏转表面，该偏转表面配置成当该按压工具朝该基板移动时将该电线按压到该基板的狭缝中。 偏转表面基本上是平面的，并且具有足够的长度以在狭缝的主要部分内延伸。

公开(公告)号：US06435495B1

公开(公告)日：2002-08-20

申请号：US09560753

申请日：2000-04-28

申请人： Kevin Alan Radbourne ,  Zdzislaw Leon Drewnicki ,  John Simon Eastham ,  Keith Vickery

发明人： Kevin Alan Radbourne ,  Zdzislaw Leon Drewnicki ,  John Simon Eastham ,  Keith Vickery

IPC分类号： B23K3704

CPC分类号： B23K37/0435

摘要： A back-up clamp component for use in a back-up clamp and adapted to fit with other sections of the back up clamp, the component carrying a number of shoes which can be moved radially inwardly and outwardly, each shoe being connected to a respective piston and cylinder arrangement, each piston having a first side and a second side, first means permitting pressurised fluid to be introduced to the first side of a piston and second means permitting pressurised fluid to be introduced to the second side of a piston so that the shoes can be positively driven outwardly and inwardly, the first means and the second means including respective first and second conduits within the body, which conduits open at an end face of the component.

摘要翻译： 一种用于备用夹具中的后备夹具部件，其适用于与后退夹具的其他部分相配合，该部件承载可径向向内和向外移动的多个鞋，每个鞋连接到相应的 活塞和气缸布置，每个活塞具有第一侧和第二侧，第一装置允许加压流体被引入到活塞的第一侧，第二装置允许加压流体被引入到活塞的第二侧，使得 鞋子可以被向外和向内驱动，第一装置和第二装置包括主体内的相应的第一和第二导管，该导管在部件的端面处开口。

公开(公告)号：US06318622B1

公开(公告)日：2001-11-20

申请号：US09567422

申请日：2000-05-09

申请人： Gregg A. Hollingsworth ,  Joseph Herbert Johnson

发明人： Gregg A. Hollingsworth ,  Joseph Herbert Johnson

IPC分类号： B23K3704

CPC分类号： H01L25/50 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/19041 ,  H05K1/142 ,  H05K1/144 ,  H01L2924/00014

摘要： The apparatus for assembly of high power hybrid modules including high power semiconductor chips and conventional surface mount technology (SMT) components are disclosed. The vacuum oven is used for creating the permanent electrical connection between each high power semiconductor chip and the high power hybrid module. The soldering reflow process is used to attach each SMT component to the high power hybrid module. The automated high power hybrid modules assembling process yields the high power hybrid modules with excellent thermal properties.

摘要翻译： 公开了用于组装包括大功率半导体芯片和常规表面贴装技术（SMT）组件的大功率混合模块的装置。 真空炉用于在每个大功率半导体芯片和大功率混合模块之间创建永久电连接。 焊接回流工艺用于将每个SMT组件连接到大功率混合模块。 自动化大功率混合模块组装过程产生具有优异热性能的大功率混合模块。

公开(公告)号：US06283355B1

公开(公告)日：2001-09-04

申请号：US09503748

申请日：2000-02-14

申请人： Edmund L. Ma ,  Christopher O. Lada ,  Donald H. Langhans

发明人： Edmund L. Ma ,  Christopher O. Lada ,  Donald H. Langhans

IPC分类号： B23K3704

CPC分类号： H01L21/68707

摘要： An end effector has a tower with non-stacked spatulas. Tolerance stacking is avoided by making grooves in the tower relative to a common reference surface, and mounting the spatulas in such grooves. The grooves are provided in separate planar walls of the tower. The walls intersect to enhance the structural properties of the tower. The tower has a dual-purpose clamp formed integrally with one wall for use in assembling the tower and the spatulas, and for mounting the completed end effector in a load lock. The spatula may carry a wafer during various operations, e.g., semiconductor processing, material deposition and etching systems, or in flat panel display processing systems. The carrying of the wafers is notwithstanding vibration of equipment for performing the manufacturing operations, which vibration is primarily in a range of frequencies. Each spatula is formed with a planar platform having an aperture formed therein such that the platform carrying the wafer has a resonant frequency dimensioned so that the resonant frequency while carrying the wafer is outside of the range of frequencies of the equipment vibration. Holes are provided around the aperture, and the spatula is provided with a pad for assembly with each of the holes. Each of the pads has a wafer support surface and a plurality of legs depending from the support surface. The legs are flexed to permit reception of the pad in one of the holes. Methods are disclosed for making the tower, the spatulas, and the end effector with these features.

