摘要:
A semiconductor device includes a wafer having a semiconductor layer with source, body and drain regions. A electrically-conducting region of the semiconductor region overlaps and electrically couples the source region and the body region. The electrical coupling of the source and body regions reduces floating body effects in the semiconductor device. A method of constructing the semiconductor device utilizes spacers, masking, and/or tilted implantation to form an source-body electrically-conducting region that overlaps the source and body regions of the semiconductor layer, and a drain electrically-conducting region that is within the drain region of the semiconductor layer.
摘要:
A semiconductor device includes a wafer having a semiconductor layer with source, body and drain regions. A electrically-conducting region of the semiconductor region overlaps and electrically couples the source region and the body region. The electrical coupling of the source and body regions reduces floating body effects in the semiconductor device. A method of constructing the semiconductor device utilizes spacers, masking, and/or tilted implantation to form an source-body electrically-conducting region that overlaps the source and body regions of the semiconductor layer, and a drain electrically-conducting region that is within the drain region of the semiconductor layer.
摘要:
A semiconductor device includes a wafer having a semiconductor layer with source, body and drain regions. A electrically-conducting region of the semiconductor region overlaps and electrically couples the source region and the body region. The electrical coupling of the source and body regions reduces floating body effects in the semiconductor device. A method of constructing the semiconductor device utilizes spacers, masking, and/or tilted implantation to form an source-body electrically-conducting region that overlaps the source and body regions of the semiconductor layer, and a drain electrically-conducting region that is within the drain region of the semiconductor layer.
摘要:
A dual material gate is effectively fabricated for a field effect transistor having a short channel length of submicron and nanometer dimensions such that disadvantageous short channel effects are minimized. Generally, the method of the present invention includes a step of forming a first material gate portion on a gate dielectric. The first material gate portion has a source side and a drain side, and an aspect of the present invention further includes the step of depositing a spacer dielectric layer on the source side and the drain side of the first material gate portion. An aspect of the present invention also includes the step of implanting heavy ions into the spacer dielectric layer at an angle such that the spacer dielectric layer at the drain side of the first material gate portion is substantially not implanted with the heavy ions. The spacer dielectric layer is then selectively etched such that any portion of the spacer dielectric layer that is implanted with the heavy ions is etched. Thus, the spacer dielectric layer on the drain side of the first material gate portion is not etched, but the spacer dielectric layer on the source side of the first material gate portion is etched. In addition, an aspect of the present invention includes a step of selectively growing a second material gate portion from the first material gate portion that is exposed on the source side of the first material gate portion. In this manner, the dual material gate of the field effect transistor is comprised of the first material gate portion toward the drain of the field effect transistor and the second material gate portion toward the source of the field effect transistor.
摘要:
A semiconductor device includes a wafer having a semiconductor layer with source, body and drain regions. A electrically-conducting region of the semiconductor region overlaps and electrically couples the source region and the body region. The electrical coupling of the source and body regions reduces floating body effects in the semiconductor device. A method of constructing the semiconductor device utilizes spacers, masking, and/or tilted implantation to form an source-body electrically-conducting region that overlaps the source and body regions of the semiconductor layer, and a drain electrically-conducting region that is within the drain region of the semiconductor layer.
摘要:
The present invention accurately determines a first parasitic capacitance component between a conductive gate region to a drain local interconnect of a real field effect transistor, and determines a second parasitic capacitance component between the conductive gate region to a source local interconnect of the real field effect transistor. A virtual field effect transistor is fabricated on a dielectric in order to determine the parasitic capacitance component between just the gate and the drain or source local interconnect of the real field effect transistor. The virtual field effect transistor includes a virtual drain local interconnect, a virtual source local interconnect, and a virtual conductive gate region fabricated on the dielectric with a respective size and positions relative to each other that are substantially the same as that of the drain and source local interconnects and the gate, respectively, of the real field effect transistor. In this manner, the first parasitic capacitance component between the conductive gate region of the real field effect transistor to the drain local interconnect of the real field effect transistor is a first capacitance measured between the virtual conductive gate region and the virtual drain local interconnect of the virtual field effect transistor of the present invention. Similarly, the second parasitic capacitance component between the conductive gate region of the real field effect transistor to the source local interconnect of the real field effect transistor is a second capacitance measured between the virtual conductive gate region and the virtual source local interconnect of the virtual field effect transistor of the present invention.
摘要:
A method for extracting a channel length between a source and a drain in a substrate of a transistor is disclosed herein. The method includes forward biasing the source with respect to the substrate to inject a charge into the substrate, collecting the charge at the drain, and calculating the channel length from the charge collected at the drain.
摘要:
A method and apparatus that uses gate-to-substrate capacitance with varying amounts of source/drain junction bias to measure channel lateral doping profile by applying a series of different voltages between the source/drain and the substrate. The gate capacitance is measured for the different voltages. The capacitance is used to calculate the depletion width. From the depletion width, channel doping is calculated. Using this method direct evidence of a localized Boron pile up at source/drain edge is shown.
摘要:
The invention provides a method and apparatus for calculating gate length and source/drain gate overlap, by measuring gate capacitance. The invention uses previously known fringe capacitance C.sub.fr and unit capacitance C.sub.OX. The invention measures gate capacitance C.sub.g, when the gate is accumulatively biased, and solves for overlap capacitance C.sub.OV using the equation C.sub.OV =(C.sub.g -2C.sub.fr)/2 or C.sub.OV =(C.sub.gg -C.sub.gb -2C.sub.fr)/2. The invention then measures the gate capacitance C.sub.g when the gate to source/drain voltage is set to inversion bias and a zero voltage is applied between the source/drain and the substrate, and solves for the channel capacitance C.sub.ch using the equation C.sub.ch =C.sub.g -2C.sub.fr -2C.sub.OV. The invention calculates the channel capacitance C.sub.ch where C.sub.ch =C.sub.g -2C.sub.fr -2C.sub.OV and then calculates gate length where gate length L.sub.g =(2C.sub.OV +C.sub.ch)/C.sub.OX and the effective gate length L.sub.eff =C.sub.ch /C.sub.OX. The invention further calculates source/drain gate overlap L.sub.OV, by setting L.sub.OV =C.sub.OV /C.sub.OX.
摘要:
Double density non-volatile memory cells having a trench structure are formed in a substrate, thereby facilitating miniaturization, improved planarization and low power programming and erasing. Each double density cell comprises two floating gates and a common control gate. Each pair of double density cells shares a common source region. Embodiments include forming first and second trenches in a substrate and depositing a tunnel dielectric layer in each trench. Polycrystalline silicon is then deposited filling each trench and a hole is etched forming two floating gate electrodes in each trench. An interpoly dielectric layer is then formed and a substantially T-shaped control gate electrode is deposited filling the hole between the floating gates and extending on the substrate.