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    Component-embedded resin substrate
    1.
    发明授权
    Component-embedded resin substrate 有权
    部件嵌入式树脂基板

    公开(公告)号：US09241409B2

    公开(公告)日：2016-01-19

    申请号：US14255610

    申请日：2014-04-17

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yoshihito Otsubo

    IPC: H05K1/18 ,  H01L23/14 ,  H01L23/498 ,  H05K3/46

    CPC classification number: H05K1/185 ,  H01L23/145 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K3/4644 ,  H05K2201/041 ,  H05K2201/10431 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A component-embedded resin substrate includes a plurality of embedded components arranged as embedded in a resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a direction of the lamination, a first distance from the first embedded component to the closest end surface is shorter than a second distance from the second embedded component to the closest end surface. A first projection area calculated by multiplying a length along the end surface when the first embedded component is projected on the closest end surface to the first embedded component by a thickness of the first embedded component is smaller than a second projection area calculated by multiplying a length along the end surface when the second embedded component is projected on the closest end surface to the second embedded component by a thickness of the second embedded component.

    Abstract translation: 嵌入部件的树脂基板包括嵌入树脂结构中的多个嵌入部件。 多个嵌入式组件包括第一嵌入组件和第二嵌入组件。 当从层叠方向观察时，从第一嵌入部件到最近端面的第一距离短于从第二嵌入部件到最近端面的第二距离。 当第一嵌入部件在第一嵌入部件的最靠近的端面上投射第一嵌入部件的最小端面时，沿端面的长度乘以第一嵌入部件的厚度而计算出的第一投影面积小于通过将长度 当所述第二嵌入式部件以所述第二嵌入部件的厚度投影到所述第二嵌入部件的最近端面上时，沿着所述端面。

    COMPONENT-EMBEDDED RESIN SUBSTRATE
    2.
    发明申请
    COMPONENT-EMBEDDED RESIN SUBSTRATE 有权
    组分嵌入树脂基材

    公开(公告)号：US20140226288A1

    公开(公告)日：2014-08-14

    申请号：US14255610

    申请日：2014-04-17

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yoshihito Otsubo

    IPC: H05K1/18

    CPC classification number: H05K1/185 ,  H01L23/145 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K3/4644 ,  H05K2201/041 ,  H05K2201/10431 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: A component-embedded resin substrate includes a plurality of embedded components arranged as embedded in a resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a direction of the lamination, a first distance from the first embedded component to the closest end surface is shorter than a second distance from the second embedded component to the closest end surface. A first projection area calculated by multiplying a length along the end surface when the first embedded component is projected on the closest end surface to the first embedded component by a thickness of the first embedded component is smaller than a second projection area calculated by multiplying a length along the end surface when the second embedded component is projected on the closest end surface to the second embedded component by a thickness of the second embedded component.

    Abstract translation: 嵌入部件的树脂基板包括嵌入树脂结构中的多个嵌入部件。 多个嵌入式组件包括第一嵌入组件和第二嵌入组件。 当从层叠方向观察时，从第一嵌入部件到最近端面的第一距离短于从第二嵌入部件到最近端面的第二距离。 当第一嵌入部件在第一嵌入部件的最靠近的端面上投射第一嵌入部件的最小端面时，沿端面的长度乘以第一嵌入部件的厚度而计算出的第一投影面积小于通过将长度 当所述第二嵌入式部件通过所述第二嵌入部件的厚度投影到所述第二嵌入部件的最近端面时，沿着所述端面。

    RESIN-SEALED MODULE
    3.
    发明申请
    RESIN-SEALED MODULE 审中-公开
    树脂密封模块

    公开(公告)号：US20170048982A1

    公开(公告)日：2017-02-16

    申请号：US15336941

    申请日：2016-10-28

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shota ISHIHARA ,  Tetsuya ODA ,  Tatsunori KAN ,  Kenichi ATSUCHI

    IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H05K1/185 ,  H05K1/111 ,  H05K3/284 ,  H05K3/34 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10431 ,  H05K2201/10507 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/048 ,  H05K2203/1316 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.

