公开(公告)号：US07388388B2

公开(公告)日：2008-06-17

申请号：US11320634

申请日：2005-12-30

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: G01R31/02

CPC classification number: G01R1/07314 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A flexible one-piece thin film with microelectro-mechanical systems (MEMS) probe circuits has a flexible non-conducting dielectric layer made from polyimide or silica, various electrical circuits arranged in multi-layered structure all embedded inside the dielectric layer, plural probes and circuit contacts protected by the dielectric layer from damage by way of one end embedded into the dielectric layer in connection with the electrical circuits respectively and the other end protruded out of the dielectric layer, and a raised probe supported-spacer disposed on the dielectric layer to form a buffer to the probes to prevent the probe from being exposed to much pressure.

Abstract translation: 具有微电子机械系统（MEMS）探针电路的柔性单件薄膜具有由聚酰亚胺或二氧化硅制成的柔性非导电介电层，以多层结构排列的各种电路全部嵌入电介质层内，多个探针和 由电介质层保护的电路触点不会受到与电路相关的一端嵌入电介质层中的一端的损坏，而另一端突出于电介质层之外，另一端突出于电介质层之外，凸起的探针支撑间隔物设置在电介质层上 形成缓冲器到探针，以防止探针暴露在很大的压力下。

公开(公告)号：US07445956B2

公开(公告)日：2008-11-04

申请号：US11287427

申请日：2005-11-28

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: B81C1/0088 ,  B81C2201/038 ,  H01L2224/16225 ,  H01L2224/48227

Abstract: A process for producing flexible MEMS thin film without a manufactured substrate applied in a MEMS manufacture specially includes a method of forming a component interface in the middle between a manufactured substrate and a MEMS thin film formed on the manufactured substrate as a basis, which component interface is so easily destroyed by an external force that the MEMS thin film produced by the mentioned process is easily separated from the manufactured substrate, and the separated MEMS thin film due to out of limitation from the manufactured substrate may be further processed in later working process to obtain a MEMS thin film with special structural features has flexibility and particularly has electrical circuits, micro structure, or MEMS components integrated and manufactured into inside or on its both sides.

Abstract translation: 用于生产柔性MEMS薄膜的方法，其中没有制造衬底应用于MEMS制造中，特别地包括在所制造的衬底和形成在所制造的衬底上的MEMS薄膜之间的中间形成部件界面的方法， 通过外力容易地破坏由所述工艺制造的MEMS薄膜容易与制造的基板分离，并且由制造的基板不受限制地分离的MEMS薄膜可以在后续工作过程中被进一步处理 获得具有特殊结构特征的MEMS薄膜具有柔性，并且特别地具有集成并制造在其内部或两侧的电路，微结构或MEMS部件。

公开(公告)号：US20060148117A1

公开(公告)日：2006-07-06

申请号：US11319632

申请日：2005-12-29

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: H01L21/00 ,  H01L21/31

CPC classification number: G01R1/07314 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A process for producing a thin film with MEMS probe circuits by using semiconductor process technology comprises steps of providing a flatted process substrate; forming a separable interface on the flatted process substrate; forming a probe circuit thin film with electric circuits, probes and circuit contacts on the separable interface; forming a raised probe supported-spacer on the probe circuit thin film; separating the probe circuit thin film from the process substrate; and processing a subsequent microstructure working to obtain a thin film with MEMS probe circuits which use the raised probe supported-spacer to form a buffer to prevent the probes from being exposed to much pressure.

Abstract translation: 通过使用半导体工艺技术制造具有MEMS探针电路的薄膜的方法包括提供平坦化处理衬底的步骤; 在平坦化的工艺衬底上形成可分离的界面; 在可分离接口上形成具有电路，探针和电路触点的探针电路薄膜; 在探针电路薄膜上形成凸起的探针支撑间隔物; 将探针电路薄膜与处理衬底分离; 并且处理随后的微结构工作以获得具有MEMS探针电路的薄膜，所述MEMS探针电路使用升高的探针支撑间隔物以形成缓冲器以防止探针暴露于大的压力。

公开(公告)号：US20070246837A1

公开(公告)日：2007-10-25

申请号：US11785452

申请日：2007-04-18

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: H01L23/48

CPC classification number: H01L23/3121 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49833 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An IC chip package, including a single chip package, two stacked chips package or a System-In-Package (SIP), is created to minimize the assembled volume, which basic structure comprises a chip, a circuited substrate provided for the chip electrically mounted thereon and an encapsulated means for covering the chip to constitute a package structure, wherein the chip has a processed substrate with an active side and an inactive side and one or more half-tunneling electrical contacts penetrating the processed substrate to form one or more electrical contacts on the inactive side of the chip, so that the chip is directly through the inactive side of the processed substrate electrically mounted to the circuited substrate without via bonding wires.

