A semiconductor package comprises an integrated circuit having a contact and a conductive bump directly attached to the contact. The conductive bump has a sidewall with a roughened surface. A leadframe is electrically coupled to the conductive bump. An integrated circuit package mold covers portions of the conductive bump and the lead frame, the roughened surface of the conductive bump is configured to interlock with the integrated circuit package mold. An electrically conductive adhesive couples the conductive bump to the lead frame. The conductive bump comprises copper in one arrangement. The roughened surface of the conductive bump includes grooves along grain boundaries that separate copper grains. The roughened surface of the conductive bump is formed by etching with a diluted sulfuric peroxide solution.