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    WORKPIECE SUPPORT JIG
    1.
    发明申请
    WORKPIECE SUPPORT JIG 审中-公开
    工作支持大

    公开(公告)号：US20170076971A1

    公开(公告)日：2017-03-16

    申请号：US15245977

    申请日：2016-08-24

    申请人： DISCO CORPORATION

    发明人： Takeomi Fukuoka

    IPC分类号： H01L21/683 ,  B28D5/00 ,  B28D5/02

    CPC分类号： H01L21/6838 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024 ,  H01L21/67346 ,  H01L21/6835 ,  H01L2221/68327

    摘要： A workpiece support jig includes a support plate supporting a workpiece on a first surface while covering a support surface of a chuck table with a second surface opposite to the first surface and a retainer plate including an area sufficient to cover the whole of the workpiece and sandwiching the workpiece, held on the first surface of the support plate, between the support plate and itself. The support plate includes a plurality of groove parts corresponding to projected division lines of the supported workpiece and a plurality of through holes formed in chip-holding regions demarcated and divided by the intersecting groove parts. When the workpiece divided by a processing unit into chips is unloaded from the chuck table, the workpiece is unloaded while being sandwiched between the support plate and the retainer plate.

    摘要翻译： 工件支撑夹具包括：在第一表面上支撑工件的支撑板，同时覆盖具有与第一表面相对的第二表面的卡盘台的支撑表面;以及保持板，该保持板包括足以覆盖整个工件并夹持 保持在支撑板的第一表面上的工件在支撑板和本身之间。 支撑板包括对应于被支撑工件的投影分割线的多个凹槽部分和形成在由交叉凹槽部分划分和划分的芯片保持区域中的多个通孔。 当将由加工单元划分成切屑的工件从卡盘卸载时，工件在夹持在支撑板和保持板之间时被卸载。

    Apparatus for manufacturing seeds for polycrystalline silicon manufacture
    2.
    发明授权
    Apparatus for manufacturing seeds for polycrystalline silicon manufacture 有权
    用于制造多晶硅制造种子的装置

    公开(公告)号：US08425279B2

    公开(公告)日：2013-04-23

    申请号：US12241393

    申请日：2008-09-30

    申请人： Larry Gurley ,  Ken Rowell ,  Satoshi Imamura ,  Yukio Yamaguchi

    发明人： Larry Gurley ,  Ken Rowell ,  Satoshi Imamura ,  Yukio Yamaguchi

    IPC分类号： B24B7/00

    CPC分类号： B28D5/029 ,  B28D5/024 ,  C01B33/035 ,  Y10T83/748 ,  Y10T83/7507 ,  Y10T83/7573 ,  Y10T83/7688

    摘要： An apparatus for manufacturing seeds for polycrystalline silicon manufacture by cutting a silicon rod in an axial direction into at least one plate-like member, and cutting at least one of the silicon plate-like member lengthwise into seeds that are square in cross section, that includes a table which mounts the silicon rod or at least one of the plate-like member, a pair of end-face supporting members which support the silicon rod or at least one of the plate-like member by pressing both end faces thereof in the axial direction, and a cutting blade which cuts the silicon rod or at least one of the plate-like member in the axial direction, in addition the end-face supporting members includes comb-like grooves that allow the cutting blade to pass through.

    摘要翻译： 一种用于通过将硅棒沿轴向切割成至少一个板状构件来制造用于多晶硅制造种子的装置，并且将所述硅板状构件中的至少一个纵向切割成横截面为正方形的种子， 包括安装硅棒或板状构件中的至少一个的工作台，一对端面支撑构件，其通过将其两个端面压在其中来支撑硅棒或至少一个板状构件 以及沿轴向切割硅棒或板状构件中的至少一个的切割刀片，此外，端面支撑构件包括允许切割刀片通过的梳状槽。

    Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor Deposition Polysilicon Reactor
    3.
    发明申请
    Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor Deposition Polysilicon Reactor 审中-公开
    用于将硅切割成用于化学气相沉积多晶硅反应器的种子棒的锯

    公开(公告)号：US20130014738A1

    公开(公告)日：2013-01-17

    申请号：US13545093

    申请日：2012-07-10

    申请人： Paolo Molino ,  Rodolfo Bovo

    发明人： Paolo Molino ,  Rodolfo Bovo

    IPC分类号： B28D1/04

    CPC分类号： B28D5/023 ,  B28D5/024 ,  B28D5/029

    摘要： Systems and methods are provided for cutting silicon into seed rods for use in a chemical vapor deposition polysilicon reactor. A method includes cutting the silicon ingot with saw blades into silicon slabs, rotating the silicon slabs, and cutting the silicon slabs into smaller-sized silicon seed rods for use in the chemical vapor deposition polysilicon reactor.

