公开(公告)号：US20110186960A1

公开(公告)日：2011-08-04

申请号：US13007059

申请日：2011-01-14

申请人： Albert Wu ,  Roawen Chen ,  Chung Chyung Han ,  Shiann-Ming Liou ,  Chien-Chuan Wei ,  Runzi Chang ,  Scott Wu ,  Chuan-Cheng Cheng

发明人： Albert Wu ,  Roawen Chen ,  Chung Chyung Han ,  Shiann-Ming Liou ,  Chien-Chuan Wei ,  Runzi Chang ,  Scott Wu ,  Chuan-Cheng Cheng

IPC分类号： H01L27/04 ,  H01L23/488 ,  H01L21/60 ,  H01L21/98

CPC分类号： H01L25/04 ,  H01L21/486 ,  H01L21/565 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13024 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/83904 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure provide a method comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, electrically coupling one or more dies to the redistribution layer, forming a molding compound on the semiconductor substrate, recessing the second surface of the semiconductor substrate, forming one or more channels through the recessed second surface of the semiconductor substrate to expose the redistribution layer; and forming one or more package interconnect structures in the one or more channels, the one or more package interconnect structures being electrically coupled to the redistribution layer, the one or more package interconnect structures to route electrical signals of the one or more dies. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例提供了一种方法，包括提供具有（i）第一表面和（ii）与第一表面相对设置的第二表面的半导体衬底，在半导体衬底的第一表面上形成电介质膜，形成 电介质膜上的再分配层，将一个或多个管芯电耦合到再分布层，在半导体衬底上形成模制化合物，使半导体衬底的第二表面凹陷，通过半导体的凹陷的第二表面形成一个或多个沟道 衬底以暴露再分布层; 以及在所述一个或多个通道中形成一个或多个封装互连结构，所述一个或多个封装互连结构电耦合到所述再分布层，所述一个或多个封装互连结构用于布置所述一个或多个管芯的电信号。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20080315389A1

公开(公告)日：2008-12-25

申请号：US12095155

申请日：2006-11-29

申请人： Wayne Nunn

发明人： Wayne Nunn

IPC分类号： H01L23/48 ,  H01L21/66

CPC分类号： H01L23/49827 ,  H01L23/3121 ,  H01L24/72 ,  H01L24/83 ,  H01L24/90 ,  H01L24/91 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73251 ,  H01L2224/83901 ,  H01L2224/83904 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2224/72 ,  H01L2224/32

摘要： Consistent with an example embodiment, an integrated circuit device (IC) is assembled on a package substrate and encapsulated in a molding compound. There is a semiconductor die having a circuit pattern with contact pads. A package substrate having bump pad landings corresponding to the contact pads of the circuit pattern, has an interposer layer sandwiched between them. The interposer layer includes randomly distributed mutually isolated conductive columns of spherical particles embedded in an elastomeric material, wherein the interposer layer is subjected to a compressive force from pressure exerted upon an underside surface of the semiconductor die. The compressive force deforms the interposer layer causing the conductive columns of spherical particles to electrically connect the contact pads of the circuit pattern with the corresponding bump pad landings of the package substrate. The compressive force may be obtained from forces generated by thermal expansion properties of the molding compound and package substrate, metal clips or combinations, thereof.

摘要翻译： 与示例性实施例一致，将集成电路器件（IC）组装在封装衬底上并封装在模塑料中。 存在具有接触焊盘的电路图案的半导体管芯。 具有与电路图案的接触焊盘相对应的凸块焊盘平台的封装基板具有夹在它们之间的插入层。 插入层包括嵌入弹性体材料中的随机分布的球形颗粒的相互隔离的导电柱，其中插入层受到施加在半导体管芯的下表面上的压力的压缩力。 压缩力使插入层变形，导致球形颗粒的导电柱将电路图案的接触焊盘与封装衬底的相应凸块焊盘着地电连接。 压缩力可以通过由模制化合物和封装衬底，金属夹或其组合的热膨胀特性产生的力获得。

公开(公告)号：US20160155732A1

公开(公告)日：2016-06-02

申请号：US15017397

申请日：2016-02-05

申请人： Marvell World Trade Ltd.

