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公开(公告)号:US20170186710A1
公开(公告)日:2017-06-29
申请号:US15312704
申请日:2015-05-27
CPC分类号: H01L23/66 , H01L21/486 , H01L23/15 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L2223/6616 , H01L2223/6677 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2924/0002 , H01P1/20381 , H01P7/08 , H01P11/003 , H01Q1/38 , H05K1/0306 , H05K2201/10378 , H01L2924/00
摘要: Various integrated high quality electronic components and systems, and methods of their manufacture, are presented. In one example, a device includes a glass substrate or interposer including one or more metalized through-glass vias (TGVs). The one or more metalized TGVs can be used to form a substrate integrated waveguide, a complementary split ring resonator, a disc loaded monopole antenna or other device. An array of metalized TGVs can define side walls of the integrated waveguide. A disc coupled to a tip of a metalized TGV can provide capacitive disc loading of the monopole antenna.