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公开(公告)号：US20240153903A1
公开(公告)日：2024-05-09
申请号：US18414125
申请日：2024-01-16
IPC分类号： H01L23/00 , H01L21/027
CPC分类号： H01L24/13 , H01L21/027 , H01L24/04 , H01L24/11 , H01L2221/1068 , H01L2224/022 , H01L2224/0401 , H01L2224/1146 , H01L2224/1147 , H01L2224/13144 , H01L2224/13147 , H01L2924/014 , H01L2924/177
摘要： In a described example, an apparatus includes: a semiconductor die having a device side surface; bond pads on the semiconductor die on the device side surface; post connects having a proximate end on the bond pads and extending from the bond pads to a distal end, the diameter of the post connects at the proximate end being the same as the diameter of the post connects at the distal end; polyimide material covering sides of the post connects and covering at least a portion of the bond pads; and solder bumps on the distal end of the post connects.
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公开(公告)号：US20240006351A1
公开(公告)日：2024-01-04
申请号：US17855695
申请日：2022-06-30
IPC分类号： H01L23/00
CPC分类号： H01L24/03 , H01L24/04 , H01L24/05 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/02 , H01L24/73 , H01L2224/04042 , H01L2224/73265 , H01L2224/32245 , H01L2224/92247 , H01L21/561
摘要： A described example includes: a semiconductor die having a device side surface and an opposing backside surface, the backside surface mounted to a die pad of a lead frame, the lead frame comprising conductive leads spaced from the die pad; a conductor layer overlying the device side surface; bond pads including bond pad conductors formed in the conductor layer, a nickel layer over the bond pad conductors, and a palladium or gold layer over the nickel layer; conductor traces formed in the conductor layer, the conductor traces free from the nickel layer and the palladium or gold layer; bond wires bonded to the bond pads electrically coupling the bond pads to conductive leads; and mold compound covering the semiconductor die, the bond pads, the bond wires, and portions of the lead frame, wherein portions of the conductive leads are exposed from the mold compound to form terminals.
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公开(公告)号：US20240363570A1
公开(公告)日：2024-10-31
申请号：US18141456
申请日：2023-04-30
IPC分类号： H01L23/00
CPC分类号： H01L24/13 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L23/31 , H01L23/4951 , H01L2224/03614 , H01L2224/03912 , H01L2224/05022 , H01L2224/05124 , H01L2224/05562 , H01L2224/05582 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05672 , H01L2224/0568 , H01L2224/05681 , H01L2224/05684 , H01L2224/11462 , H01L2224/11464 , H01L2224/11831 , H01L2224/13018 , H01L2224/13147 , H01L2224/16245
摘要： A semiconductor package comprises an integrated circuit having a contact and a conductive bump directly attached to the contact. The conductive bump has a sidewall with a roughened surface. A leadframe is electrically coupled to the conductive bump. An integrated circuit package mold covers portions of the conductive bump and the lead frame, the roughened surface of the conductive bump is configured to interlock with the integrated circuit package mold. An electrically conductive adhesive couples the conductive bump to the lead frame. The conductive bump comprises copper in one arrangement. The roughened surface of the conductive bump includes grooves along grain boundaries that separate copper grains. The roughened surface of the conductive bump is formed by etching with a diluted sulfuric peroxide solution.
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公开(公告)号：US11876065B2
公开(公告)日：2024-01-16
申请号：US17491496
申请日：2021-09-30
IPC分类号： H01L23/00 , H01L21/027
CPC分类号： H01L24/13 , H01L21/027 , H01L24/04 , H01L24/11 , H01L2221/1068 , H01L2224/022 , H01L2224/0401 , H01L2224/1146 , H01L2224/1147 , H01L2224/13144 , H01L2224/13147 , H01L2924/014 , H01L2924/177
摘要： In a described example, an apparatus includes: a semiconductor die having a device side surface; bond pads on the semiconductor die on the device side surface; post connects having a proximate end on the bond pads and extending from the bond pads to a distal end, the diameter of the post connects at the proximate end being the same as the diameter of the post connects at the distal end; polyimide material covering sides of the post connects and covering at least a portion of the bond pads; and solder bumps on the distal end of the post connects.
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