摘要翻译： 末端执行器具有具有非堆叠刮刀的塔。 通过在塔中相对于公共参考表面形成凹槽并将刮刀安装在这种凹槽中来避免公差堆叠。 凹槽设置在塔的分开的平面壁中。 墙壁相交以增强塔的结构性能。 该塔具有与一个壁一体形成的双重用途的夹具，用于组装塔和刮铲，并将完整的末端执行器安装在装载锁中。 刮刀可以在各种操作（例如半导体处理，材料沉积和蚀刻系统）或平板显示处理系统中承载晶片。 尽管用于执行制造操作的设备的振动，晶片的携带也是如此，该振动主要在一定频率范围内。 每个刮刀形成有平面平台，其具有形成在其中的孔，使得承载晶片的平台具有谐振频率的尺寸，使得承载晶片的谐振频率在设备振动的频率范围之外。 孔设置在孔的周围，并且刮刀设置有用于与每个孔组装的垫。 每个焊盘具有晶片支撑表面和从支撑表面悬垂的多个支脚。 腿弯曲以允许在其中一个孔中接收垫。 公开了用于制造具有这些特征的塔，刮铲和末端执行器的方法。

公开(公告)号：US06267287B1

公开(公告)日：2001-07-31

申请号：US09358309

申请日：1999-07-21

申请人： Michael B. Ball

发明人： Michael B. Ball

IPC分类号： B23K3704

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/4825 ,  H01L21/67138 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

公开(公告)号：US06213376B1

公开(公告)日：2001-04-10

申请号：US09098828

申请日：1998-06-17

申请人： George C. Correia ,  John E. Cronin ,  Edmund J. Sprogis

发明人： George C. Correia ,  John E. Cronin ,  Edmund J. Sprogis

IPC分类号： B23K3704

CPC分类号： H01L21/6835 ,  B23K37/0408 ,  B23K2101/40 ,  H01L25/50 ,  H01L2221/68313 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/30105 ,  Y10T29/53978 ,  H01L2924/00014

摘要： An apparatus used for holding a first semiconductor device in proper alignment to a second semiconductor device, whose size is different from the first device, while performing a C4 bond between the two devices. The apparatus for holding the two devices in proper alignment consists of a holding fixture, which includes upper and lower pocket receptacles for receiving the semiconductor devices. The semiconductor devices are placed into the respective upper and lower slots aligned to two or more edges of the holding fixture.

摘要翻译： 一种用于在与两个装置之间执行C4键的同时保持尺寸与第一装置不同的第二半导体装置正确对准的装置。 用于将两个装置保持正确对准的装置包括保持夹具，其包括用于接收半导体装置的上部和下部口袋容器。 将半导体器件放置在与保持夹具的两个或更多个边缘对准的相应的上部和下部狭缝中。

公开(公告)号：US06715659B2

公开(公告)日：2004-04-06

申请号：US10191656

申请日：2002-07-08

申请人： Michael B. Ball

发明人： Michael B. Ball

IPC分类号： B23K3704

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/4825 ,  H01L21/67138 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An apparatus for supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

摘要翻译： 一种用于在引线接合过程中支撑引线指的装置，并且防止接合装置和夹紧组件向模具施加力。 本发明包括在引线接合过程中使用具有可定位在引线框架的引线的一部分下方的部分的可动臂，以提供引线指的增加的稳定性并防止接合装置和夹紧组件施加 对死亡的力量 本发明还提供了在引线接合过程期间将热量从热块直接转移到引线指。 本发明包括在引线接合过程中使用用于稳定引线指的夹具。