公开(公告)号：US20230224388A1

公开(公告)日：2023-07-13

申请号：US17903893

申请日：2022-09-06

Applicant: Apple Inc.

Inventor： Eric W. Bates ,  Arun R. Varma ,  Benjamin J. Pope ,  Griffin L. Schmitt ,  Zonghao Liu ,  Michael W. Firka ,  Christopher J. Durning ,  Douglas G. Fournier ,  Yaocheng Zhang

IPC: H04M1/02 ,  G06V40/16

CPC classification number: H04M1/0264 ,  G06V40/166 ,  G06V40/168 ,  G06V40/172 ,  H04M1/0266 ,  H04M1/0262 ,  H04M1/0277

Abstract: A mobile phone may include a display, wireless communication circuitry, a battery, and an enclosure enclosing the display, the wireless communication circuitry, and the battery. The enclosure may include a front cover formed from a transparent material and defining a front exterior surface of the mobile phone, a rear cover formed from a glass material and defining a rear exterior surface of the mobile phone, and a first housing component including a first wall section defining a first side exterior surface of the mobile phone, a second wall section defining a second side exterior surface opposite to the first side exterior surface, and a mid-chassis section extending between the first wall section and the second wall section.

公开(公告)号：US20210168226A1

公开(公告)日：2021-06-03

申请号：US17068619

申请日：2020-10-12

Applicant: Apple Inc.

Inventor： Bryan D. Keen ,  Devon A. Monaco ,  Sherry Lee ,  Ihtesham H. Chowdhury ,  Eric N. Nyland ,  Matthew D. Hill ,  Arun R. Varma ,  Lucy E. Browning ,  Sawyer I. Cohen ,  Benjamin J. Pope

IPC: H04M1/02 ,  H05K1/11 ,  H05K5/00

Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

公开(公告)号：US12009576B2

公开(公告)日：2024-06-11

申请号：US17068541

申请日：2020-10-12

Applicant: Apple Inc.

Inventor： Arun R. Varma ,  David Hurrell ,  Eric N. Nyland ,  Ihtesham H. Chowdhury ,  Jennifer M. Edwards ,  Matthew D. Hill ,  Benjamin J. Kallman ,  Trent Canales ,  Daniel C. Wagman ,  Bilgehan Avser ,  Elisabeth Lang

IPC: H01Q21/24 ,  H01Q1/24 ,  H01Q1/38

CPC classification number: H01Q1/243 ,  H01Q1/38

Abstract: A mobile phone includes a housing structure, the housing structure defining a side surface of the mobile phone, a front cover coupled to the housing structure and defining a front surface of the mobile phone, a rear cover coupled to the housing structure and defining a rear surface of the mobile phone, a display positioned below the front cover, a first directional antenna defining a first radiation pattern extending through the front surface of the mobile phone, a second directional antenna defining a second radiation pattern extending through the rear surface of the mobile phone, and a third directional antenna defining a third radiation pattern extending through the side surface of the mobile phone.

公开(公告)号：US20210167487A1

公开(公告)日：2021-06-03

申请号：US17068541

申请日：2020-10-12

Applicant: Apple Inc.

Inventor： Arun R. Varma ,  David Hurrell ,  Eric N. Nyland ,  Ihtesham H. Chowdhury ,  Jennifer M. Edwards ,  Matthew D. Hill ,  Benjamin J. Kallman ,  Trent Canales ,  Daniel C. Wagman ,  Bilgehan Avser ,  Elisabeth Lang

IPC: H01Q1/24 ,  H01Q1/38

Abstract: A mobile phone includes a housing structure, the housing structure defining a side surface of the mobile phone, a front cover coupled to the housing structure and defining a front surface of the mobile phone, a rear cover coupled to the housing structure and defining a rear surface of the mobile phone, a display positioned below the front cover, a first directional antenna defining a first radiation pattern extending through the front surface of the mobile phone, a second directional antenna defining a second radiation pattern extending through the rear surface of the mobile phone, and a third directional antenna defining a third radiation pattern extending through the side surface of the mobile phone.

公开(公告)号：US11515679B2

公开(公告)日：2022-11-29

申请号：US17092022

申请日：2020-11-06

Applicant: Apple Inc.