Abstract translation: 创建包括单个芯片封装，两个堆叠芯片封装或系统级封装（SIP）的IC芯片封装，以最小化组装的体积，该基本结构包括一个芯片，一个用于芯片的循环基板电气安装 封装装置，用于覆盖芯片以构成封装结构，其中芯片具有处理后的衬底，其具有有源侧和无效侧，以及一个或多个半通道电触点穿透处理过的衬底以形成一个或多个电触点 在芯片的非活动侧，使得芯片直接通过电路安装到循环衬底的处理衬底的不活动侧，而无需通过接合线。

公开(公告)号：US20060244468A1

公开(公告)日：2006-11-02

申请号：US11411125

申请日：2006-04-26

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: G01R31/02

CPC classification number: G01R1/0735

Abstract: A MEMPCS having high stiffness against bending deformation or distortion is formed by integrating the probe, electronic circuit, circuit connecting pad and dielectric material into a complete unit with flexible multiple-layered substrate structure, and the part of the probe extended outside the dielectric material is further wrapped with a protecting layer to form an reinforced structure for increasing high stiffness to the probe and for preventing environmental dirt and particle from getting into the gap existed between the probes of the MEMPCS.

Abstract translation: 通过将探针，电子电路，电路连接焊盘和电介质材料集成到具有柔性多层基板结构的完整单元中，形成具有抗弯曲变形或变形的高刚度的MEMPCS，并且扩展到介电材料外部的探针部分是 进一步用保护层包裹以形成用于增加探针高度的增强结构，并防止环境污垢和颗粒进入MEMPCS探头之间的间隙。

公开(公告)号：US07414419B2

公开(公告)日：2008-08-19

申请号：US11411125

申请日：2006-04-26

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: G01R31/02

CPC classification number: G01R1/0735

Abstract: A MEMPCS having high stiffness against bending deformation or distortion is formed by integrating the probe, electronic circuit, circuit connecting pad and dielectric material into a complete unit with flexible multiple-layered substrate structure, and the part of the probe extended outside the dielectric material is further wrapped with a protecting layer to form an reinforced structure for increasing high stiffness to the probe and for preventing environmental dirt and particle from getting into the gap existed between the probes of the MEMPCS.

Abstract translation: 通过将探针，电子电路，电路连接焊盘和电介质材料集成到具有柔性多层基板结构的完整单元中，形成具有抗弯曲变形或变形的高刚度的MEMPCS，并且扩展到介电材料外部的探针部分是 进一步用保护层包裹以形成用于增加探针高度的增强结构，并防止环境污垢和颗粒进入MEMPCS探头之间的间隙。

公开(公告)号：US07351602B2

公开(公告)日：2008-04-01

申请号：US11319632

申请日：2005-12-29

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: H01L21/00

CPC classification number: G01R1/07314 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A process for producing a thin film with MEMS probe circuits by using semiconductor process technology comprises steps of providing a flatted process substrate; forming a separable interface on the flatted process substrate; forming a probe circuit thin film with electric circuits, probes and circuit contacts on the separable interface; forming a raised probe supported-spacer on the probe circuit thin film; separating the probe circuit thin film from the process substrate; and processing a subsequent microstructure working to obtain a thin film with MEMS probe circuits which use the raised probe supported-spacer to form a buffer to prevent the probes from being exposed to much pressure.

