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Patent Agency Ranking
公开(公告)号：US12209171B2
公开(公告)日：2025-01-28
申请号：US18826534
申请日：2024-09-06
Applicant: Hubei Choice Technology Co., Ltd.
Inventor： De Wu , Shengquan Wang , Shuhang Liao , Junxing Su
Abstract: Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 μm-100 μm accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.
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公开(公告)号：US20230094916A1
公开(公告)日：2023-03-30
申请号：US17911431
申请日：2020-11-27
Applicant: HUBEI CHOICE TECHNOLOGY CO., LTD.
Inventor： De WU , Shuhang LIAO , Yi WANG , Junxing SU , Shengquan WANG
Abstract: A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).
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公开(公告)号：US12037488B1
公开(公告)日：2024-07-16
申请号：US18639612
申请日：2024-04-18
Applicant: Hubei Choice Technology Co., Ltd.
Inventor： De Wu , Shengquan Wang , Shuhang Liao , Junxing Su
CPC classification number: C08L63/00 , C08K3/04 , C08K3/36 , C08K2201/014 , C08L2207/322
Abstract: The disclosure provides a liquid molding compound and preparation method thereof, belonging to the technical field of semiconductor packaging. The liquid molding compound includes: the following components in mass fraction, a filler 83%-88%, an epoxy resin 6%-9%, a curing agent 6%-9%, a colorant 0.1%-0.2%, an accelerator 0.1%-0.3%, and a paraffin oil 0.3%-0.6%; by adding paraffin oil that has a small surface activity, paraffin oil does not participate in the reaction between epoxy resin and curing agent, is easily compatible with epoxy resin, and easy to precipitate under heating conditions. The precipitated paraffin oil forms a spacer layer between the colloid surface and the thermal release tape. The paraffin oil of the spacer layer has almost no adhesion to the acrylic adhesive on the thermal release tape, so the thermal release tape can be easily removed at a certain temperature to achieve the effect of no residual adhesive.
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公开(公告)号：US20240425669A1
公开(公告)日：2024-12-26
申请号：US18826534
申请日：2024-09-06
Applicant: Hubei Choice Technology Co., Ltd.
Inventor： De WU , Shengquan WANG , Shuhang LIAO , Junxing SU
Abstract: Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 μm-100 μm accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.
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公开(公告)号：US11643499B2
公开(公告)日：2023-05-09
申请号：US17911431
申请日：2020-11-27
Applicant: HUBEI CHOICE TECHNOLOGY CO., LTD.
Inventor： De Wu , Shuhang Liao , Yi Wang , Junxing Su , Shengquan Wang
CPC classification number: C08G59/621 , C08L63/00 , C09J11/04 , C09J11/06 , C09J11/08 , C09J163/00 , C08L2203/206
Abstract: A liquid molding compound for protecting five edges of a semiconductor chip and a preparation method thereof are disclosed. The liquid molding compound includes 15 to 40 parts by mass of an epoxy resin, 15 to 35 parts by mass of a curing agent, 0.1 to 3 parts by mass of a curing accelerator, 4 to 15 parts by mass of a toughening agent, 75 to 150 parts by mass of an inorganic filler, and 0.1 to 5 parts by mass of a coupling agent. The epoxy resin is one or more selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a biphenyl epoxy resin. The toughening agent is an adduct of an epoxy resin and a carboxyl-terminated liquid butyronitrile rubber, and the curing agent is a phenol-formaldehyde resin. The molding compound has a low coefficient of thermal expansion (CTE).
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