发明人： Albert Wu ,  Roawen Chen ,  Chung Chyung (Justin) Han ,  Shiann-Ming Liou ,  Chien-Chuan Wei ,  Runzi Chang ,  Scott Wu ,  Chuan-Cheng Cheng

IPC分类号： H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065 ,  H01L23/498 ,  H01L21/768 ,  H01L23/00

CPC分类号： H01L25/04 ,  H01L21/486 ,  H01L21/565 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13024 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/83904 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例提供了一种装置，包括具有第一表面的半导体衬底，与第一表面相对设置的第二表面，其中第一表面的至少一部分被凹入以形成半导体衬底的凹陷区域， 以及形成在半导体衬底的凹陷区域中以在半导体衬底的第一表面和第二表面之间提供电或热路径的一个或多个通孔，以及耦合到半导体衬底的管芯，该管芯电耦合到 形成在半导体衬底的凹陷区域中的一个或多个通孔。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20140363924A1

公开(公告)日：2014-12-11

申请号：US14466541

申请日：2014-08-22

申请人： TESSERA, INC.

发明人： Belgacem Haba

IPC分类号： H01L23/00 ,  H01L23/64 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/64 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/04026 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/056 ,  H01L2224/24145 ,  H01L2224/24155 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/83904 ,  H01L2224/85207 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic assembly may include microelectronic devices arranged in a stack and having device contacts exposed at respective front surfaces. Signal conductors having substantial portions extending above the front surface of the respective microelectronic devices connect the device contacts with signal contacts of an underlying interconnection element. A rear surface of a microelectronic device of the stack overlying an adjacent microelectronic device of the stack is spaced a predetermined distance above and extends at least generally parallel to the substantial portions of the signal conductors connected to the adjacent device, such that a desired impedance may be achieved for the signal conductors connected to the adjacent device.

摘要翻译： 微电子组件可以包括布置在堆叠中的微电子器件，并且具有在相应的前表面处暴露的器件触点。 具有在相应的微电子器件的前表面之上延伸的实质部分的信号导体将器件触点与底层互连元件的信号触点相连接。 覆盖堆叠的相邻微电子器件的堆叠的微电子器件的后表面在上方隔开预定距离并且至少大致平行于连接到相邻器件的信号导体的实质部分延伸，使得期望的阻抗可以 可以实现连接到相邻设备的信号导体。

公开(公告)号：US20140124961A1

公开(公告)日：2014-05-08

申请号：US14153892

申请日：2014-01-13

申请人： Marvell World Trade Ltd.

发明人： Albert WU ,  Roawen Chen ,  Chung Chyung Han ,  Shiann-Ming Liou ,  Chien-Chuan Wei ,  Runzi Chang ,  Scott Wu ,  Chuan-Cheng Cheng

IPC分类号： H01L25/04

CPC分类号： H01L25/04 ,  H01L21/486 ,  H01L21/565 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13024 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/83904 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure provide a method comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, electrically coupling one or more dies to the redistribution layer, forming a molding compound on the semiconductor substrate, recessing the second surface of the semiconductor substrate, forming one or more channels through the recessed second surface of the semiconductor substrate to expose the redistribution layer; and forming one or more package interconnect structures in the one or more channels, the one or more package interconnect structures being electrically coupled to the redistribution layer, the one or more package interconnect structures to route electrical signals of the one or more dies. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例提供了一种方法，包括提供具有（i）第一表面和（ii）与第一表面相对设置的第二表面的半导体衬底，在半导体衬底的第一表面上形成电介质膜，形成 电介质膜上的再分配层，将一个或多个管芯电耦合到再分布层，在半导体衬底上形成模制化合物，使半导体衬底的第二表面凹陷，通过半导体的凹陷的第二表面形成一个或多个沟道 衬底以暴露再分布层; 以及在所述一个或多个通道中形成一个或多个封装互连结构，所述一个或多个封装互连结构电耦合到所述再分布层，所述一个或多个封装互连结构用于布置所述一个或多个管芯的电信号。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09768144B2

公开(公告)日：2017-09-19

申请号：US15017397

申请日：2016-02-05

申请人： Marvell World Trade Ltd.

发明人： Albert Wu ,  Roawen Chen ,  Chung Chyung (Justin) Han ,  Shiann-Ming Liou ,  Chien-Chuan Wei ,  Runzi Chang ,  Scott Wu ,  Chuan-Cheng Cheng

IPC分类号： H01L25/04 ,  H01L21/48 ,  H01L23/13 ,  H01L23/14 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/367 ,  H01L23/00

CPC分类号： H01L25/04 ,  H01L21/486 ,  H01L21/565 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13024 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/83904 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed.

