公开(公告)号：US20110303263A1

公开(公告)日：2011-12-15

申请号：US13139340

申请日：2009-12-14

Applicant: Catherine Corfias-Zuccalli ,  Laurent B. Cartier ,  Samuel Devisme ,  Stephane Bizet

Inventor： Catherine Corfias-Zuccalli ,  Laurent B. Cartier ,  Samuel Devisme ,  Stephane Bizet

IPC: H01L31/048 ,  C08L33/14 ,  C08L35/00 ,  H01L31/18 ,  C08L51/06

CPC classification number: C08L23/06 ,  C08L23/0815 ,  C08L23/0869 ,  C08L23/0884 ,  C08L2666/06 ,  C09D123/0869 ,  C09D123/0884 ,  C09J123/0869 ,  C09J123/0884 ,  H01L31/0481 ,  H01L31/049 ,  Y02E10/50 ,  Y10T29/49355

Abstract: The invention relates to the use in a photovoltaic module of a film of a composition as a backsheet or as an encapsulant, this composition comprising, with respect to the total weight of the composition: from 1 to 99% of a polyethylene having an ethylene whose level by weight is greater than or equal to 80% chosen from the homopolymers of ethylene and the copolymers of ethylene and another alpha-olefin; from 99 to 1% of a polyolefin B, other than A, carrying a reactive functional group X chosen from the anhydride carboxylic acids and epoxides. The invention further relates to a photovoltaic module comprising the film of the composition according to the invention and also a process for the manufacture of this module.

Abstract translation: 本发明涉及光伏组件中作为底片或作为密封剂的组合物的薄膜的用途，该组合物相对于组合物的总重量包括：1至99％的具有乙烯的聚乙烯 重量百分比大于或等于80％，选自乙烯的均聚物和乙烯与另一种α-烯烃的共聚物; 99％至1％的除A之外的聚烯烃B，其携带选自酸酐羧酸和环氧化物的反应性官能团X. 本发明还涉及包含根据本发明的组合物的薄膜的光伏组件以及该模块的制造方法。

公开(公告)号：US20040213973A1

公开(公告)日：2004-10-28

申请号：US10813311

申请日：2004-03-30

Inventor： Tomihiro Hara ,  Shigeyoshi Ishii

IPC: B32B031/00

CPC classification number: H01L21/561 ,  C08F210/02 ,  C08L23/0869 ,  C08L23/0884 ,  C08L2666/06 ,  C09J7/22 ,  C09J7/35 ,  C09J123/0869 ,  C09J123/0884 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3135 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/14 ,  H03H9/10 ,  Y10T156/109 ,  Y10T428/24942 ,  C08F220/00 ,  C08F2500/26 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A film adhesive for sealing a plurality of chip-type devices on a substrate at one time, including an adhesive layer of an adhesive composition which exhibits a minimum value of a storage modulus of elasticity before curing from 1null103 to 5null105 Pa measured by using a dynamic visco-elasticity measuring apparatus while elevating the temperature from 80null C. to 150null C. at an elevating temperature rate of 2.4null C./min and at a shearing rate of 6.28 rad/sec and a storage modulus of elasticity after curing from 5null105 to 5null107 Pa measured by using a dynamic visco-elasticity measuring apparatus at a sample temperature of 150null C. in a tensile mode at a measuring frequency of 6.28 rad/sec.

Abstract translation: 一种薄膜粘合剂，用于一次密封基板上的多个芯片型器件，包括粘合剂组合物的粘合剂层，其在固化前的储能弹性模量的最小值为1×10 3至5×10 5 Pa，通过使用动态粘弹性测量装置测量，同时将温度从80℃升高到150℃，升温速度为2.4℃/分钟，剪切速率为6.28rad / sec，储存 通过使用动态粘弹性测量装置，在样品温度为150℃，拉伸模式下以6.28rad / sec的测量频率，测量固化后的弹性模量，从5×10 5至5×10 7 Pa。

公开(公告)号：US20040063804A1

公开(公告)日：2004-04-01

申请号：US10470875

申请日：2003-07-31

Inventor： Masaaki Takeda ,  Kohichiro Kawate ,  Shigeyoshi Ishii ,  Naoyuki Toriumi ,  Koji Itoh ,  Tomihiro Hara

IPC: C08J003/28 ,  C08K003/22 ,  C08L063/00

CPC classification number: C09J123/0884 ,  C08G59/687 ,  C08K5/36 ,  C09J7/35 ,  C09J2205/114 ,  C09J2423/00 ,  C09J2433/00 ,  C08L23/0884

Abstract: A thermosetting adhesive which produces no foul odor or discharged gas, or form no bubbles under irradiation, and which exhibits a satisfactorily high bonding property, even under low-dose irradiation. The thermosetting adhesive contains an ethylene-glycidyl (meth)acrylate copolymer, whose principal monomer components are an ethylene and a glycidyl (meth)acrylate, and a sulphonium salt-comprising cationic polymerization catalyst.

