知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.012 seconds)

    COAXIAL TRANSMISSION LINE STRUCTURE
    1.
    发明申请
    COAXIAL TRANSMISSION LINE STRUCTURE 审中-公开

    公开(公告)号：US20190035517A1

    公开(公告)日：2019-01-31

    申请号：US15663128

    申请日：2017-07-28

    Applicant: Raytheon Company

    Inventor： Angelo M. Puzella ,  Lance A. Auer ,  Norman Armendariz ,  Donald A. Bozza ,  John B. Francis ,  Philip M. Henault ,  Randal W. Oberle ,  Susan C. Trulli ,  Dimitry Zarkh

    IPC: H01B11/20 ,  H01B11/18

    Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center, and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.

    COMPONENT SUPPORT FOR DENSE CIRCUIT BOARD
    2.
    发明申请
    COMPONENT SUPPORT FOR DENSE CIRCUIT BOARD 有权
    电路板组件支持

    公开(公告)号：US20160270230A1

    公开(公告)日：2016-09-15

    申请号：US14644721

    申请日：2015-03-11

    Applicant: Raytheon Company

    Inventor： Dennis W. Mercier ,  Corey R. Delisle ,  Patrick J. Lott ,  Dimitry Zarkh

    IPC: H05K1/18 ,  F16M13/02 ,  H05K1/11

    CPC classification number: H05K1/184 ,  F16M13/02 ,  H01G2/06 ,  H01G4/228 ,  H01G4/38 ,  H01G9/26 ,  H01G11/10 ,  H01G11/76 ,  H05K1/11 ,  H05K1/115 ,  H05K1/181 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10431 ,  H05K2201/10606 ,  Y02E60/13

    Abstract: A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.

    Abstract translation: 提供了一种用于部件的支撑装置，其包括在基板的表面上的部件的占地面积内的完全一次性的外围的第一部分，具有可与部件粘合地连接的第一表面的第一部分，具有一次性接触的第二表面的第二部分 衬底的表面在离散的扇区中并且限定了一个孔，通过该孔，引线可以从部件和基板延伸出来，并且在从孔到周边的离散扇区之间延伸的通风口以及从第二表面突出设置的凸起 通孔限定在基板中。

    Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones
    3.
    发明授权
    Tailored coldplate geometries for forming multiple coefficient of thermal expansion (CTE) zones 有权

    公开(公告)号：US11032947B1

    公开(公告)日：2021-06-08

    申请号：US16792681

    申请日：2020-02-17

    Applicant: Raytheon Company

    Inventor： Craig H. McCordic ,  Joseph R. Ellsworth ,  Todd E. Southard ,  Ethan S. Heinrich ,  Dimitry Zarkh

    IPC: H05K7/20 ,  H01L23/373 ,  H01L23/367 ,  H05K1/02 ,  H01L25/07 ,  H01L25/065

    Abstract: An apparatus includes a coldplate configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The coldplate includes (i) first and second outer layers having at least one first material and (ii) a third layer embedded in the outer layers and having at least one second material. The first and second materials have different coefficients of thermal expansion (CTEs). The third layer is embedded non-uniformly in the outer layers so that different zones of the coldplate have different local CTEs. The third layer may include openings extending through the second material(s), and projections of the first material(s) from at least one of the first and second outer layers may partially or completely fill the openings. The first and second outer layers may include aluminum or an aluminum alloy, and the third layer may include aluminum silicon carbide or thermal pyrolytic graphite.

    Low profile, nesting capacitor collars
    5.
    发明授权
    Low profile, nesting capacitor collars 有权

    公开(公告)号：US10716232B2

    公开(公告)日：2020-07-14

    申请号：US16109519

    申请日：2018-08-22

    Applicant: Raytheon Company

    Inventor： Derek B. Wells ,  Kenneth P. Walsh, Jr. ,  Gregory S. Renaud ,  Dimitry Zarkh

    IPC: H05K7/14 ,  H05K1/18 ,  H05K3/32

    Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component (e.g., capacitor) of an electronics assembly, and a radial retention component supported about an inner surface (e.g., annular groove) of the opening of the collar body. The radial retention component (e.g., elastomeric O-ring) is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board. Associated systems and methods are provided.

    Low Profile, Nesting Capacitor Collars
    6.
    发明申请
    Low Profile, Nesting Capacitor Collars 审中-公开

    公开(公告)号：US20200068738A1

    公开(公告)日：2020-02-27

    申请号：US16109519

    申请日：2018-08-22

    Applicant: Raytheon Company

    Inventor： Derek B. Wells ,  Kenneth P. Walsh, JR. ,  Gregory S. Renaud ,  Dimitry Zarkh

    IPC: H05K7/14 ,  H05K1/18 ,  H05K3/32

    Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component (e.g., capacitor) of an electronics assembly, and a radial retention component supported about an inner surface (e.g., annular groove) of the opening of the collar body. The radial retention component (e.g., elastomeric O-ring) is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board. Associated systems and methods are provided.

Patent Agency Ranking