公开(公告)号：US20240080986A1

公开(公告)日：2024-03-07

申请号：US18450701

申请日：2023-08-16

Applicant: Apple Inc.

Inventor： David A. Karol ,  Yaodong Wang ,  Obinna O. Onyemepu ,  Zhong J. Ma ,  Harshavardhan Reddy Abbeydoddi Bolla ,  Robert Hrabchak

IPC: H05K1/18 ,  H05K3/00

CPC classification number: H05K1/181 ,  H05K3/0011 ,  H05K2201/10015 ,  H05K2201/10151 ,  H05K2201/10431

Abstract: The present disclosure relates to a contaminant shield system. The contaminant shield system may surround an electronic device, such as a local oscillator (e.g., a crystal oscillator), to prevent contamination of the electronic device via coupling material (e.g., under-fill material) creep or wicking. The contaminant shield system includes multiple walls and at least one wall includes a pick-and-place feature that facilitates positioning of the contaminant shield system during assembly of a circuit board that includes the contaminant shield system.

公开(公告)号：US11838432B2

公开(公告)日：2023-12-05

申请号：US17068619

申请日：2020-10-12

Applicant: Apple Inc.

Inventor： Bryan D. Keen ,  Devon A. Monaco ,  Sherry Lee ,  Ihtesham H. Chowdhury ,  Eric N. Nyland ,  Matthew D. Hill ,  Arun R. Varma ,  Lucy E. Browning ,  Sawyer I. Cohen ,  Benjamin J. Pope ,  Abhishek Choudhury ,  James W. Bilanski ,  Yaodong Wang ,  Daniel J. Morizio ,  Nicholas W. Ruhter ,  David A. Karol ,  Sean M. Gordoni

IPC: H05K1/18 ,  H04M1/02 ,  H05K1/11 ,  H05K5/00 ,  G06F1/16 ,  H05K5/02

CPC classification number: H04M1/0206 ,  G06F1/1637 ,  G06F1/1686 ,  H04M1/026 ,  H04M1/0264 ,  H04M1/0266 ,  H05K1/115 ,  H05K1/118 ,  H05K1/189 ,  H05K5/0047 ,  H05K5/0086 ,  H05K5/0217 ,  H04M2201/38

Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.