Abstract translation: 即使在低剂量照射下也不产生恶臭或排出气体，也不会在照射下不产生气泡的热固性粘合剂，并且具有令人满意的高粘接性。 热固性粘合剂含有乙烯 - （甲基）丙烯酸缩水甘油酯共聚物，其主要单体成分为乙烯和（甲基）丙烯酸缩水甘油酯，以及含锍盐阳离子聚合催化剂。

公开(公告)号：US5731050A

公开(公告)日：1998-03-24

申请号：US600041

申请日：1996-02-12

Applicant: Hidefumi Kotsubo ,  Yasuhiro Morimura ,  Kyouei Yoshida ,  Kiyomi Sasaki

Inventor： Hidefumi Kotsubo ,  Yasuhiro Morimura ,  Kyouei Yoshida ,  Kiyomi Sasaki

IPC: C09J4/06 ,  C09J123/08 ,  C09J133/06 ,  G02F1/1335 ,  G02F1/133

CPC classification number: C09J133/062 ,  C09J123/0853 ,  C09J123/0869 ,  C09J123/0876 ,  C09J123/0884 ,  C09J4/06 ,  G02F1/133528 ,  Y10T428/1077

Abstract: An adhesive composition for use in joining a polarizer plate to a substrate of a liquid crystal cell contains as a main component (1) an ethylene-vinyl acetate copolymer, (2) a copolymer of ethylene, vinyl acetate, and an acrylate and/or methacrylate monomer, (3) a copolymer of ethylene, vinyl acetate, and maleic acid and/or maleic anhydride, (4) a copolymer of ethylene, an acrylate and/or methacrylate monomer, and maleic acid and/or maleic anhydride or (5) an ionomer resin in the form of an ethylene-methacrylic acid copolymer having a metal ion for binding molecules thereof. The composition is thermosetting when it contains an organic peroxide. The composition is photo-curable when it contains a photosensitizer.

Abstract translation: 用于将偏振片连接到液晶单元的基板的粘合剂组合物含有乙烯 - 乙酸乙烯酯共聚物的主要成分（1），（2）乙烯，乙酸乙烯酯和丙烯酸酯的共聚物和/或 甲基丙烯酸酯单体，（3）乙烯，乙酸乙烯酯和马来酸和/或马来酸酐的共聚物，（4）乙烯，丙烯酸酯和/或甲基丙烯酸酯单体和马来酸和/或马来酸酐的共聚物或（5 ）具有用于结合其分子的金属离子的乙烯 - 甲基丙烯酸共聚物形式的离聚物树脂。 当组合物含有有机过氧化物时，该组合物是热固性的。 当它含有光敏剂时，组合物是可光固化的。

公开(公告)号：US08653166B2

公开(公告)日：2014-02-18

申请号：US12782851

申请日：2010-05-19

Applicant: Luke A. Strzegowski ,  Ryan T. Tucker

Inventor： Luke A. Strzegowski ,  Ryan T. Tucker

IPC: C08K5/15

CPC classification number: C08L23/08 ,  C08L23/06 ,  C08L23/0869 ,  C08L23/0884 ,  C08L51/06 ,  C08L2205/02 ,  C08L2205/035 ,  C08L2666/02 ,  C09J123/0884 ,  H01L31/0481 ,  H01L33/56 ,  Y02E10/50 ,  Y10T156/1089 ,  C08L2666/06

Abstract: An encapsulant composition containing about 15 to about 50 wt % of an ethylene/ethyl acrylate/maleic anhydride copolymer containing about 20 to about 40 wt % of an ethylene/glycidyl (meth)acrylate copolymer; about 2 to about 30 wt % of an ethylene/butyl acrylate/maleic anhydride copolymer; about 5 to about 50 wt % of polyethylene, about 0.05 to about 5 wt % of an adhesion promoter; and optionally about 0.01 to about 2 wt % of at least one additive. The composition is useful for encapsulating thin film devices. The disclosure also relates to a method of encapsulating thin film devices with the composition and to devices produced by the method.

