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1.发明申请公开(公告)号：US20150070864A1
公开(公告)日：2015-03-12
申请号：US14020059
申请日：2013-09-06
Applicant: Apple Inc.
Inventor： Amanda R. Rainer , Connor R. Duke , James W. Bilanski , Jeffrey M. Thoma , Michael Eng , Mingzhe Li , Sung Woo Yoo , Miguel Alejandro Lara-Pena , Weng Choy Foo , Kieran Poulain
IPC: H01L23/29 , H01L25/065 , H05K1/03 , H01L21/56
CPC classification number: H05K1/0393 , H01L21/563 , H01L25/0655 , H01L2224/73204 , H05K1/181 , H05K3/284 , H05K2201/0133 , H05K2201/10015 , H05K2201/10977 , H05K2201/2045 , H05K2203/0126 , H05K2203/304
Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.
Abstract translation: 电子设备可以设置有集成电路和电气部件，例如电焊接到印刷电路板的电容器。 诸如密封剂和底部填充材料的液体聚合物粘合剂可以沉积在印刷电路上。 诸如电容器的电气部件可以用密封剂涂覆。 底部填充物可以沉积在集成电路附近，使得底部填充物吸入集成电路和印刷电路板之间的间隙中。 密封剂可能比底部填充剂更粘稠，因此可以防止流动的底部填充物到达电气部件。 一些密封剂可以位于电气部件和印刷电路板之间。 密封剂可以被固化以形成覆盖电气部件的弹性材料，其有助于阻止振动。 弹性材料的硬度可能低于底部填充物。
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公开(公告)号：US11838432B2
公开(公告)日：2023-12-05
申请号：US17068619
申请日：2020-10-12
Applicant: Apple Inc.
Inventor： Bryan D. Keen , Devon A. Monaco , Sherry Lee , Ihtesham H. Chowdhury , Eric N. Nyland , Matthew D. Hill , Arun R. Varma , Lucy E. Browning , Sawyer I. Cohen , Benjamin J. Pope , Abhishek Choudhury , James W. Bilanski , Yaodong Wang , Daniel J. Morizio , Nicholas W. Ruhter , David A. Karol , Sean M. Gordoni
CPC classification number: H04M1/0206 , G06F1/1637 , G06F1/1686 , H04M1/026 , H04M1/0264 , H04M1/0266 , H05K1/115 , H05K1/118 , H05K1/189 , H05K5/0047 , H05K5/0086 , H05K5/0217 , H04M2201/38
Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.
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3.发明授权Electronic device with printed circuit board noise reduction using elastomeric damming and damping structures 有权具有印刷电路板降噪的电子设备使用弹性阻尼和阻尼结构公开(公告)号：US09596756B2
公开(公告)日：2017-03-14
申请号：US14020059
申请日：2013-09-06
Applicant: Apple Inc.
Inventor： Amanda R. Rainer , Connor R. Duke , James W. Bilanski , Jeffrey M. Thoma , Michael Eng , Mingzhe Li , Sung Woo Yoo , Miguel Alejandro Lara-Pena , Weng Choy Foo , Kieran Poulain
IPC: H05K1/03 , H01L21/56 , H05K3/28 , H01L25/065 , H05K1/18
CPC classification number: H05K1/0393 , H01L21/563 , H01L25/0655 , H01L2224/73204 , H05K1/181 , H05K3/284 , H05K2201/0133 , H05K2201/10015 , H05K2201/10977 , H05K2201/2045 , H05K2203/0126 , H05K2203/304
Abstract: An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.
Abstract translation: 电子设备可以设置有集成电路和电气部件，例如电焊接到印刷电路板的电容器。 诸如密封剂和底部填充材料的液体聚合物粘合剂可以沉积在印刷电路上。 诸如电容器的电气部件可以用密封剂涂覆。 底部填充物可以沉积在集成电路附近，使得底部填充物吸入集成电路和印刷电路板之间的间隙中。 密封剂可能比底部填充剂更粘稠，因此可以防止流动的底部填充物到达电气部件。 一些密封剂可以位于电气部件和印刷电路板之间。 密封剂可以被固化以形成覆盖电气部件的弹性材料，其有助于阻止振动。 弹性材料的硬度可能低于底部填充物。
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