    摘要翻译： 提供了将硅切割成用于化学气相沉积多晶硅反应器的种子棒的系统和方法。 一种方法包括将具有锯片的硅锭切割成硅板，旋转硅片，以及将硅片切割成用于化学气相沉积多晶硅反应器的较小尺寸的硅种子棒。

    APPARATUS FOR MANUFACTURING SEEDS FOR POLYCRYSTALLINE SILICON MANUFACTURE
    4.
    发明申请
    APPARATUS FOR MANUFACTURING SEEDS FOR POLYCRYSTALLINE SILICON MANUFACTURE 有权
    用于制造多晶硅制造的种子的装置

    公开(公告)号：US20100077897A1

    公开(公告)日：2010-04-01

    申请号：US12241393

    申请日：2008-09-30

    申请人： Larry Gurley ,  Ken Rowell ,  Satoshi Imamura ,  Yukio Yamaguchi

    发明人： Larry Gurley ,  Ken Rowell ,  Satoshi Imamura ,  Yukio Yamaguchi

    IPC分类号： B26D1/14 ,  B26D1/157 ,  B26D7/02 ,  B26D7/12 ,  B26D7/27

    CPC分类号： B28D5/029 ,  B28D5/024 ,  C01B33/035 ,  Y10T83/748 ,  Y10T83/7507 ,  Y10T83/7573 ,  Y10T83/7688

    摘要： An apparatus for manufacturing seeds for polycrystalline silicon manufacture by cutting a silicon rod in an axial direction into at least one plate-like member, and cutting at least one of the silicon plate-like member lengthwise into seeds that are square in cross section, that includes a table which mounts the silicon rod or at least one of the plate-like member, a pair of end-face supporting members which support the silicon rod or at least one of the plate-like member by pressing both end faces thereof in the axial direction, and a cutting blade which cuts the silicon rod or at least one of the plate-like member in the axial direction, in addition the end-face supporting members includes comb-like grooves that allow the cutting blade to pass through.

    摘要翻译： 一种用于通过将硅棒沿轴向切割成至少一个板状构件来制造用于多晶硅制造种子的装置，并且将所述硅板状构件中的至少一个纵向切割成横截面为正方形的种子， 包括安装硅棒或板状构件中的至少一个的工作台，一对端面支撑构件，其通过将其两个端面压在其中来支撑硅棒或至少一个板状构件 以及沿轴向切割硅棒或板状构件中的至少一个的切割刀片，此外，端面支撑构件包括允许切割刀片通过的梳状槽。

    Mother substrate cutting apparatus, method of cutting a mother substrate using the same and organic light emitting diode display cut thereby
    5.
    发明申请
    Mother substrate cutting apparatus, method of cutting a mother substrate using the same and organic light emitting diode display cut thereby 审中-公开
    母体基板切割装置，使用其切割母基板的方法以及有机发光二极管显示器切割

    公开(公告)号：US20100011925A1

    公开(公告)日：2010-01-21

    申请号：US12458527

    申请日：2009-07-15

    申请人： Sang-Hyung Lim ,  Jang-Hwan Shin

    发明人： Sang-Hyung Lim ,  Jang-Hwan Shin

    IPC分类号： B26D1/15 ,  H01J1/62

    CPC分类号： B26D1/15 ,  B26D1/141 ,  B26D3/06 ,  B26D3/22 ,  B26D5/02 ,  B26D7/01 ,  B28D5/0082 ,  B28D5/024 ,  Y10T83/0605 ,  Y10T83/6625 ,  Y10T83/7709

    摘要： A mother substrate cutting apparatus which may include a stationary stage, a moving stage on the stationary stage, the moving stage being configured to move in a first direction, a guide bar on the stationary stage, the guide bar being connected to the stationary stage via posts and configured to extend above the moving stage in a second direction crossing the first direction, a moving unit at the guide bar, the moving unit being configured to move on the guide bar, a lifter on the moving unit, the lifter being configured to move in a third direction that crosses the first direction and the second direction, and a blade on the lifter, the blade being configured to rotate and cut the mother substrate on the moving stage.