Abstract translation: 通过使用半导体工艺技术制造具有MEMS探针电路的薄膜的方法包括提供平坦化处理衬底的步骤; 在平坦化的工艺衬底上形成可分离的界面; 在可分离接口上形成具有电路，探针和电路触点的探针电路薄膜; 在探针电路薄膜上形成凸起的探针支撑间隔物; 将探针电路薄膜与处理衬底分离; 并且处理随后的微结构工作以获得具有MEMS探针电路的薄膜，所述MEMS探针电路使用升高的探针支撑间隔物以形成缓冲器以防止探针暴露于大的压力。

公开(公告)号：US20070249153A1

公开(公告)日：2007-10-25

申请号：US11785447

申请日：2007-04-18

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: H01L21/44 ,  H01L21/4763

CPC classification number: H01L23/3121 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49833 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for producing a chip structure with one electrical contact formed on inactive side thereof includes by pre-forming at least one half-tunneling electrical contact to penetrate a processed substrate prepared for processing a chip, and when finishing processing the chip the half-tunneling electrical contact is without completely penetrated the whole chip, particularly one end of the half-tunneling electrical contact is exposed on the inactive side of the chip and formed as an electrical contact of the chip and the other end of the half-tunneling electrical contact is electrically connected to a circuit formed in the chip; the kind of chip having the half-tunneling electrical contact may provide with various layouts and designs of the electrical contacts to minimize the assembled volume of the chip, and the chips are easily stacked together or assembled into a System-In-Package (SIP) structure.

Abstract translation: 一种用于制造具有在其非活性侧形成的一个电触点的芯片结构的方法包括：通过预先形成至少一个半通道电接触以穿透准备用于处理芯片的处理衬底，并且当完成半导体处理芯片时 电接触没有完全穿透整个芯片，特别是半通道电接触的一端暴露在芯片的非活动侧，并且形成为芯片的电接触，并且半通道电接触的另一端形成 电连接到芯片中形成的电路; 具有半通道电接触的芯片的种类可以提供电触点的各种布局和设计，以最小化芯片的组装体积，并且芯片容易堆叠在一起或组装成系统级封装（SIP） 结构体。

公开(公告)号：US20060145338A1

公开(公告)日：2006-07-06

申请号：US11320634

申请日：2005-12-30

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: H01L23/34

CPC classification number: G01R1/07314 ,  G01R1/06772 ,  G01R1/0735 ,  G01R3/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A flexible one-piece thin film with microelectro-mechanical systems (MEMS) probe circuits has a flexible non-conducting dielectric layer made from polyimide or silica, various electrical circuits arranged in multi-layered structure all embedded inside the dielectric layer, plural probes and circuit contacts protected by the dielectric layer from damage by way of one end embedded into the dielectric layer in connection with the electrical circuits respectively and the other end protruded out of the dielectric layer, and a raised probe supported-spacer disposed on the dielectric layer to form a buffer to the probes to prevent the probe from being exposed to much pressure.

Abstract translation: 具有微电子机械系统（MEMS）探针电路的柔性单件薄膜具有由聚酰亚胺或二氧化硅制成的柔性非导电介电层，以多层结构排列的各种电路全部嵌入电介质层内，多个探针和 由电介质层保护的电路触点不会受到与电路相关的一端嵌入电介质层中的一端的损坏，而另一端突出于电介质层之外，另一端突出于电介质层之外，凸起的探针支撑间隔物设置在电介质层上 形成缓冲器到探针，以防止探针暴露在很大的压力下。

公开(公告)号：US20060115960A1

公开(公告)日：2006-06-01

申请号：US11287428

申请日：2005-11-28

Applicant: Wen-Chang Dong

Inventor： Wen-Chang Dong

IPC: H01L21/30 ,  H01L21/46

CPC classification number: B81C1/0088 ,  B81C2201/038 ,  H01L2224/16225 ,  H01L2224/48227

Abstract: A method of forming component interface in semiconductor or MEMS manufacture is by way of a bad adhesion material or manufacture, or an easy etching and removable material, to form an easily removed component interface in the middle between a manufactured substrate and a layer of semiconductor circuit or MEMS component formed on the manufactured substrate as a basis, therefore, after semiconductor or MEMS manufacture is completed, the component interface is so easily destroyed by an external force that the layer of semiconductor circuit or MEMS component is easily separated from the manufactured substrate.

Abstract translation: 在半导体或MEMS制造中形成部件界面的方法是通过不良的粘附材料或制造方法，或易于蚀刻和可移除的材料，以在制造的基板和半导体电路层之间的中间形成容易去除的部件界面 或MEMS部件形成在制造的基板上作为基础，因此，在半导体或MEMS制造完成之后，部件界面被外力容易地破坏，使得半导体电路层或MEMS部件容易与制造的基板分离。