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公开(公告)号：US20240021546A1
公开(公告)日：2024-01-18
申请号：US18363536
申请日：2023-08-01
IPC分类号： H01L23/64 , H01L23/495
CPC分类号： H01L23/642 , H01L23/49575 , H01L23/4952 , H01L23/49503
摘要： Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.
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公开(公告)号：US11715707B2
公开(公告)日：2023-08-01
申请号：US16730856
申请日：2019-12-30
IPC分类号： H01L23/64 , H01L23/495
CPC分类号： H01L23/642 , H01L23/4952 , H01L23/49503 , H01L23/49575
摘要： Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.
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公开(公告)号：US11688672B2
公开(公告)日：2023-06-27
申请号：US17527994
申请日：2021-11-16
IPC分类号： H01L23/49 , H01L23/495 , H01L23/00 , H01L21/56 , H01L23/492
CPC分类号： H01L23/49589 , H01L21/565 , H01L23/492 , H01L23/49541 , H01L23/49575 , H01L24/46 , H01L24/85
摘要： An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.
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公开(公告)号：US20230022572A1
公开(公告)日：2023-01-26
申请号：US17954122
申请日：2022-09-27
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.
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公开(公告)号：US11482477B2
公开(公告)日：2022-10-25
申请号：US16236730
申请日：2018-12-31
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.
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公开(公告)号：US20170194088A1
公开(公告)日：2017-07-06
申请号：US14984631
申请日：2015-12-30
IPC分类号： H01F27/28
CPC分类号： H01F27/2804 , H01F27/365 , H01F2027/2809 , H01F2027/2819
摘要： A transformer for module integration includes a first layer of magnetic material having an outer edge, a second layer of magnetic material having an outer edge, and an isolation layer positioned between the first layer of magnetic material and the second layer of magnetic material along a primary axis. The transformer includes a first inductive element positioned in the first layer of magnetic material and a second inductive element disposed opposite of the first inductive element and in the second layer of magnetic material.
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7.发明申请公开(公告)号：US20170178787A1
公开(公告)日：2017-06-22
申请号：US14974901
申请日：2015-12-18
CPC分类号： H01F27/2804 , B22F3/10 , B22F5/12 , B22F7/06 , B22F2999/00 , C22C2202/02 , H01F27/24 , H01F27/288 , H01F41/0206 , H01F41/04 , H01F41/046 , H01F2027/2809 , H01F2027/2819 , H01L2224/48137 , H01L2224/48247 , H01L2924/181 , B22F1/0059 , H01L2924/00012
摘要： Methods and apparatus for isolation barrier with magnetics. In an example arrangement, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also disclosed.
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公开(公告)号：US20220077038A1
公开(公告)日：2022-03-10
申请号：US17527994
申请日：2021-11-16
IPC分类号： H01L23/495 , H01L21/56 , H01L23/492 , H01L23/00
摘要： An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.
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9.发明授权公开(公告)号：US11094449B2
公开(公告)日：2021-08-17
申请号：US16700739
申请日：2019-12-02
摘要： For isolation barrier with magnetics, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also described.
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公开(公告)号：US20200211939A1
公开(公告)日：2020-07-02
申请号：US16236730
申请日：2018-12-31
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.
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