- 专利标题: Polymer substrate design parameters for electronic microfabrication
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申请号: US16606570申请日: 2018-04-13
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公开(公告)号: US12071533B2公开(公告)日: 2024-08-27
- 发明人: Radu Reit , Adrian Avendano-Bolivar , David Arreaga-Salas
- 申请人: Ares Materials Inc.
- 申请人地址: US TX Dallas
- 专利权人: Ares Materials Inc.
- 当前专利权人: Ares Materials Inc.
- 当前专利权人地址: US TX Dallas
- 代理机构: McGuire Woods LLP
- 国际申请: PCT/US2018/027654 2018.04.13
- 国际公布: WO2018/194936A 2018.10.25
- 进入国家日期: 2019-10-18
- 主分类号: C08G73/10
- IPC分类号: C08G73/10 ; B05D3/06 ; B05D3/12 ; C08L101/12 ; G02F1/1333 ; G03F7/09 ; H01L27/12
摘要:
Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.
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