公开(公告)号：US20250140769A1

公开(公告)日：2025-05-01

申请号：US18498092

申请日：2023-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yunyi Gong ,  Kenji Otake ,  Hidetoshi Inoue ,  Sombuddha Chakraborty ,  Jonathan Montoya ,  Osvaldo Lopez

IPC: H01L25/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373

Abstract: A packaged integrated circuit (IC) includes a package substrate and an IC on the package substrate. A first material is on the package substrate and encapsulates the IC. An inductor is coupled to the package substrate. A heat sink includes a second material. The heat sink is coupled to the IC. A third material is on the first material and encapsulates the inductor and at least part of the heat sink. The second material has a higher thermal conductivity than the first and third materials.