Abstract translation: 包含约15至约50重量％的乙烯/丙烯酸乙酯/马来酸酐共聚物的包封剂组合物，其含有约20至约40重量％的乙烯/（甲基）丙烯酸缩水甘油酯共聚物; 约2至约30重量％的乙烯/丙烯酸丁酯/马来酸酐共聚物; 约5至约50重量％的聚乙烯，约0.05至约5重量％的粘合促进剂; 和任选的约0.01至约2重量％的至少一种添加剂。 该组合物可用于封装薄膜器件。 本公开还涉及一种封装具有该组合物的薄膜器件的方法以及通过该方法生产的器件。

公开(公告)号：US20100330315A1

公开(公告)日：2010-12-30

申请号：US12867559

申请日：2009-02-13

Applicant: Christophe Robert

Inventor： Christophe Robert

IPC: B32B1/02 ,  C08L67/00

CPC classification number: C09J123/0884 ,  C08L23/0884 ,  C08L91/06 ,  C08L93/00 ,  C08L2666/02 ,  C09J167/02 ,  C09J167/04 ,  Y10T428/1352

Abstract: The invention relates to biodegradable hot-melt adhesive compositions, preferably without residual tackiness at room temperature and having a biodegradability, as measured by the released carbon-dioxide analysis method pursuant to Standard EN ISO 14855, that is higher than 55%, preferably higher than 60%, and preferably higher than 90%, and to the use thereof. This percentage is given by reference with the cellulose biodegradability measurement, which amounts to 100% in the same conditions.

Abstract translation: 本发明涉及可生物降解的热熔粘合剂组合物，优选在室温下不具有残留粘性并且具有生物降解性，如通过根据标准EN ISO 14855的释放的二氧化碳分析方法测得的，其高于55％，优选高于 60％，优选高于90％，以及其用途。 该百分比通过参考纤维素生物降解性测量给出，在相同条件下相当于100％。

公开(公告)号：US07682477B2

公开(公告)日：2010-03-23

申请号：US11836296

申请日：2007-08-09

Applicant: Thomas Moeller ,  Holger Toenniessen

Inventor： Thomas Moeller ,  Holger Toenniessen

IPC: C09J163/08 ,  C09J5/06 ,  C09J109/00 ,  C09J123/30

CPC classification number: C09J115/00 ,  C08K5/0016 ,  C08L23/08 ,  C08L101/02 ,  C08L2666/02 ,  C08L2666/06 ,  C09J119/006 ,  C09J123/0884 ,  Y10T428/287 ,  Y10T428/31511

Abstract: The invention relates to a radiation crosslinkable hot melt pressure sensitive adhesive comprised of a radiation crosslinkable polymer as component (A) based on epoxidized polyolefins, wherein the epoxy groups are not consolidated in blocks; a tackifying resin possessing no epoxy groups as component (B); optionally a low molecular weight oligomer as component (C) that possesses reactive groups that can react with the epoxy groups of component (A); and an additive comprising a photo initiator as component (D).

Abstract translation: 本发明涉及一种辐射可交联的热熔压敏粘合剂，其由基于环氧化聚烯烃的作为组分（A）的辐射可交联聚合物组成，其中环氧基团未固结在嵌段中; 不含环氧基的增粘树脂作为组分（B）; 任选地具有作为组分（C）的低分子量低聚物，其具有可与组分（A）的环氧基反应的反应性基团; 和包含光引发剂作为组分（D）的添加剂。

公开(公告)号：US6051652A

公开(公告)日：2000-04-18

申请号：US68073

申请日：1998-04-30

Applicant: Kohichiro Kawate ,  Shigeyoshi Ishii

Inventor： Kohichiro Kawate ,  Shigeyoshi Ishii

IPC: C08L23/08 ,  C08L33/04 ,  C08L93/04 ,  C09J123/08 ,  C08K5/04

CPC classification number: C09J123/0884 ,  C08L23/0869 ,  C08L33/04 ,  C08L93/04

Abstract: A composition for preparing a reactive hot melt composition comprises (a) a thermoplastic polymer which comprises a polyolefin having an epoxy group, and (b) a radiation polymerizable component containing (b-1) an aliphatic alkyl (meth)acrylate and (b-2) an acrylic compound having a functional group reactive with an epoxy group. A reactive hot melt composition is obtained by polymerizing this composition so as to polymerize the radiation polymerizable component.The reactive hot melt composition which can be easily hot melt coated, crosslinked quickly in the absence of radiation or moisture after bonding adherends, does not form moisture during crosslinking, and has high flowability during hot melting.

