A method of forming component interface in semiconductor or MEMS manufacture is by way of a bad adhesion material or manufacture, or an easy etching and removable material, to form an easily removed component interface in the middle between a manufactured substrate and a layer of semiconductor circuit or MEMS component formed on the manufactured substrate as a basis, therefore, after semiconductor or MEMS manufacture is completed, the component interface is so easily destroyed by an external force that the layer of semiconductor circuit or MEMS component is easily separated from the manufactured substrate.