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公开(公告)号：US20160069662A1
公开(公告)日：2016-03-10
申请号：US14801810
申请日：2015-07-16
发明人： Joyce Mullenix , George Reitsma
CPC分类号： G01D5/22 , G01D5/202 , G01D5/2225
摘要： A position detecting system detects and responds to the movement of a target through a sensing domain area of a plane. The movement causes the amount of the target that lies within a first sensing domain area of a first sensor to change. A second sensor detects a height from the plane to a sensor for enhancing accuracy of measurements from the first sensor.
摘要翻译： 位置检测系统通过平面的感测域区域来检测和响应目标的移动。 移动导致位于第一传感器的第一感测区域内的目标的量改变。 第二传感器检测从平面到传感器的高度，以增强来自第一传感器的测量精度。
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公开(公告)号：US20230022572A1
公开(公告)日：2023-01-26
申请号：US17954122
申请日：2022-09-27
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.
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公开(公告)号：US11482477B2
公开(公告)日：2022-10-25
申请号：US16236730
申请日：2018-12-31
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.
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公开(公告)号：US09759580B2
公开(公告)日：2017-09-12
申请号：US14837141
申请日：2015-08-27
发明人： Joyce Mullenix
IPC分类号： G01D5/20
CPC分类号： G01D5/2006 , G01D5/202
摘要： A position sensor includes a target having an electrical conductor having an exterior boundary, a void located at least partially within the conductor, and an opening extending between the exterior boundary of the conductor and the void, wherein the opening interrupts a current path in the conductor around the void.
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公开(公告)号：US20170194088A1
公开(公告)日：2017-07-06
申请号：US14984631
申请日：2015-12-30
IPC分类号： H01F27/28
CPC分类号： H01F27/2804 , H01F27/365 , H01F2027/2809 , H01F2027/2819
摘要： A transformer for module integration includes a first layer of magnetic material having an outer edge, a second layer of magnetic material having an outer edge, and an isolation layer positioned between the first layer of magnetic material and the second layer of magnetic material along a primary axis. The transformer includes a first inductive element positioned in the first layer of magnetic material and a second inductive element disposed opposite of the first inductive element and in the second layer of magnetic material.
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6.发明申请公开(公告)号：US20170178787A1
公开(公告)日：2017-06-22
申请号：US14974901
申请日：2015-12-18
CPC分类号： H01F27/2804 , B22F3/10 , B22F5/12 , B22F7/06 , B22F2999/00 , C22C2202/02 , H01F27/24 , H01F27/288 , H01F41/0206 , H01F41/04 , H01F41/046 , H01F2027/2809 , H01F2027/2819 , H01L2224/48137 , H01L2224/48247 , H01L2924/181 , B22F1/0059 , H01L2924/00012
摘要： Methods and apparatus for isolation barrier with magnetics. In an example arrangement, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also disclosed.
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公开(公告)号：US11226211B2
公开(公告)日：2022-01-18
申请号：US14801810
申请日：2015-07-16
发明人： Joyce Mullenix , George Reitsma
摘要： A position detecting system detects and responds to the movement of a target through a sensing domain area of a plane. The movement causes the amount of the target that lies within a first sensing domain area of a first sensor to change. A second sensor detects a height from the plane to a sensor for enhancing accuracy of measurements from the first sensor.
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8.发明授权公开(公告)号：US11094449B2
公开(公告)日：2021-08-17
申请号：US16700739
申请日：2019-12-02
摘要： For isolation barrier with magnetics, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also described.
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公开(公告)号：US20200211939A1
公开(公告)日：2020-07-02
申请号：US16236730
申请日：2018-12-31
IPC分类号： H01L23/495 , H01L23/31 , H01L23/00
摘要： A packaged electronic device includes a die pad directly connected to a first set of conductive leads of a leadframe structure, a semiconductor die attached to the conductive die pad, a conductive support structure directly connected to a second set of conductive leads, and spaced apart from all other conductive structures of the leadframe structure. A magnetic assembly is attached to the conductive support structure, and a molded package structure that encloses the conductive die pad, the conductive support structure, the semiconductor die, the magnetic assembly and portions of the conductive leads, the molded package structure including a top side, and an opposite bottom side, wherein the lamination structure is centered between the top and bottom sides.
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公开(公告)号：US20170059364A1
公开(公告)日：2017-03-02
申请号：US14837141
申请日：2015-08-27
发明人： Joyce Mullenix
IPC分类号： G01D5/20
CPC分类号： G01D5/2006 , G01D5/202
摘要： A position sensor includes a target having an electrical conductor having an exterior boundary, a void located at least partially within the conductor, and an opening extending between the exterior boundary of the conductor and the void, wherein the opening interrupts a current path in the conductor around the void.
摘要翻译： 位置传感器包括具有外部边界的电导体的目标，至少部分地位于导体内的空隙以及在导体的外部边界与空隙之间延伸的开口，其中开口中断导体中的电流路径 围绕着空洞。
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