Inventor： Matthew A. Lashinsky ,  Arun R. Varma ,  Cesar Lozano Villarreal ,  Mathieu P. Roy ,  Balal Khan ,  Johnathan D. Simeroth

IPC: H01R31/06 ,  H05K1/18 ,  H01R13/504 ,  H05K5/00 ,  H01R12/72

Abstract: A power adapter for powering portable electronic devices is disclosed. The modifications and enhancements to the power adapter can reduce or eliminate the need for adhesives, flexible circuitry, and/or wiring. The power adapter includes multiple guide rails used to guide a circuit board (carrying components) to electrical springs. The electrical springs provide not only an electrical coupling, but also a mechanical coupling. As a result, wiring and/or adhesives is not required. Additionally, a cap is secured to the enclosure through melting part of the cap by, for example, ultrasonic welding without causing damage to the circuit board, as welding location(s) is/are in locations away from the electrical springs and other sensitive components. The power adapter further includes a connector connected to the circuit board. During assembly, the circuit board can pivot in three dimensions during assembly to align the connector with the cap.

公开(公告)号：US10283898B2

公开(公告)日：2019-05-07

申请号：US15974185

申请日：2018-05-08

Applicant: Apple Inc.

Inventor： Ross C. Heyman ,  Alfredo Castillo ,  Arun R. Varma

IPC: H05K7/02 ,  H05K7/04 ,  H01R13/504 ,  H05K5/02 ,  H01R31/06 ,  B29D99/00 ,  H02M7/00

Abstract: An enclosure for an AC to DC adapter has a continuous and apparently monolithic exterior appearance. The enclosure includes a housing and a cap that are joined together by one or more weld joints. The weld joints create flash on the exterior surface of the enclosure and the flash is removed by forming a chamfer along the weld joint such that it removes a portion of the housing and the cap.

公开(公告)号：US11838432B2

公开(公告)日：2023-12-05

申请号：US17068619

申请日：2020-10-12

Applicant: Apple Inc.

Inventor： Bryan D. Keen ,  Devon A. Monaco ,  Sherry Lee ,  Ihtesham H. Chowdhury ,  Eric N. Nyland ,  Matthew D. Hill ,  Arun R. Varma ,  Lucy E. Browning ,  Sawyer I. Cohen ,  Benjamin J. Pope ,  Abhishek Choudhury ,  James W. Bilanski ,  Yaodong Wang ,  Daniel J. Morizio ,  Nicholas W. Ruhter ,  David A. Karol ,  Sean M. Gordoni

IPC: H05K1/18 ,  H04M1/02 ,  H05K1/11 ,  H05K5/00 ,  G06F1/16 ,  H05K5/02

CPC classification number: H04M1/0206 ,  G06F1/1637 ,  G06F1/1686 ,  H04M1/026 ,  H04M1/0264 ,  H04M1/0266 ,  H05K1/115 ,  H05K1/118 ,  H05K1/189 ,  H05K5/0047 ,  H05K5/0086 ,  H05K5/0217 ,  H04M2201/38

Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

公开(公告)号：US20230221782A1

公开(公告)日：2023-07-13

申请号：US17903963

申请日：2022-09-06

Applicant: Apple Inc.

Inventor： David A. Hurrell ,  Gregory N. Stephens ,  Isabel Yang ,  John J. Baker ,  Sherry Lee ,  Matthew D. Hill ,  Obinna Onyemepu ,  Douglas G. Fournier ,  Benjamin J. Pope ,  Michael W. Firka ,  Griffin L. Schmitt ,  Arun R. Varma ,  Robert Hrabchak

IPC: G06F1/20 ,  H05K7/20 ,  H04M1/02

CPC classification number: G06F1/203 ,  H05K7/20481 ,  H05K7/205 ,  H04M1/0202

Abstract: A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.

公开(公告)号：US20190081431A1

公开(公告)日：2019-03-14

申请号：US15974185

申请日：2018-05-08

Applicant: Apple Inc.

Inventor： Ross C. Heyman ,  Alfredo Castillo ,  Arun R. Varma

IPC: H01R13/504 ,  H05K5/02 ,  H01R31/06

Abstract: An enclosure for an AC to DC adapter has a continuous and apparently monolithic exterior appearance. The enclosure includes a housing and a cap that are joined together by one or more weld joints. The weld joints create flash on the exterior surface of the enclosure and the flash is removed by forming a chamfer along the weld joint such that it removes a portion of the housing and the cap.