Abstract translation: PCT No.PCT / US96 / 16924 Sec。 371日期：1998年4月30日 102（e）1998年4月30日PCT PCT 1996年10月23日PCT公布。 公开号WO97 / 16500 日期1997年5月9日制备反应性热熔组合物的组合物包含（a）包含具有环氧基的聚烯烃的热塑性聚合物，和（b）含（b-1）脂肪族（甲基）丙烯酸烷基酯 和（b-2）具有与环氧基反应的官能团的丙烯酸类化合物。 通过聚合该组合物以聚合可辐射聚合组分来获得反应性热熔组合物。 可以容易地热熔融涂覆的反应性热熔组合物，在粘合被粘物之后，在没有辐射或湿气的情况下快速交联，在交联过程中不会形成水分，并且在热熔融时具有高流动性。

公开(公告)号：US10005930B2

公开(公告)日：2018-06-26

申请号：US15263661

申请日：2016-09-13

Applicant: Saudi Arabian Oil Company

Inventor： B. Raghava Reddy

IPC: C09J123/08 ,  E21B33/14 ,  C09K8/512 ,  C08G59/32 ,  C09K8/035 ,  C09K8/42 ,  C09K8/44

CPC classification number: C09J123/0884 ,  C08F210/02 ,  C08G59/3209 ,  C08G59/5006 ,  C08G59/502 ,  C08G59/504 ,  C09K8/035 ,  C09K8/428 ,  C09K8/44 ,  C09K8/512 ,  E21B33/14 ,  C08F220/14 ,  C08F2220/325 ,  C08F2500/12

Abstract: This document relates to compositions including a crosslinkable polymer including a pendant epoxide repeat unit and an amine crosslinker, and methods of treating a subterranean formation by providing the composition to the formation. The pendant epoxide repeat unit has the structure Each R1 is independently a (C1-C10) alkylene or (C1-C10) alkylene ether, each alkylene ether independently having a ratio of carbon atoms to oxygen atoms of 1:1 to 4:1.

公开(公告)号：US08916642B2

公开(公告)日：2014-12-23

申请号：US13139340

申请日：2009-12-14

Applicant: Catherine Corfias-Zuccalli ,  Laurent B. Cartier ,  Samuel Devisme ,  Stephane Bizet

Inventor： Catherine Corfias-Zuccalli ,  Laurent B. Cartier ,  Samuel Devisme ,  Stephane Bizet

IPC: C08L37/00 ,  C08L23/06 ,  C08L23/08 ,  C09D123/08 ,  C09J123/08 ,  H01L31/048

CPC classification number: C08L23/06 ,  C08L23/0815 ,  C08L23/0869 ,  C08L23/0884 ,  C08L2666/06 ,  C09D123/0869 ,  C09D123/0884 ,  C09J123/0869 ,  C09J123/0884 ,  H01L31/0481 ,  H01L31/049 ,  Y02E10/50 ,  Y10T29/49355

Abstract: The invention relates to the use in a photovoltaic module of a film of a composition as a backsheet or as an encapsulant, this composition comprising, with respect to the total weight of the composition: from 1 to 99% of a polyethylene having an ethylene whose level by weight is greater than or equal to 80% chosen from the homopolymers of ethylene and the copolymers of ethylene and another alpha-olefin; from 99 to 1% of a polyolefin B, other than A, carrying a reactive functional group X chosen from the anhydride carboxylic acids and epoxides. The invention further relates to a photovoltaic module comprising the film of the composition according to the invention and also a process for the manufacture of this module.

Abstract translation: 本发明涉及光伏组件中作为底片或作为密封剂的组合物的薄膜的用途，该组合物相对于组合物的总重量包括：1至99％的具有乙烯的聚乙烯 重量百分比大于或等于80％，选自乙烯的均聚物和乙烯与另一种α-烯烃的共聚物; 99％至1％的除A之外的聚烯烃B，其携带选自酸酐羧酸和环氧化物的反应性官能团X. 本发明还涉及包含根据本发明的组合物的薄膜的光伏组件以及该模块的制造方法。