公开(公告)号：US20250081476A1

公开(公告)日：2025-03-06

申请号：US18459230

申请日：2023-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hidetoshi Inoue ,  Kenji Otake ,  Sombuddha Chakraborty ,  Taisuke Kazama

IPC: H10N35/00 ,  H01L23/00 ,  H01L23/495 ,  H01L25/065

Abstract: A packaged integrated circuit (IC) includes a package substrate, an electronic device on the package substrate, and metal interconnects coupled between the electronic device and the package substrate. The packaged IC also includes an insulation material on the package substrate and encapsulating the electronic device. The insulation material surrounds the metal interconnects. An inductor is over the electronic device and is coupled to the package substrate. A magnetic material is on the insulation material and encapsulates the inductor. The magnetic material is different from the insulation material.

公开(公告)号：US20250140769A1

公开(公告)日：2025-05-01

申请号：US18498092

申请日：2023-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yunyi Gong ,  Kenji Otake ,  Hidetoshi Inoue ,  Sombuddha Chakraborty ,  Jonathan Montoya ,  Osvaldo Lopez

IPC: H01L25/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373

Abstract: A packaged integrated circuit (IC) includes a package substrate and an IC on the package substrate. A first material is on the package substrate and encapsulates the IC. An inductor is coupled to the package substrate. A heat sink includes a second material. The heat sink is coupled to the IC. A third material is on the first material and encapsulates the inductor and at least part of the heat sink. The second material has a higher thermal conductivity than the first and third materials.

公开(公告)号：US11948721B2

公开(公告)日：2024-04-02

申请号：US16883614

申请日：2020-05-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ying-Chuan Kao ,  Hung-Yu Chou ,  Dong-Ren Peng ,  Jun Jie Kuo ,  Kenji Otake ,  Chih-Chien Ho

IPC: H01F27/28 ,  H01F19/08 ,  H01L23/64 ,  H01L49/02

CPC classification number: H01F27/2804 ,  H01L23/645 ,  H01L28/10 ,  H01F2019/085 ,  H01F2027/2809

Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.

公开(公告)号：US20210375540A1

公开(公告)日：2021-12-02

申请号：US17240656

申请日：2021-04-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Zhemin Zhang ,  Byron Lovell Williams ,  Dongbin Hou ,  Sombuddha Chakraborty

IPC: H01F41/04 ,  H01F17/00 ,  H01F17/04

Abstract: A laminate embedded core and coil structure comprises a magnetic core embedded in a laminate structure that includes two types of laminates. A first laminate embeds the coils of the structure and a second laminate fills space between the magnetic core and the first laminate, as well as space below the magnetic core and lower surface of the first laminate. The first and second laminates form a laminate structure that protects and improves isolation of the magnetic components. Solder resist encloses the laminate structure, magnetic core and coils. The laminate embedded core and coil structure may be assembled on a transformer leadframe of various types using non-conductive paste.

公开(公告)号：US20210375525A1

公开(公告)日：2021-12-02

申请号：US16883614

申请日：2020-05-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ying-Chuan Kao ,  Hung-Yu Chou ,  Dong-Ren Peng ,  Jun Jie Kuo ,  Kenji Otake ,  Chih-Chien Ho

IPC: H01F27/28 ,  H01L23/64 ,  H01L49/02

Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.

公开(公告)号：US20210343662A1

公开(公告)日：2021-11-04

申请号：US17138150

申请日：2020-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, JR. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

公开(公告)号：US20240170207A1

公开(公告)日：2024-05-23

申请号：US18427734

申请日：2024-01-30

Applicant: Texas Instruments Incorporated

Inventor： Yi Yan ,  Zhemin Zhang ,  Yuki Sato ,  Kenji Otake ,  Vijaylaxmi Khanolkar

IPC: H01F41/04 ,  H01F27/28

CPC classification number: H01F41/041 ,  H01F27/2804

Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

公开(公告)号：US11887776B2

公开(公告)日：2024-01-30

申请号：US16904875

申请日：2020-06-18

Applicant: Texas Instruments Incorporated

Inventor： Yi Yan ,  Zhemin Zhang ,  Yuki Sato ,  Kenji Otake ,  Vijaylaxmi Khanolkar

IPC: H01F41/04 ,  H01F27/28

CPC classification number: H01F41/041 ,  H01F27/2804

Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

公开(公告)号：US20210398736A1

公开(公告)日：2021-12-23

申请号：US16904875

申请日：2020-06-18

Applicant: Texas Instruments Incorporated

Inventor： Yi Yan ,  Zhemin Zhang ,  Yuki Sato ,  Kenji Otake ,  Vijaylaxmi Khanolkar

IPC: H01F27/26 ,  H01F27/28

Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

公开(公告)号：US20250138054A1

公开(公告)日：2025-05-01

申请号：US18499086

申请日：2023-10-31

Applicant: Texas Instruments Incorporated

Inventor： Yi Yan ,  Dok Won Lee ,  Hank Ming Sung ,  Kenji Otake

IPC: G01R15/20 ,  G01R19/00 ,  H10N52/01 ,  H10N52/80

Abstract: A described example includes: a heat slug coupled to a package substrate, the heat slug configured to conduct a current between terminals of the package substrate; a first magnetic shield mounted to a top surface of the package substrate, the first magnetic shield including a die mount area; a semiconductor die flip chip mounted to the die mount area; a second magnetic shield mounted to the package substrate, the second magnetic shield having a cantilever portion extending over a portion of the semiconductor die including a Hall element; electrical connections of wire bonds or ribbon bonds between bond pads of the semiconductor die and leads on the package substrate; and mold compound covering the electrical connections, the semiconductor die, the first magnetic shield, and the second magnetic shield, while a portion of the heat slug is exposed forming a thermal pad for a semiconductor device package.