HIGH DURABILITY THERMALLY CONDUCTIVE COMPOSITE AND LOW DE-OIOLING GREASE
    8.
    发明申请
    HIGH DURABILITY THERMALLY CONDUCTIVE COMPOSITE AND LOW DE-OIOLING GREASE 审中-公开
    高耐久性导热组合物和低脱脂润滑脂

    公开(公告)号:US20130248755A1

    公开(公告)日:2013-09-26

    申请号:US13892348

    申请日:2013-05-13

    Abstract: Provided is a high durability thermally conductive composite containing 0.5-10 volume % of a high molecular weight silicone with vinyl groups on both ends with viscosity at 25 DEG C. of 10000-15000 Pa·s, 1-10 volume % of an alkylalkoxysilane, and 40-65 volume % of an inorganic filler with the remainder being an addition-reacting low molecular weight silicone with viscosity at 25 DEG C. of 0.2-0.5 Pa·s. Also provided is a grease characterized in containing 38-48 volume % of an addition-reacting low molecular weight silicone with viscosity at 25 DEG C. of 0.2-0.5 Pa·s, 2-8 volume % of a high molecular weight silicone with vinyl groups on both ends with viscosity at 25 DEG C. of 10000-15000 Pa·s, and 50-60 volume % of an inorganic filler. It is preferable that the alkylalkoxysilane is a triethoxysilane or trimethoxysilane wherein the number of carbons in the alkyl groups is six to ten.

    Abstract translation: 提供一种高耐久性导热复合体,其含有0.5-10体积%的高分子量硅氧烷,两端具有乙烯基,在25℃下的粘度为10000-15000Pa·s,1-10体积%的烷基烷氧基硅烷, 和40-65体积%的无机填料,其余为加成反应低分子量硅氧烷,其粘度在25℃为0.2-0.5Pa·s。 还提供了一种润滑脂,其特征在于含有38-48体积%的加成反应低分子量硅氧烷,其在25℃下的粘度为0.2-0.5Pa·s,2-8体积%的高分子量硅氧烷与乙烯基 两端的粘度在25℃下为10000-15000Pa·s,50-60体积%的无机填料。 烷基烷氧基硅烷优选三烷氧基硅烷或三甲氧基硅烷,其中烷基中的碳数为六至十。

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