METHOD OF FABRICATING CIS OR CIGS THIN FILM
    3.
    发明申请
    METHOD OF FABRICATING CIS OR CIGS THIN FILM 失效
    制造CIS或CIGS薄膜的方法

    公开(公告)号:US20120051998A1

    公开(公告)日:2012-03-01

    申请号:US13070099

    申请日:2011-03-23

    摘要: Disclosed herein is a method of fabricating a CIS or CIGS thin film, comprising: forming, on a substrate, a seed particle layer comprising copper-indium-compound seed particles comprising copper (Cu); indium (In); and at least one selected from the group consisting of gallium (Ga), sulfur (S) and selenium (Se), applying, on the seed particle layer, a water-soluble precursor solution comprising: a water-soluble copper (Cu) precursor; a water-soluble indium (In) precursor; and at least one selected from the group consisting of a water-soluble gallium (Ga) precursor, a water-soluble sulfur (S) precursor and a water-soluble selenium (Se) precursor, and forming a thin film at high temperature.

    摘要翻译: 本文公开了一种制造CIS或CIGS薄膜的方法,包括:在基底上形成包含铜(Cu)的铜 - 铟 - 复合种子颗粒的种子颗粒层; 铟(In); 和选自镓(Ga),硫(S)和硒(Se)的至少一种,在种子颗粒层上施加水溶性前体溶液,其包含水溶性铜(Cu)前体 ; 水溶性铟(In)前体; 和选自水溶性镓(Ga)前体,水溶性硫(S)前体和水溶性硒(Se)前体)中的至少一种,并在高温下形成薄膜。

    Low-emissivity coating having low solar reflectance
    7.
    发明申请
    Low-emissivity coating having low solar reflectance 有权
    低辐射率涂层具有低的太阳反射率

    公开(公告)号:US20060193976A1

    公开(公告)日:2006-08-31

    申请号:US11413775

    申请日:2006-04-28

    申请人: Wayne Hoffman

    发明人: Wayne Hoffman

    IPC分类号: B05D5/06

    摘要: The invention provides low solar reflectance, low-emissivity coatings. The invention also provides a pane bearing a low solar reflectance, low-emissivity coating. Further, the invention provides an insulating glass unit comprising first and second panes held in a spaced-apart configuration, wherein the panes have confronting inner surfaces oriented toward a between-pane space and opposed outer surfaces oriented away from the between-pane space, and wherein one of these inner surfaces bears a low solar reflectance, low-emissivity coating. Also provided are methods of producing coated substrates.

    摘要翻译: 本发明提供低的太阳反射率,低发射率涂层。 本发明还提供了一种具有低太阳反射率,低发射率涂层的玻璃板。 此外,本发明提供了一种绝缘玻璃单元,其包括以间隔开的构造保持的第一和第二窗格,其中,所述窗格具有面向玻璃间间隔和面向远离所述窗格间空间的相对的外表面之间的相对的内表面,以及 其中这些内表面之一具有低的太阳反射率,低发射率涂层。 还提供了生产涂覆的基材的方法。

    Method of fabricating CIS or CIGS thin film
    8.
    发明授权
    Method of fabricating CIS or CIGS thin film 失效
    制造CIS或CIGS薄膜的方法

    公开(公告)号:US08647394B2

    公开(公告)日:2014-02-11

    申请号:US13070099

    申请日:2011-03-23

    IPC分类号: C01D3/00

    摘要: Disclosed herein is a method of fabricating a CIS or CIGS thin film, comprising: forming, on a substrate, a seed particle layer comprising copper-indium-compound seed particles comprising copper (Cu); indium (In); and at least one selected from the group consisting of gallium (Ga), sulfur (S) and selenium (Se), applying, on the seed particle layer, a water-soluble precursor solution comprising: a water-soluble copper (Cu) precursor; a water-soluble indium (In) precursor; and at least one selected from the group consisting of a water-soluble gallium (Ga) precursor, a water-soluble sulfur (S) precursor and a water-soluble selenium (Se) precursor, and forming a thin film at high temperature.

    摘要翻译: 本文公开了一种制造CIS或CIGS薄膜的方法,包括:在基底上形成包含铜(Cu)的铜 - 铟 - 复合种子颗粒的种子颗粒层; 铟(In); 和选自镓(Ga),硫(S)和硒(Se)的至少一种,在种子颗粒层上施加水溶性前体溶液,其包含水溶性铜(Cu)前体 ; 水溶性铟(In)前体; 和选自水溶性镓(Ga)前体,水溶性硫(S)前体和水溶性硒(Se)前体)中的至少一种,并在高温下形成薄膜。

    System and method for transferring substrates in large scale processing of CIGS and/or CIS devices
    9.
    发明授权
    System and method for transferring substrates in large scale processing of CIGS and/or CIS devices 失效
    用于在CIGS和/或CIS设备的大规模处理中传送衬底的系统和方法

    公开(公告)号:US08377736B2

    公开(公告)日:2013-02-19

    申请号:US13343202

    申请日:2012-01-04

    申请人: Robert D. Wieting

    发明人: Robert D. Wieting

    IPC分类号: H01L21/00

    摘要: The present invention provides methods for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates having a copper and indium composite structure, and including a peripheral region, the peripheral region including a plurality of openings, the plurality of openings including at least a first opening and a second opening. The method includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the furnace including a holding apparatus. The method further includes introducing a gaseous species into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to at least initiate formation of a copper indium diselenide film on each of the substrates.

    摘要翻译: 本发明提供了制造铜铟二硒化物半导体膜的方法。 该方法包括提供具有铜和铟复合结构的多个衬底,并且包括周边区域,该周边区域包括多个开口,多个开口至少包括第一开口和第二开口。 该方法包括将多个基板转移到炉中,多个基板中的每一个相对于重力方向设置成垂直取向,炉包括保持装置。 该方法还包括将气态物质引入炉中并将热能传递到炉中以将温度从第一温度升高至至少在每个基板上开始形成铜铟锡硒化物膜。

    System and Method for Transferring Substrates in Large Scale Processing of CIGS and/or CIS Devices
    10.
    发明申请
    System and Method for Transferring Substrates in Large Scale Processing of CIGS and/or CIS Devices 失效
    用于在CIGS和/或CIS设备的大规模处理中传送基板的系统和方法

    公开(公告)号:US20120122304A1

    公开(公告)日:2012-05-17

    申请号:US13343202

    申请日:2012-01-04

    申请人: Robert D. Wieting

    发明人: Robert D. Wieting

    IPC分类号: H01L21/20

    摘要: The present invention provides methods for fabricating a copper indium diselenide semiconductor film. The method includes providing a plurality of substrates having a copper and indium composite structure, and including a peripheral region, the peripheral region including a plurality of openings, the plurality of openings including at least a first opening and a second opening. The method includes transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the furnace including a holding apparatus. The method further includes introducing a gaseous species into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature to at least initiate formation of a copper indium diselenide film on each of the substrates.

    摘要翻译: 本发明提供了制造铜铟二硒化物半导体膜的方法。 该方法包括提供具有铜和铟复合结构的多个衬底,并且包括周边区域,该周边区域包括多个开口,多个开口至少包括第一开口和第二开口。 该方法包括将多个基板转移到炉中,多个基板中的每一个相对于重力方向设置成垂直取向,炉包括保持装置。 该方法还包括将气态物质引入炉中并将热能传递到炉中以将温度从第一温度升高至第二温度,以至少在每个基板上起始形成铜铟硒化物膜。