发明申请
- 专利标题： Dicing saw with variable indexing capability
- 专利标题（中）： 具有可变索引能力的切割锯
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申请号： US11137048申请日： 2005-05-25
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公开(公告)号： US20050211236A1公开(公告)日： 2005-09-29
- 发明人: Salman Akram , Derek Gochnour , Michael Hess , David Hembree
- 申请人： Salman Akram , Derek Gochnour , Michael Hess , David Hembree
- 主分类号： B23P17/00
- IPC分类号： B23P17/00 ; B26D3/00 ; B28D1/32 ; B28D5/02 ; H01L21/00 ; H01L21/301 ; H01L23/58 ; H01L29/00 ; H05K3/02 ; H05K3/20 ; H05K3/30
摘要：
A saw for dicing substrates, such as semiconductor wafers, that has one or more variable indexing capabilities and two or more blades. One of the blades may be moved laterally or vertically, independent of one or more other blades.
公开/授权文献
- US07387119B2 Dicing saw with variable indexing capability 公开/授权日：2008-06-17
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