    Abstract translation: 桥接部分12设置在安装部分11彼此相对的区域中，使得其朝向预定侧移位。 因此，即使桥接部12的线宽比现有技术中的线宽大，也可以在回流工序中适当地进行自对准现象。 因此，可以提供具有高树脂充电性能的树脂密封模块，并且包括电路基板，其中桥接部分12也不会破坏，即使根据较小尺寸的共同接地电极10的尺寸减小 电路部件5可靠地确保安装在电路基板上的多个电路部件5之间的充分的间隙。

    COMPONENT SUPPORT FOR DENSE CIRCUIT BOARD
    4.
    发明申请
    COMPONENT SUPPORT FOR DENSE CIRCUIT BOARD 有权
    电路板组件支持

    公开(公告)号：US20160270230A1

    公开(公告)日：2016-09-15

    申请号：US14644721

    申请日：2015-03-11

    Applicant: Raytheon Company

    Inventor： Dennis W. Mercier ,  Corey R. Delisle ,  Patrick J. Lott ,  Dimitry Zarkh

    IPC: H05K1/18 ,  F16M13/02 ,  H05K1/11

    CPC classification number: H05K1/184 ,  F16M13/02 ,  H01G2/06 ,  H01G4/228 ,  H01G4/38 ,  H01G9/26 ,  H01G11/10 ,  H01G11/76 ,  H05K1/11 ,  H05K1/115 ,  H05K1/181 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10431 ,  H05K2201/10606 ,  Y02E60/13

    Abstract: A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.

    Abstract translation: 提供了一种用于部件的支撑装置，其包括在基板的表面上的部件的占地面积内的完全一次性的外围的第一部分，具有可与部件粘合地连接的第一表面的第一部分，具有一次性接触的第二表面的第二部分 衬底的表面在离散的扇区中并且限定了一个孔，通过该孔，引线可以从部件和基板延伸出来，并且在从孔到周边的离散扇区之间延伸的通风口以及从第二表面突出设置的凸起 通孔限定在基板中。

    Attaching apparatus and attaching method
    5.
    发明授权
    Attaching apparatus and attaching method 有权

    公开(公告)号：US11934222B2

    公开(公告)日：2024-03-19

    申请号：US17772548

    申请日：2021-05-17

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Yonghong Zhou ,  Meiling Gao ,  Shengxing Zhang

    IPC: H05K1/18 ,  G06F1/16

    CPC classification number: G06F1/1607 ,  H05K1/189 ,  H05K2201/10431

    Abstract: The present disclosure relates to an attaching apparatus (2) and an attaching method. The attaching apparatus (2) includes: an auxiliary attaching structure having a protective film layer (20) and a support part (21), and the protective film layer (20) includes first areas (20a) and second areas (20b), each first area (20a) is configured to correspond to an installation area (10a), first sides of the first areas (20a) can be attached to body parts (13a) of rigid structural members on the installation areas (10a) corresponding to the first areas (20a) and receiving through holes (20c) or receiving recesses (20d) are formed at positions on the first areas (20a) corresponding to installation protrusions (13b), the second areas (20b) are configured to correspond to bending areas (10b); and a laminating jig (22) that can be located on a second side of the protective film layer (20).

    THREE-DIMENSIONAL PATTERNED MODULE EXTERIOR SURFACE FOR IMPROVED HEAT DISSIPATION AND METHOD OF FABRICATING
    6.
    发明公开
    THREE-DIMENSIONAL PATTERNED MODULE EXTERIOR SURFACE FOR IMPROVED HEAT DISSIPATION AND METHOD OF FABRICATING 审中-公开

    公开(公告)号：US20230180393A1

    公开(公告)日：2023-06-08

    申请号：US17989954

    申请日：2022-11-18

    Applicant: Qorvo US, Inc.

    Inventor： Loizos Loizou ,  Tobias Mangold ,  Andreas Link

    IPC: H05K3/28 ,  H05K1/18 ,  H05K3/30

    CPC classification number: H05K3/284 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/10431

    Abstract: A module includes a protective shield with a three-dimensional (3D) pattern to increase a rate of heat dissipation. As circuit components get smaller in size, more circuit components can fit into a module, thereby increasing heat density in the module. Some of the heat in a module is conducted through an overmold disposed on the circuit components. The heat conducted through the overmold then dissipates through an optional protective shield on an exterior surface of the overmold. A rate of heat dissipation depends on the surface area of the overmold and, if any, the protective shield. In an exemplary aspect, a 3D pattern is formed in the exterior surface of the overmold to increase the surface area to increase a rate of heat dissipation from the module. Improved heat dissipation improves performance and product life of the circuit components in the module.

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