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    Liquid molding compound and preparation method thereof
    2.
    发明授权
    Liquid molding compound and preparation method thereof 有权

    公开(公告)号：US12037488B1

    公开(公告)日：2024-07-16

    申请号：US18639612

    申请日：2024-04-18

    Applicant: Hubei Choice Technology Co., Ltd.

    Inventor： De Wu ,  Shengquan Wang ,  Shuhang Liao ,  Junxing Su

    IPC: C08K3/04 ,  C08K3/36 ,  C08L63/00

    CPC classification number: C08L63/00 ,  C08K3/04 ,  C08K3/36 ,  C08K2201/014 ,  C08L2207/322

    Abstract: The disclosure provides a liquid molding compound and preparation method thereof, belonging to the technical field of semiconductor packaging. The liquid molding compound includes: the following components in mass fraction, a filler 83%-88%, an epoxy resin 6%-9%, a curing agent 6%-9%, a colorant 0.1%-0.2%, an accelerator 0.1%-0.3%, and a paraffin oil 0.3%-0.6%; by adding paraffin oil that has a small surface activity, paraffin oil does not participate in the reaction between epoxy resin and curing agent, is easily compatible with epoxy resin, and easy to precipitate under heating conditions. The precipitated paraffin oil forms a spacer layer between the colloid surface and the thermal release tape. The paraffin oil of the spacer layer has almost no adhesion to the acrylic adhesive on the thermal release tape, so the thermal release tape can be easily removed at a certain temperature to achieve the effect of no residual adhesive.

    POLYMER COMPOSITION
    6.
    发明公开
    POLYMER COMPOSITION 审中-公开

    公开(公告)号：US20230141015A1

    公开(公告)日：2023-05-11

    申请号：US17919714

    申请日：2021-04-20

    Applicant: ENEOS CORPORATION

    Inventor： Keisuke CHINO

    IPC: C08L91/06 ,  C08L23/20 ,  C08K3/34

    CPC classification number: C08L91/06 ,  C08L23/20 ,  C08K3/346 ,  C08L2205/035 ,  C08L2207/322 ,  C08L2205/025 ,  C08L2312/00

    Abstract: A polymer composition including: at least one polymer ingredient selected from the group consisting of a polymer (A) having a side chain (a) containing a hydrogen-bonding cross-linking moiety with a carbonyl-containing group and/or a nitrogen-containing heterocycle and having a glass transition point of 25° C. or lower, and a polymer (B) containing a hydrogen-bonding cross-linking moiety and a covalent-bonding cross-linking moiety in a side chain and having a glass transition point of 25° C. or lower, wherein both the polymer (A) and the polymer (B) are a reaction product of a cross-linking agent with a maleic anhydride graft-modified thermoplastic polymer having a melting point of 64° C. or lower and a maleation rate of 0.1 to 3.0% by mass, and a type A durometer hardness measured under a temperature condition of 20±5° C. according to JIS K6253-3: 2012 is 0 to 49.

    MODIFIED SOYBEAN OIL-EXTENDED SBR COMPOUNDS AND VULCANIZATES FILLED WITH CARBON BLACK
    7.
    发明申请
    MODIFIED SOYBEAN OIL-EXTENDED SBR COMPOUNDS AND VULCANIZATES FILLED WITH CARBON BLACK 审中-公开
    改性大豆油扩展SBR化合物和充满碳黑的VULCANIZATE

    公开(公告)号：US20160272795A1

    公开(公告)日：2016-09-22

    申请号：US15037154

    申请日：2014-11-18

    Applicant: Mark Soucek ,  Avraam Isayev

    Inventor： Mark Soucek ,  Avraam Isayev

    IPC: C08L9/06

    CPC classification number: C08L9/06 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08L91/00 ,  C08L2205/06 ,  C08L2207/322

    Abstract: Rubber formulations include a rubber and a norbornylized seed oil. The norbornylized seed oil is a seed oil that is modified with norbornylene groups. The norbornylized seed oil can replace petroleum oils currently often used in rubber formulations. A process for creating a rubber formulation includes the steps of adding a norbornylized seed oil to a rubber, wherein the norbornylized seed oil is a seed oil modified with norbornylene groups.

    Abstract translation: 橡胶制剂包括橡胶和降冰片烯基化的种子油。 降冰片烯基种子油是用降冰片烯基团改性的种子油。 降冰片精的种子油可代替目前常用于橡胶配方中的石油。 制备橡胶制剂的方法包括将降冰片烯基化的种子油加入到橡胶中的步骤，其中降冰片烯基化的种子油是用降冰片烯基团改性的种子油。

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