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公开(公告)号：US20240021546A1
公开(公告)日：2024-01-18
申请号：US18363536
申请日：2023-08-01
IPC分类号： H01L23/64 , H01L23/495
CPC分类号： H01L23/642 , H01L23/49575 , H01L23/4952 , H01L23/49503
摘要： Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.
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公开(公告)号：US11038461B2
公开(公告)日：2021-06-15
申请号：US16998526
申请日：2020-08-20
摘要： A digital isolator comprising a set of bipolar transistors and an inductor capacitor (LC) oscillator coupled to the set of bipolar transistors in series, wherein the LC oscillator is configured to be turned on and off based on the current applied to the set of bipolar transistors or the LC oscillator and generate a set of differential signals based on the current flowing through the set of bipolar transistors and mimicking the operational characteristics of an optocoupler.
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公开(公告)号：US20220077038A1
公开(公告)日：2022-03-10
申请号：US17527994
申请日：2021-11-16
IPC分类号： H01L23/495 , H01L21/56 , H01L23/492 , H01L23/00
摘要： An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.
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公开(公告)号：US11119971B1
公开(公告)日：2021-09-14
申请号：US17071902
申请日：2020-10-15
摘要： Disclosed embodiments include a serial buffer device comprising first and second serial input/output (I/O) ports, first and second comparators, and a multiplexer having a first input coupled to the output of the first comparator and a second input coupled to the output of the second comparator. There is also a transistor, a third comparator having first and second inputs and an output, wherein the first input is coupled to the second serial I/O port, the second input is coupled to a third reference voltage source, and the output is coupled to the control terminal of the multiplexer. Additionally, the embodiment includes an impedance controlled driver circuit having an input and an output, wherein the input is coupled to the output of the third comparator and the output is coupled to the first serial I/O port.
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公开(公告)号：US20240291696A1
公开(公告)日：2024-08-29
申请号：US18204260
申请日：2023-05-31
IPC分类号： H04L25/02 , H03K5/19 , H03K19/173 , H04B1/04 , H04B1/16
CPC分类号： H04L25/0266 , H03K5/19 , H03K19/173 , H04B1/04 , H04B1/16
摘要： An example apparatus includes: transmitter channel circuitry including: a buffer having an output; and a capacitor having a first terminal and a second terminal, the first terminal of the capacitor coupled to the output of the buffer; an isolation transformer including: a first inductor having a terminal coupled to the second terminal of the capacitor; and a second inductor magnetically coupled to the first inductor across an isolation barrier, and receiver channel circuitry coupled to the second inductor.
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公开(公告)号：US20210202405A1
公开(公告)日：2021-07-01
申请号：US16730856
申请日：2019-12-30
IPC分类号： H01L23/64 , H01L23/495
摘要： Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.
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公开(公告)号：US10790782B2
公开(公告)日：2020-09-29
申请号：US16223545
申请日：2018-12-18
摘要： A digital isolator comprising a set of bipolar transistors and an inductor capacitor (LC) oscillator coupled to the set of bipolar transistors in series, wherein the LC oscillator is configured to be turned on and off based on the current applied to the set of bipolar transistors or the LC oscillator and generate a set of differential signals based on the current flowing through the set of bipolar transistors and mimicking the operational characteristics of an optocoupler.
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公开(公告)号：US20240235504A9
公开(公告)日：2024-07-11
申请号：US17972518
申请日：2022-10-24
发明人： Harsh Sheokand , Tarunvir Singh , Anant Kamath , Suvadip Banerjee
IPC分类号： H03F3/45
CPC分类号： H03F3/45654 , H03F3/45183 , H03F2203/45526
摘要： A system includes an operational amplifier which includes a first amplifier input, a second amplifier input and an amplifier output. The system includes a first switch which includes a first terminal and includes a second terminal coupled to the first amplifier input. The system includes a second switch which includes a first terminal coupled to the first amplifier input and a second terminal coupled to the second amplifier input. The system includes a first bias current source coupled between the first amplifier input and a common potential and includes a second bias current source coupled between the first terminal of the first switch and the common potential. The system includes a feedback path between the amplifier output and the first amplifier input.
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公开(公告)号：US20220077788A1
公开(公告)日：2022-03-10
申请号：US17236931
申请日：2021-04-21
摘要： DC-DC power converter architecture is disclosed. In an example, an integrated circuit includes an H-bridge switching circuit operatively coupled with a transformer. The switching circuit is compensated to account for parasitic differences between the high-side (power) and low-side (ground). For instance, PMOS transistors connected to the high-side are sized larger to substantially match on-resistance of NMOS transistors connected to the low-side (e.g., such that the on-resistances are all within a tolerance of one another, or within a tolerance of a target on-resistance value), and the NMOS transistors include additional gate-drain capacitance to substantially match gate-drain capacitance of the larger PMOS transistors (e.g., such that the gate-drain capacitances are all within a tolerance of one another, or within a tolerance of a target gate-drain capacitance value). In addition, the transformer is configured with physical symmetry, such that the inductive and capacitive mid-points of the transformer are substantially co-located.
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公开(公告)号：US11205611B1
公开(公告)日：2021-12-21
申请号：US16901310
申请日：2020-06-15
IPC分类号： H01L23/49 , H01L23/495 , H01L23/00 , H01L21/56 , H01L23/492
摘要： An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.
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