公开(公告)号：US08853708B2

公开(公告)日：2014-10-07

申请号：US12883612

申请日：2010-09-16

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L23/48 ,  H01L21/50 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L24/83 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/64 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/04026 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/056 ,  H01L2224/24145 ,  H01L2224/24155 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/83904 ,  H01L2224/85207 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic assembly may include microelectronic devices arranged in a stack and having device contacts exposed at respective front surfaces. Signal conductors having substantial portions extending above the front surface of the respective microelectronic devices connect the device contacts with signal contacts of an underlying interconnection element. A rear surface of a microelectronic device of the stack overlying an adjacent microelectronic device of the stack is spaced a predetermined distance above and extends at least generally parallel to the substantial portions of the signal conductors connected to the adjacent device, such that a desired impedance may be achieved for the signal conductors connected to the adjacent device.

摘要翻译： 微电子组件可以包括布置在堆叠中的微电子器件，并且具有在相应的前表面处暴露的器件触点。 具有在相应的微电子器件的前表面之上延伸的实质部分的信号导体将器件触点与底层互连元件的信号触点相连接。 覆盖堆叠的相邻微电子器件的堆叠的微电子器件的后表面在上方隔开预定距离并且至少大致平行于连接到相邻器件的信号导体的基本部分延伸，使得期望的阻抗可以 可以实现连接到相邻设备的信号导体。

公开(公告)号：US20120068361A1

公开(公告)日：2012-03-22

申请号：US12883612

申请日：2010-09-16

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/83 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/64 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/04026 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/056 ,  H01L2224/24145 ,  H01L2224/24155 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/83904 ,  H01L2224/85207 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic assembly may include microelectronic devices arranged in a stack and having device contacts exposed at respective front surfaces. Signal conductors having substantial portions extending above the front surface of the respective microelectronic devices connect the device contacts with signal contacts of an underlying interconnection element. A rear surface of a microelectronic device of the stack overlying an adjacent microelectronic device of the stack is spaced a predetermined distance above and extends at least generally parallel to the substantial portions of the signal conductors connected to the adjacent device, such that a desired impedance may be achieved for the signal conductors connected to the adjacent device.

摘要翻译： 微电子组件可以包括布置在堆叠中的微电子器件，并且具有在相应的前表面处暴露的器件触点。 具有在相应的微电子器件的前表面之上延伸的实质部分的信号导体将器件触点与底层互连元件的信号触点相连接。 覆盖堆叠的相邻微电子器件的堆叠的微电子器件的后表面在上方隔开预定距离并且至少大致平行于连接到相邻器件的信号导体的基本部分延伸，使得期望的阻抗可以 可以实现连接到相邻设备的信号导体。

公开(公告)号：US20110186998A1

公开(公告)日：2011-08-04

申请号：US13012644

申请日：2011-01-24

申请人： Albert Wu ,  Roawen Chen ,  Chung Chyung Han ,  Shiann-Ming Liou ,  Chien-Chuan Wei ,  Runzi Chang ,  Scott Wu ,  Chuan-Cheng Cheng

发明人： Albert Wu ,  Roawen Chen ,  Chung Chyung Han ,  Shiann-Ming Liou ,  Chien-Chuan Wei ,  Runzi Chang ,  Scott Wu ,  Chuan-Cheng Cheng

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L25/04 ,  H01L21/486 ,  H01L21/565 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13024 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/83904 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例提供了一种装置，包括具有第一表面的半导体衬底，与第一表面相对设置的第二表面，其中第一表面的至少一部分被凹入以形成半导体衬底的凹陷区域， 以及形成在半导体衬底的凹陷区域中以在半导体衬底的第一表面和第二表面之间提供电或热路径的一个或多个通孔以及耦合到半导体衬底的管芯，该管芯电耦合到 形成在半导体衬底的凹陷区域中的一个或多个通孔。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09391045B2

公开(公告)日：2016-07-12

申请号：US14715170

申请日：2015-05-18

申请人： Marvell World Trade Ltd.

发明人： Albert Wu ,  Roawen Chen ,  Chung Chyung (Justin) Han ,  Shiann-Ming Liou ,  Chien-Chuan Wei ,  Runzi Chang ,  Scott Wu ,  Chuan-Cheng Cheng

IPC分类号： H01L21/00 ,  H01L25/04 ,  H01L21/48 ,  H01L23/13 ,  H01L23/14 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/367 ,  H01L23/00

CPC分类号： H01L25/04 ,  H01L21/486 ,  H01L21/565 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13024 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/83904 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure provide a method, comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming one or more vias in the first surface of the semiconductor substrate, the one or more vias initially passing through only a portion of the semiconductor substrate without reaching the second surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, the redistribution layer being electrically coupled to the one or more vias, coupling one or more dies to the redistribution layer, forming a molding compound to encapsulate at least a portion of the one or more dies, and recessing the second surface of the semiconductor substrate to expose the one or more vias. Other embodiments may be described and/or claimed.