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    Capacitive type humidity sensor
    5.
    发明授权
    Capacitive type humidity sensor 失效
    电容式湿度传感器

    公开(公告)号：US07387024B2

    公开(公告)日：2008-06-17

    申请号：US11061448

    申请日：2005-02-22

    申请人： Toshikazu Itakura ,  Hisanori Yokura

    发明人： Toshikazu Itakura ,  Hisanori Yokura

    IPC分类号： G01N27/22 ,  G01R27/26

    CPC分类号： G01N27/223

    摘要： A capacitive type humidity sensor includes: a semiconductor substrate; a plurality of humidity devices having a capacitance variable in accordance with a humidity; a standard capacitance device having a standard capacitance, a capacitance change of which in accordance with the humidity is smaller than that of the capacitance of each humidity device; and a CV converter circuit for converting a capacitance difference between the capacitance of each humidity device and the standard capacitance of the standard capacitance device to a signal voltage. The humidity devices, the standard capacitance device and the CV converter circuit are disposed on one side of the substrate.

    摘要翻译： 电容式湿度传感器包括：半导体衬底; 多个湿度装置，其具有根据湿度可变的电容; 具有标准电容的标准电容器件，根据湿度的电容变化小于每个湿度器件的电容的电容值; 以及用于将每个湿度装置的电容和标准电容装置的标准电容之间的电容差转换为信号电压的CV转换器电路。 湿度装置，标准电容装置和CV转换器电路设置在基板的一侧。

    Fabri-Perot filter
    6.
    发明授权
    Fabri-Perot filter 有权
    Fabri-Perot过滤器

    公开(公告)号：US07154094B2

    公开(公告)日：2006-12-26

    申请号：US11007277

    申请日：2004-12-09

    申请人： Hisanori Yokura ,  Takahiko Yoshida

    发明人： Hisanori Yokura ,  Takahiko Yoshida

    IPC分类号： G01J5/02

    CPC分类号： G01J3/26 ,  G02B26/001

    摘要： A Fabri-Perot filter includes: a substrate; a first mirror disposed on the substrate; and a movable mirror unit facing the first mirror with a gap therebetween. The movable mirror unit is movable toward the first mirror in a case where a predetermined voltage is applied between the first mirror and the movable mirror unit so that the gap is changeable. The filter is capable of transmitting an infrared light having a predetermined wavelength corresponding to the gap. The movable mirror unit includes a center portion and a periphery portion, which is deformable easier than the center portion.

    摘要翻译： Fabri-Perot过滤器包括：基底; 设置在基板上的第一反射镜; 以及面对第一反射镜的可移动镜单元，其间具有间隙。 在第一反射镜和可动反射镜单元之间施加预定电压使得间隙可变的情况下，可动镜单元可朝向第一反射镜移动。 滤光器能够传输具有与间隙对应的预定波长的红外光。 可动镜单元包括中心部分和周边部分，其比中心部分易变形。

    Semiconductor device
    7.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08497557B2

    公开(公告)日：2013-07-30

    申请号：US12754036

    申请日：2010-04-05

    申请人： Masaya Tanaka ,  Tetsuo Fujii ,  Hisanori Yokura

    发明人： Masaya Tanaka ,  Tetsuo Fujii ,  Hisanori Yokura

    IPC分类号： H01L29/84

    CPC分类号： B81B7/0041 ,  B81C2203/019 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, and a sealing member. The first semiconductor substrate has a surface and includes a sensing portion on the surface side. The sensing portion has a movable portion. The first semiconductor substrate and the second semiconductor substrate are bonded together to form a stacked substrate. The stacked substrate defines a hermetically sealed space for accommodating the sensing portion between the first and second semiconductor substrates. The stacked substrate further defines a recess extending between the first semiconductor substrate and the second semiconductor substrate to penetrate an interface between the first semiconductor substrate and the second semiconductor substrate. The sealing member is located in the recess.