    摘要翻译： 母基板切割装置，其可以包括固定台，固定台上的移动台，移动台被构造成沿第一方向移动，固定台上的导杆，导杆连接到固定台通孔 并且构造成在与所述第一方向交叉的第二方向上延伸到所述移动台的上方，所述移动单元在所述引导杆处，所述移动单元被构造成在所述引导杆上移动，所述移动单元上的升降器， 在与第一方向和第二方向交叉的第三方向上移动，以及在升降器上的叶片，所述叶片构造成在移动台上旋转和切割母基板。

    Cutting machine
    9.
    发明申请
    Cutting machine 有权
    切割机

    公开(公告)号：US20030070520A1

    公开(公告)日：2003-04-17

    申请号：US10263794

    申请日：2002-10-04

    发明人： Takayuki Gawazawa

    IPC分类号： B26D003/08 ,  B26D007/02

    CPC分类号： B28D5/026 ,  B28D5/023 ,  B28D5/024 ,  Y10T29/49798 ,  Y10T83/0348 ,  Y10T83/037 ,  Y10T83/7487 ,  Y10T83/8847

    摘要： A cutting machine comprising a chuck table for holding a workpiece, a spindle unit having a rotary spindle for mounting a cutting blade which cuts the workpiece held on the chuck table, and a spindle unit support mechanism for supporting the spindle unit in such a manner that it can move in a cutting direction, wherein the spindle unit support mechanism comprises a movable base, a guide rail which is provided on the movable base and has a predetermined curvature radius, a spindle unit support member which is movably disposed along the guide rail and mounts the spindle unit, and an angle adjustment mechanism for moving the spindle unit support member along the guide rail to adjust the angle.

    摘要翻译： 一种切割机，包括用于保持工件的卡盘台，具有用于安装切割保持在卡盘台上的工件的切割刀片的旋转主轴的主轴单元和用于支撑主轴单元的主轴单元支撑机构， 其可以沿切割方向移动，其中所述主轴单元支撑机构包括可移动基座，设置在所述可移动基座上并具有预定曲率半径的导轨，沿所述导轨可移动地设置的主轴单元支撑构件， 安装主轴单元，以及用于使主轴单元支撑构件沿导轨移动以调整角度的角度调节机构。

    Precision cutting apparatus and cutting method using the same
    10.
    发明授权
    Precision cutting apparatus and cutting method using the same 有权
    精密切割装置及切割方法采用相同方式

    公开(公告)号：US06361404B1

    公开(公告)日：2002-03-26

    申请号：US09515510

    申请日：2000-02-29

    申请人： Souichi Ishiwata ,  Kazuma Sekiya ,  Takayuki Umahashi

    发明人： Souichi Ishiwata ,  Kazuma Sekiya ,  Takayuki Umahashi

    IPC分类号： B24B100

    CPC分类号： B28D5/029 ,  B28D5/024 ,  Y10T83/6587

    摘要： Disclosed is an improved precision cutting apparatus comprising a chuck table for holding a workpiece, and first and second cutting means each including a spindle unit having a blade attached thereto. The first and second cutting means are series-arranged with their blades opposing a predetermined distance apart, thereby cutting along two traces at one time by moving the chuck table relative to the stationary cutting means. These cutting means need not be allowed to overrun the workpiece while cutting, thus saving extra time required for overrunning which otherwise, would be required as is the case with the parallel-arrangement of two cutting means, and accordingly the dicing can be performed at an increased efficiency.

    摘要翻译： 公开了一种改进的精密切割装置，其包括用于保持工件的卡盘台，以及每个包括具有附接到其上的刀片的主轴单元的第一和第二切割装置。 第一和第二切割装置串联布置，其叶片相对于预定距离分开，从而通过相对于固定切割装置移动卡盘台，一次切割两条迹线。 这些切割装置不需要在切割时超过工件，因此节省了超出所需的额外时间，否则将需要与两个切割装置的平行布​​置的情况相同的，因此切割可以在 提高效率。