公开(公告)号：US20170331454A1

公开(公告)日：2017-11-16

申请号：US15592319

申请日：2017-05-11

Applicant: Qorvo US, Inc.

Inventor： Aykut Cihangir ,  Andreas Link

IPC: H03H9/54 ,  H03F3/24 ,  H03F3/19 ,  H03H9/60

CPC classification number: H03H9/605 ,  H03F1/565 ,  H03F3/19 ,  H03F3/245 ,  H03F2200/171 ,  H03F2200/451 ,  H03H9/542 ,  H03H9/6483

Abstract: A circuit having a power amplifier port, an antenna port, and a ladder network coupled between the power amplifier and antenna ports is disclosed. The ladder network includes a proximal series acoustic resonator coupled to the power amplifier port, a distal series acoustic resonator coupled to the antenna port, and at least one series acoustic resonator coupled between the proximal series acoustic resonator and the distal series acoustic resonator. A first shunt acoustic resonator is coupled between a fixed voltage node and the proximal series acoustic resonator and the at least one series acoustic resonator. A second shunt acoustic resonator is coupled between the fixed voltage node and a second node to which the at least one series acoustic resonator is also coupled. A first inductor is coupled in parallel with the proximal series acoustic resonator to create notches below and above a passband of the ladder network.

公开(公告)号：US12245382B2

公开(公告)日：2025-03-04

申请号：US17989954

申请日：2022-11-18

Applicant: Qorvo US, Inc.

Inventor： Loizos Loizou ,  Tobias Mangold ,  Andreas Link

IPC: H05K3/28 ,  H05K1/18 ,  H05K3/30

Abstract: A module includes a protective shield with a three-dimensional (3D) pattern to increase a rate of heat dissipation. As circuit components get smaller in size, more circuit components can fit into a module, thereby increasing heat density in the module. Some of the heat in a module is conducted through an overmold disposed on the circuit components. The heat conducted through the overmold then dissipates through an optional protective shield on an exterior surface of the overmold. A rate of heat dissipation depends on the surface area of the overmold and, if any, the protective shield. In an exemplary aspect, a 3D pattern is formed in the exterior surface of the overmold to increase the surface area to increase a rate of heat dissipation from the module. Improved heat dissipation improves performance and product life of the circuit components in the module.

公开(公告)号：US20230180393A1

公开(公告)日：2023-06-08

申请号：US17989954

申请日：2022-11-18

Applicant: Qorvo US, Inc.

Inventor： Loizos Loizou ,  Tobias Mangold ,  Andreas Link

IPC: H05K3/28 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K3/284 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/10431

Abstract: A module includes a protective shield with a three-dimensional (3D) pattern to increase a rate of heat dissipation. As circuit components get smaller in size, more circuit components can fit into a module, thereby increasing heat density in the module. Some of the heat in a module is conducted through an overmold disposed on the circuit components. The heat conducted through the overmold then dissipates through an optional protective shield on an exterior surface of the overmold. A rate of heat dissipation depends on the surface area of the overmold and, if any, the protective shield. In an exemplary aspect, a 3D pattern is formed in the exterior surface of the overmold to increase the surface area to increase a rate of heat dissipation from the module. Improved heat dissipation improves performance and product life of the circuit components in the module.