    摘要翻译： 半导体器件包括第一半导体衬底，第二半导体衬底和密封构件。 第一半导体衬底具有表面并且在表面侧包括感测部分。 感测部分具有可移动部分。 将第一半导体衬底和第二半导体衬底接合在一起以形成堆叠衬底。 堆叠的衬底限定用于在第一和第二半导体衬底之间容纳感测部分的气密密封空间。 堆叠的衬底还限定了在第一半导体衬底和第二半导体衬底之间延伸的凹部，以穿透第一半导体衬底和第二半导体衬底之间的界面。 密封件位于凹槽中。

    Capacitive type humidity sensor
    8.
    发明申请
    Capacitive type humidity sensor 失效
    电容式湿度传感器

    公开(公告)号：US20050188764A1

    公开(公告)日：2005-09-01

    申请号：US11061448

    申请日：2005-02-22

    申请人： Toshikazu Itakura ,  Hisanori Yokura

    发明人： Toshikazu Itakura ,  Hisanori Yokura

    IPC分类号： G01N1/00 ,  G01N27/22

    CPC分类号： G01N27/223

    摘要： A capacitive type humidity sensor includes: a semiconductor substrate; a plurality of humidity devices having a capacitance variable in accordance with a humidity; a standard capacitance device having a standard capacitance, a capacitance change of which in accordance with the humidity is smaller than that of the capacitance of each humidity device; and a CV converter circuit for converting a capacitance difference between the capacitance of each humidity device and the standard capacitance of the standard capacitance device to a signal voltage. The humidity devices, the standard capacitance device and the CV converter circuit are disposed on one side of the substrate.

    摘要翻译： 电容式湿度传感器包括：半导体衬底; 多个湿度装置，其具有根据湿度可变的电容; 具有标准电容的标准电容器件，根据湿度的电容变化小于每个湿度器件的电容的电容值; 以及用于将每个湿度装置的电容和标准电容装置的标准电容之间的电容差转换为信号电压的CV转换器电路。 湿度装置，标准电容装置和CV转换器电路设置在基板的一侧。

    Semiconductor sensor and method of manufacturing the same
    9.
    发明申请
    Semiconductor sensor and method of manufacturing the same 有权
    半导体传感器及其制造方法

    公开(公告)号：US20080202249A1

    公开(公告)日：2008-08-28

    申请号：US12010758

    申请日：2008-01-29

    申请人： Hisanori Yokura ,  Yoshihiko Isobe ,  Eishi Kawasaki

    发明人： Hisanori Yokura ,  Yoshihiko Isobe ,  Eishi Kawasaki

    IPC分类号： G01L9/04 ,  H01C17/28

    CPC分类号： G01L9/0055 ,  G01K5/52 ,  G01L1/2293 ,  H01L2224/02166 ,  Y10T29/49103

    摘要： A semiconductor pressure sensing apparatus includes a metallic stem having a diaphragm and a semiconductor sensor bonded to the diaphragm. The semiconductor sensor includes a gauge section and first and second bonding pads. The gauge section is configured to be deformed according to a deformation of the diaphragm. The first and second bonding pads are respectively connected to different positions of the gauge section so that an electrical resistance between the first and second bonding pads can change with a change in the deformation of the diaphragm. The gauge section is formed to a semiconductor layer of an silicon-on-insulator substrate. The semiconductor sensor is directly bonded to the diaphragm by activating contact surfaces between the semiconductor sensor and the diaphragm.

    摘要翻译： 一种半导体压力感测装置，包括具有隔膜的金属杆和结合到隔膜的半导体传感器。 半导体传感器包括测量部分和第一和第二接合焊盘。 仪表部分被配置为根据隔膜的变形而变形。 第一和第二接合焊盘分别连接到量规部分的不同位置，使得第一和第二接合焊盘之间的电阻随着隔膜变形的改变而改变。 测量部分形成为绝缘体上硅衬底的半导体层。 通过激活半导体传感器和隔膜之间的接触表面，半导体传感器直接接合到隔膜。