公开(公告)号：US20070252169A1

公开(公告)日：2007-11-01

申请号：US11740622

申请日：2007-04-26

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

IPC分类号： H01L29/74

CPC分类号： H05K7/02 ,  H01G2/08 ,  H01G4/224 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  Y02T10/7022 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance.The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

摘要翻译： 本发明提供一种电路装置，其中可以同时实现冷却性能的提高和由于线路电感引起的工作损耗的降低。 上述目的可以通过构造多个板状导体来实现，使得电连接到多个半导体芯片的这些导体中的每一个也热连接到每个这样的半导体芯片的两个芯片表面，以从每个半导体芯片的芯片表面释放热量， 并且使得在上述导体中，DC正极板状导体和DC负极板状导体在各导体表面处彼此相对。

公开(公告)号：US20120008280A1

公开(公告)日：2012-01-12

申请号：US13241600

申请日：2011-09-23

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

IPC分类号： H05K7/20

CPC分类号： H05K7/02 ,  H01G2/08 ,  H01G4/224 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  Y02T10/7022 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

摘要翻译： 本发明提供一种电路装置，其中可以同时实现冷却性能的提高和由于线路电感引起的工作损耗的降低。 上述目的可以通过构造多个板状导体来实现，使得电连接到多个半导体芯片的这些导体中的每一个也热连接到每个这样的半导体芯片的两个芯片表面，以从每个半导体芯片的芯片表面释放热量， 并且使得在上述导体中，DC正极板状导体和DC负极板状导体在各导体表面处彼此相对。

公开(公告)号：US08743548B2

公开(公告)日：2014-06-03

申请号：US13241600

申请日：2011-09-23

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

IPC分类号： H05K5/00 ,  H01L23/34 ,  H01L23/48

CPC分类号： H05K7/02 ,  H01G2/08 ,  H01G4/224 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  Y02T10/7022 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

摘要翻译： 本发明提供一种电路装置，其中可以同时实现冷却性能的提高和由于线路电感引起的工作损耗的降低。 上述目的可以通过构造多个板状导体来实现，使得电连接到多个半导体芯片的这些导体中的每一个也热连接到每个这样的半导体芯片的两个芯片表面，以从每个半导体芯片的芯片表面释放热量， 并且使得在上述导体中，DC正极板状导体和DC负极板状导体在各导体表面处彼此相对。

公开(公告)号：US08081472B2

公开(公告)日：2011-12-20

申请号：US12715025

申请日：2010-03-01

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Atushi Kawabata

IPC分类号： H05K5/00 ,  H01L23/34 ,  H01L23/48

CPC分类号： H05K7/02 ,  H01G2/08 ,  H01G4/224 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  Y02T10/7022 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

公开(公告)号：US20100165577A1

公开(公告)日：2010-07-01

申请号：US12715025

申请日：2010-03-01

申请人： Takeshi TOKUYAMA ,  Kinya Nakatsu ,  Atushi Kawabata

发明人： Takeshi TOKUYAMA ,  Kinya Nakatsu ,  Atushi Kawabata

IPC分类号： H05K7/20

CPC分类号： H05K7/02 ,  H01G2/08 ,  H01G4/224 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H02M7/003 ,  Y02T10/7022 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance.The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

摘要翻译： 本发明提供一种电路装置，其中可以同时实现冷却性能的提高和由于线路电感引起的工作损耗的降低。 上述目的可以通过构造多个板状导体来实现，使得电连接到多个半导体芯片的这些导体中的每一个也热连接到每个这样的半导体芯片的两个芯片表面，以从每个半导体芯片的芯片表面释放热量， 并且使得在上述导体中，DC正极板状导体和DC负极板状导体在各导体表面处彼此相对。

公开(公告)号：US09433134B2

公开(公告)日：2016-08-30

申请号：US14126955

申请日：2012-06-15

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

IPC分类号： H05K7/20 ,  H05K7/14 ,  H01L25/11 ,  H01L25/18 ,  H01L23/367 ,  H01L23/433 ,  H01L23/00 ,  H02M7/00 ,  H01L23/473

CPC分类号： H05K7/2089 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/33 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  H05K7/1432 ,  H05K7/209 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.

摘要翻译： 功率半导体模块包括具有上臂电路部分的第一封装，具有下臂电路部分的第二封装，具有存储第一封装和第二封装的存储空间的金属外壳以及与存储空间连接的开口， 以及将上臂电路部分与下臂电路部分连接的中间连接导体; 壳体包括通过存储空间面向第一辐射部分的第一辐射部分和第二辐射部分; 第一包装被布置成使得第一和第二包装件的布置方向可以平行于面向第一和第二辐射部分的相应表面; 并且中间连接导体将从第一封装延伸的发射极侧端子与从存储空间中的第二封装延伸的集电极侧端子耦合。

公开(公告)号：US20110069455A1

公开(公告)日：2011-03-24

申请号：US12886904

申请日：2010-09-21

申请人： Takeshi TOKUYAMA ,  Kinya Nakatsu ,  Ryuichi Saito

发明人： Takeshi TOKUYAMA ,  Kinya Nakatsu ,  Ryuichi Saito

IPC分类号： H05K7/20

CPC分类号： H01L25/115 ,  H01L23/473 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M7/003 ,  H02M7/81 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00

