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公开(公告)号：US09575411B2
公开(公告)日：2017-02-21
申请号：US14450704
申请日：2014-08-04
CPC分类号： G03F7/30 , B05C5/02 , B05C5/0287 , B05C11/08 , B05D1/005 , B05D1/26 , G03F7/3021 , H01L21/6715
摘要： A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.
摘要翻译： 显影装置包括：水平保持基板的基板支架; 显影剂喷嘴，其将显影剂供应到所述基板上以形成液体熔池; 旋转流产生机构，其包括旋转构件，所述旋转构件在所述旋转构件与所述液体熔池接触的同时围绕垂直于所述基板的轴旋转，从而在形成在所述基板上的所述显影剂的液体池中产生转向流; 以及用于沿着基板的表面移动转向流产生机构的移动机构。 可以通过在衬底的期望区域中形成转向流并搅拌显影剂来改善图案的线宽均匀性。
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公开(公告)号：US09304398B2
公开(公告)日：2016-04-05
申请号：US14022434
申请日：2013-09-10
发明人： Yasushi Takiguchi , Taro Yamamoto , Yoshinori Ikeda , Koki Yoshimura , Yoshiki Okamoto , Masahiro Fukuda
CPC分类号： G03F7/16 , G03F7/3021 , G03F7/3092 , H01L21/67017
摘要： The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.
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公开(公告)号：US09947556B2
公开(公告)日：2018-04-17
申请号：US14321054
申请日：2014-07-01
发明人： Yasushi Takiguchi , Taro Yamamoto , Hideharu Kyouda , Koshi Muta
IPC分类号： B08B1/04 , B08B3/04 , H01L21/67 , H01L21/687
CPC分类号： H01L21/67051 , H01L21/67046 , H01L21/68792
摘要： There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.
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公开(公告)号：US09625821B2
公开(公告)日：2017-04-18
申请号：US14801096
申请日：2015-07-16
发明人： Masahiro Fukuda , Taro Yamamoto
CPC分类号： G03F7/30 , G03F7/3021
摘要： A developing apparatus includes a first cup module and a second cup module arranged to be spaced apart from each other in a transverse direction; a first developing solution nozzle configured to wait in a standby position between the first cup module and the second cup module; and a first moving mechanism configured to move the first developing solution nozzle between the standby position and a processing position in which the developing solution is supplied to the substrate, wherein the first developing solution nozzle includes an ejection hole configured to eject the developing solution to form a liquid puddle on a surface of the substrate, the first developing solution nozzle includes a contact portion formed smaller than the surface of the substrate and installed to face the surface of the substrate, and the first developing solution nozzle spreads the liquid puddle on the substrate.
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5.发明授权公开(公告)号：US09570327B2
公开(公告)日：2017-02-14
申请号：US14651816
申请日：2013-12-12
发明人： Masahiro Fukuda , Akihiro Kubo , Taro Yamamoto , Kenzi Yada , Atsushi Ookouchi
CPC分类号： H01L21/67051 , B08B5/00 , B08B5/02 , B08B5/023 , H01L21/67028 , H01L21/67034
摘要： A substrate liquid treatment apparatus comprises a chuck (13) that holds and rotates a wafer, a back surface purging nozzle (15) that discharges a purge gas toward the back surface of the wafer, and a periphery purging nozzle 16 that discharges the purge gas onto the back surface of the wafer. The back surface purging nozzle has a slit-like opening part extending from a central side to a peripheral side of the substrate in a plan view. Vertical distance between the slit-like opening part and the substrate held by the substrate holding unit increases as approaching an end of the opening part on the central side of the substrate. The periphery purging nozzle discharges the purge gas, toward a central part of the substrate, toward a region on the back surface of the substrate, which region is located radially outside an end of the slit-like opening part of the back surface purging nozzle and radially inside an peripheral edge of the substrate.
摘要翻译： 基板液体处理装置包括：保持和旋转晶片的卡盘（13），向晶片背面排出吹扫气体的后表面清洗喷嘴（15），以及将净化气体排出的周边清洗喷嘴16 到晶片的背面。 后表面清洗喷嘴在平面图中具有从基板的中心侧向周边侧延伸的狭缝状的开口部。 狭缝状开口部与被基板保持单元保持的基板之间的垂直距离随着接近基板的中心侧的开口部的端部而增大。 周边清洗喷嘴将清洗气体朝向基板的中心部朝向基板的背面的区域排出，该区域位于背面清洗喷嘴的狭缝状开口部的端部的径向外侧， 径向地位于衬底的周边边缘内。
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公开(公告)号：US11031261B2
公开(公告)日：2021-06-08
申请号：US16014308
申请日：2018-06-21
IPC分类号： H01L21/67
摘要： A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.
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公开(公告)号：US10128136B2
公开(公告)日：2018-11-13
申请号：US15671325
申请日：2017-08-08
IPC分类号： H01L21/76 , H01L21/67 , B05C5/02 , B05C11/08 , B05C11/10 , B08B3/08 , B08B3/10 , G03F7/16 , H01L21/027 , G03F7/30
摘要： There is provided a guide member 3 in which an inclined surface 32 thereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding member 2 which surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding member 2 has, at an inner surface side thereof, two groove portions 23 extended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member 2, a vortex flow is formed within the groove portions 23 and stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup body 1 can be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.
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公开(公告)号：US10120285B2
公开(公告)日：2018-11-06
申请号：US15374081
申请日：2016-12-09
发明人： Kousuke Yoshihara , Hideharu Kyouda , Koshi Muta , Taro Yamamoto , Yasushi Takiguchi , Masahiro Fukuda
摘要： A developing apparatus including a horizontal substrate holder, a rotating mechanism to rotate the substrate holder, a developer nozzle to supply a developer onto a part of the substrate to form a liquid puddle, a moving mechanism to move the developer nozzle in a radial direction of the rotating substrate, a contact part that moves with the developer nozzle and has a surface opposed to the substrate, which is smaller than the surface of the substrate, and a control unit to output a control signal such that a supply position of the developer on the substrate is moved in the radial direction of the substrate so that the liquid puddle is spread out on a whole surface of the substrate while the contact part is in contact with the liquid puddle.
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公开(公告)号：US20180047592A1
公开(公告)日：2018-02-15
申请号：US15671325
申请日：2017-08-08
CPC分类号： H01L21/6715 , B05C5/0258 , B05C11/08 , B05C11/1002 , B08B3/08 , B08B3/10 , G03F7/162 , G03F7/3021 , H01L21/0273 , H01L21/67051 , H01L21/67178
摘要： There is provided a guide member 3 in which an inclined surface 32 thereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding member 2 which surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding member 2 has, at an inner surface side thereof, two groove portions 23 extended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member 2, a vortex flow is formed within the groove portions 23 and stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup body 1 can be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.
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10.发明授权公开(公告)号：US09669510B2
公开(公告)日：2017-06-06
申请号：US14533133
申请日：2014-11-05
发明人： Akihiro Kubo , Masahiro Fukuda , Taro Yamamoto , Kenji Yada , Masashi Enomoto , Noboru Nakashima
CPC分类号： B24B37/005 , B24B25/00 , B24B27/0061 , B24B37/34 , B24B47/16 , B24D7/18 , H01L21/0209 , H01L21/30625 , H01L21/67046 , H01L21/67253
摘要： There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.
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