Abstract:
The present disclosure generally relates to semiconductor structures and, more particularly, to intelligent through silicon via sharing in 3D-IC integrated structures and methods of manufacture. The structure includes: a plurality of stacked dies each containing at least one macro device; and a layer structure positioned between the plurality of stacked dies which comprises a control structured to route signals between the at least one macro device of a first stacked die and the at least one macro device of a second stacked die of the plurality of stacked dies.
Abstract:
A superconducting fault-tolerant programmable read-only memory (SFT-PROM) cell stores information in the phases of superconducting wires in a Josephson array. The information is addressable and retrievable in a fault-tolerant manner due to the non local nature of the information stored. The coding and decoding process is content-addressable and parallel due to the multitude of interconnections, resulting in picosecond data access time. The SFT-PROM cell comprises superposed WRITE/READ arrays and a reset circuit that ensures multiple non-destructive read-out of data.
Abstract:
A superconducting learning matrix in which the coupling cells at the matrix intersections include a write cryotron controlled by the row lines for activating the storage cells, and a coupling cryotron for coupling the column lines either to the row lines or word recognition lines for reading out of the cell. The storage cells are activated according to a geometric series. The coupling cryotrons may also be controlled by a blocking line, and additional switching cryotrons may be provided for insuring constant current in taught cells. In a further embodiment, a complementary matrix may also be provided.
Abstract:
A memory system including a content addressable memory having an array of content addressable memory elements including a plurality of rows of content addressable memory elements and a plurality of columns of content addressable memory elements is provided. Each of the content addressable memory elements further includes a first superconducting quantum interference device (SQUID) and a second superconducting quantum interference device (SQUID), where an input bit to each of the content addressable memory elements is compared with: (1) a first state of the first SQUID and (2) a second state of the second SQUID to generate an output signal. The memory system further includes a Josephson magnetic random access memory (JMRAM), coupled to the content addressable memory.