摘要： A double-face-cooled semiconductor module with an upper arm and a lower arm of an inverter circuit includes first and second heat dissipation members, each having a heat dissipation surface on one side and a conducting member formed on another side through an insulation member. On the conducting member on the first dissipation plate is provided with a fixing portion that fixes a collector surface of the semiconductor chip and a gate conductor connected to a gate terminal of the semiconductor module. The gate electrode terminal and the gate conductor are wire bonded. The conducting member on the second heat dissipation member is connected to an emitter surface of the semiconductor chip connected to the first heat dissipation member. The productivity and reliability are improved by most of formation operations for the upper and lower arms series circuit on one of the heat dissipation member.

摘要翻译： 具有逆变器电路的上臂和下臂的双面冷却半导体模块包括第一和第二散热构件，每个散热构件具有一侧的散热面和通过绝缘构件形成在另一侧的导电构件。 在第一散热板上的导电部件上设置有固定部分，该固定部分固定半导体芯片的集电极表面和连接到半导体模块的栅极端子的栅极导体。 栅电极端子和栅极导体线接合。 第二散热构件上的导电构件连接到连接到第一散热构件的半导体芯片的发射极表面。 通过在散热构件之一上的上下臂系列电路的大多数形成操作来提高生产率和可靠性。

公开(公告)号：US08723306B2

公开(公告)日：2014-05-13

申请号：US13811722

申请日：2011-07-25

申请人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

发明人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  B60L1/003 ,  B60L3/003 ,  B60L7/14 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/525 ,  H01L21/56 ,  H01L21/565 ,  H01L23/473 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/37011 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7077 ,  Y02T10/7241 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation surfaces 7b and 8b and a surface 13b of a mold material (sealing material 13) adjacent to the exposed area produce an uneven step from which either one of the exposed area and the surface 13b adjacent to the exposed area projects. The step side surface formed between the convex surface and the concave surface of the uneven step has an inclined surface 7a or 13a so configured that an obtuse angle can be formed by the inclined surface and the convex surface and by the inclined surface and the concave surface for each.

摘要翻译： 电极引线框架7和8的散热表面7b和8b通过绝缘片10与热辐射部件301热接触，以将热量从功率半导体元件5散发到散热部件（厚部分301）。 辐射表面7b和8b的每个暴露区域和与暴露区域相邻的模具材料（密封材料13）的表面13b产生不均匀的步骤，露出区域和表面13b中的任一个与暴露的 区域项目。 在凹凸台面的凸面与凹面之间形成的台阶侧表面具有倾斜面7a，13a，该倾斜面7a，13a可以由倾斜面和凸面以及倾斜面和凹面形成钝角 为每一个。

公开(公告)号：US08659130B2

公开(公告)日：2014-02-25

申请号：US13640512

申请日：2011-04-26

申请人： Yusuke Takagi ,  Kaoru Uchiyama ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Shinji Hiramitsu

发明人： Yusuke Takagi ,  Kaoru Uchiyama ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Shinji Hiramitsu

IPC分类号： H01L23/62

CPC分类号： H01L23/3675 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/34 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K7/209 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.

摘要翻译： 电源模块包括：密封体，包括具有多个电极表面的半导体元件，通过焊料连接到半导体元件的一个电极表面的第一导体板和用于密封半导体元件和第一导体板的密封材料， 所述密封体具有在所述第一表面的相对侧上的至少第一表面和第二表面; 以及用于容纳密封体的壳体。 壳体由与密封体的第一面相对的第一散热板，与密封体的第二面相对的第二散热板，以及将第一散热板和第二热连接的中间部件构成 辐射板。 中间构件具有厚度小于第一散热板的厚度的第一薄部分，比第一散热板更容易弹性变形，并且形成为围绕第一散热板。 密封体经由第一散热板通过在第一薄部分中产生的弹力被压靠并固定到第二散热板。

公开(公告)号：US08503209B2

公开(公告)日：2013-08-06

申请号：US13273162

申请日：2011-10-13

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

IPC分类号： H02M7/537 ,  H02M7/5387

CPC分类号： H05K7/20927 ,  H01L23/473 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H02M7/003 ,  H02M7/537 ,  H02M7/5387 ,  H05K7/209 ,  H01L2924/00

摘要： Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.

摘要翻译： 提供了一种功率转换装置的尺寸减小的技术，其包括与提高生产率并提高商业生产所需的可靠性相关的冷却功能和技术。 包括逆变器电路的上臂和下臂的串联电路内置在单个半导体模块500中。半导体模块在两侧具有冷却金属。 上臂半导体芯片和下臂半导体芯片楔入冷却金属之间。 半导体模块插入通道壳体主单元214内。半导体模块中设置有直流正极端子532，直流负极端子572和半导体芯片的交流端子582。 直流端子532和572与电容器模块的端子电连接。 交流端子582经由AC连接器与电动发电机电连接。