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公开(公告)号：US11667111B2
公开(公告)日：2023-06-06
申请号：US16628483
申请日：2018-06-19
申请人： Ares Materials Inc.
IPC分类号： B32B27/28 , G02B1/14 , C09D7/41 , B29D11/00 , C08G75/045 , C08K5/00 , C09D181/02 , C08G18/64 , C08G18/38 , B29K81/00 , C08K5/132 , C08K5/46
CPC分类号： B32B27/286 , B29D11/00009 , B32B27/28 , C08G18/3855 , C08G18/3876 , C08G18/6453 , C08G75/045 , C08K5/0041 , C09D7/41 , C09D181/02 , G02B1/14 , B29K2081/04 , C08K5/132 , C08K5/46
摘要： Display modules typically incorporate a transparent hard material such as glass on the outside of the module in order to better protect the display stack from scratches, dents, and other mechanical deformations. However, as displays move to novel form factors such as bendable, foldable, and reliable display modules, these transparent hard materials (e.g., glass) may not be used due to their limited flexibility. Therefore, it is desirable that replacement materials be sufficiently flexible while maintaining the desirable optical (e.g., >90% transmission and low yellow index) and mechanical properties (e.g., pencil hardness>H) that comparable glass hard materials offer.
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公开(公告)号：US20210115258A1
公开(公告)日：2021-04-22
申请号：US16606570
申请日：2018-04-13
申请人： Ares Materials Inc.
IPC分类号： C08L101/12 , G03F7/09 , H01L27/12 , G02F1/1333 , B05D3/06 , B05D3/12
摘要： Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.
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公开(公告)号：US20210363304A1
公开(公告)日：2021-11-25
申请号：US16973540
申请日：2019-12-09
申请人： Ares Materials Inc.
发明人： Kejia YANG , Radu REIT
IPC分类号： C08G75/045 , C08J5/18 , C08K5/523 , C08K5/13
摘要： A photocurable resin composition for forming an optically clear film. The photocurable resin composition includes a polyfunctional thiol monomer comprising 2 thiol functional groups, a polyfunctional (meth)acrylate monomer comprising 2 (meth)acryloyl functional groups, a photo-initiator present in a concentration of about 1 parts per hundred (phr) or less, a sterically hindered phenolic antioxidant present in a concentration of about 5 phr or less, and a phosphite antioxidant present in a concentration of about 5 phr or less.
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公开(公告)号：US10736212B2
公开(公告)日：2020-08-04
申请号：US15698426
申请日：2017-09-07
申请人： Ares Materials, Inc.
发明人： Radu Reit , David Arreaga-Salas
摘要： A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.
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公开(公告)号：US12071533B2
公开(公告)日：2024-08-27
申请号：US16606570
申请日：2018-04-13
申请人： Ares Materials Inc.
IPC分类号： C08G73/10 , B05D3/06 , B05D3/12 , C08L101/12 , G02F1/1333 , G03F7/09 , H01L27/12
CPC分类号： C08L101/12 , B05D3/067 , B05D3/12 , G02F1/133305 , G03F7/09 , H01L27/1218 , H01L27/1262 , C08G73/1028 , C08L2203/20
摘要： Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.
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公开(公告)号：US11427684B2
公开(公告)日：2022-08-30
申请号：US16629869
申请日：2018-06-20
申请人： Ares Materials Inc.
IPC分类号： C08G75/045 , H01L21/768 , G03F7/038 , G03F7/09
摘要： Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.
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公开(公告)号：US20210147631A1
公开(公告)日：2021-05-20
申请号：US16629869
申请日：2018-06-20
申请人： Ares Materials Inc.
IPC分类号： C08G75/045 , H01L21/768
摘要： Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.
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